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Method for representing bonding strength of hard film through interfacial stress of elasticoplastic deformation

A technology of elastic-plastic deformation and bonding strength, which is applied in special data processing applications, measuring devices, instruments, etc., to achieve the effect of flexible test conditions and flexible and simple test methods

Active Publication Date: 2015-04-08
宁波云涂科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Through the search of the existing technical literature, it is found that the method for quantitatively characterizing the bonding strength of the film / substrate interface based on the elastic-plastic deformation of the film-based system under cyclic loads has not been reported so far, and there is no universally applicable method that can be promoted. use

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  • Method for representing bonding strength of hard film through interfacial stress of elasticoplastic deformation
  • Method for representing bonding strength of hard film through interfacial stress of elasticoplastic deformation
  • Method for representing bonding strength of hard film through interfacial stress of elasticoplastic deformation

Examples

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Embodiment 1

[0031] A kind of method characterizing the bonding strength of hard thin film with the interfacial stress of elastoplastic deformation, comprises the steps:

[0032] In the first step, the sample is tested using a cyclic press-in tester

[0033] (1) A sample of MoN film deposited with a thickness of 5.6 μm and a substrate material of GCr15 steel was used for testing. Using a cyclic indentation tester, a diamond spherical indenter with a radius of curvature of 200 μm was used to perform an indentation test on the surface of the sample film under cyclic loading at a fixed peak value and minimum value. The sample film matrix system undergoes elastic-plastic deformation under external loads. The upper limit of the load peak selection in the cyclic indentation test should be less than 90% of the load value when one-time indentation causes peeling off. The minimum load should not be greater than 90% of the peak load. In this embodiment, the peeling load of the film once loaded is ...

Embodiment 2

[0051] The sample was changed to a 2.3 μm CrN thin film, and the operation steps were the same as in Example 1.

[0052] The first step is to use a cyclic indentation testing machine to test the sample with a diamond spherical indenter with a radius of curvature of 200 μm

[0053] (1) Use a cyclic indentation tester to perform an indentation test on the surface of the sample film under cyclic loading with a fixed 60N load peak value. The minimum load values ​​are respectively 15N, 20N, 30N and 40N (the ratio of the minimum load value to the maximum value is 25% respectively. , 33%, 50%, 66%).

[0054] (2) Under the above-mentioned four load ratios, the sample is subjected to a cyclic indentation test and finally the peeling of the film is caused. The observation record shows that the number of cycles that the film peels off under the action of the 25% load ratio is 9.0×10 2 Times; 1.5×10 at 33% 3 times; 1.8×10 at 50% 4 Times; 5.0×10 at 66% 5 Second-rate.

[0055] The seco...

Embodiment 3

[0061] Sample and operating steps are the same as in Example 1.

[0062] The first step is to use a cyclic press-in test machine, and the indenter is Si with a curvature radius of 400 μm 3 N 4 Ceramic spherical indenter, with fixed load peak value and minimum value, carries out indentation test on sample film surface with cyclic loading.

[0063] (1) The peak loads used in this embodiment are 150N and 200N respectively, and the minimum load is selected as 30% of the peak load.

[0064] (2) Under the above two loads, the sample is subjected to a cyclic indentation test and finally causes the peeling of the film. The observation records show that the number of cycles that the film peels off under the peak load of 200N is 1.3×10 5 times; greater than 1.0×10 under 150N 6 Second-rate.

[0065] In the second step, the finite element model is established with embodiment 1, and this embodiment defines Si 3 N 4 The ceramic indenter is elastic: the elastic modulus is 210GPa, and t...

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Abstract

The invention discloses a method for representing the bonding strength of a hard film through interfacial stress of elasticoplastic deformation. The method comprises the following steps: performing circulation pressing testing on a sample of which a metal or hard alloy substrate surface is deposited with the hard film by using a circulation pressing experiment machine, so as to cause elasticoplastic deformation of a film substrate system, and finally strip off the film from the substrate because of interface fatigue; performing finite element modeling analysis according to relevant material property and practical testing conditions, acquiring the shearing stress amplitude acting at the film base interface when the film is stripped off under different circulation loads according to the solving result, and finally quantitatively representing the bonding strength of the film / substrate interface according to shearing stress amplitude-stripping week curved. The method for representing the bonding strength of a film / substrate interface is relatively reasonable and feasible, relatively accurate and quantitative in representation, relatively practical and reliable in result, and applicable to representation and evaluation on the bonding strength of hard films on metal or hard alloy surfaces which are widely used in the conventional industrial fields.

Description

technical field [0001] The invention relates to a method for detecting the properties of a hard film on the surface of a metal or hard alloy substrate. Background technique [0002] As an important performance index to evaluate the quality of the film, the bonding strength between the film and the substrate is a necessary condition for process optimization. As an important field of surface engineering research, the evaluation and characterization of bonding strength has received extensive attention. How to effectively evaluate and characterize the bonding strength of the film base has extremely important guiding significance for further improving the performance and service life of tools and molds. [0003] At present, there are dozens of measurement and evaluation methods for the bonding strength of thin films, mainly including scratch method, indentation method, stretching method, bending method, etc. The influence of interface factors can only be used to qualitatively o...

Claims

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Application Information

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IPC IPC(8): G01N19/04G06F19/00
Inventor 朱晓东邱龙时鲁莎李雁淮徐可为
Owner 宁波云涂科技有限公司
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