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A Folded Beam High Sensitivity Micromachined Accelerometer

A high-sensitivity, accelerometer technology, applied in the direction of velocity/acceleration/shock measurement, measurement of acceleration, measurement device, etc., can solve problems such as affecting detection accuracy, achieve the effect of simple structure, low cost, and reduce temperature drift

Active Publication Date: 2017-05-24
NAT UNIV OF DEFENSE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after the stiffness of the support beam is reduced, the influence of temperature drift is more obvious, thus affecting the accuracy of detection

Method used

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  • A Folded Beam High Sensitivity Micromachined Accelerometer
  • A Folded Beam High Sensitivity Micromachined Accelerometer
  • A Folded Beam High Sensitivity Micromachined Accelerometer

Examples

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Embodiment Construction

[0022] Figure 1 to Figure 5 It shows an embodiment of a folded-beam type high-sensitivity micromachined accelerometer of the present invention, which comprises an upper cover 1, a sensitive silicon structure 2 and a lower cover 3, the upper cover 1 is provided with an upper fixed capacitor plate 10, and the lower cover 1 The cover 3 is provided with a lower fixed capacitor plate 30, and the sensitive silicon structure 2 is arranged between the upper fixed capacitor plate 10 and the lower fixed capacitor plate 30. The sensitive silicon structure 2 includes a fixed frame 21, a sensitive mass 22 and a folded beam 23. Each side of the frame 21 is provided with a stress relief groove 24, and the fixed frame 21 forms a matching beam 25 between the stress relief groove 24 and the inner side of the fixed frame 21, and the sensitive mass 22 is arranged in the middle of the fixed frame 21 and is connected by a folding beam 23 On the matching beam 25, the upper fixed capacitance plate 1...

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Abstract

A folded-beam-type high-sensitivity micro-mechanical accelerometer comprises an upper cover, a sensitive silicon structure and a lower cover. The upper cover is provided with an upper fixing capacitance plate, the lower cover is provided with a lower fixing capacitance plate, the sensitive silicon structure comprises a fixing frame, a sensitive mass block and folded beams, a stress release groove is formed in each lateral side of the fixing frame, the fixing frame forms matching beams between the stress release grooves and the inner side of the fixing frame, the sensitive mass block is arranged in the middle of the fixing frame and connected onto the matching beams through the folded beams, the upper fixing capacitance plate comprises an upper detection electrode and upper matching electrodes, the upper matching electrodes are arranged around the upper detection electrode, the lower fixing capacitance plate comprises a lower detection electrode and lower matching electrodes, the lower matching electrodes are arranged around the lower detection electrode, the sensitive mass block is positioned between the upper detection electrode and the lower detection electrode, and the matching beams are positioned between the upper matching electrodes and the lower matching electrodes. The folded-beam-type high-sensitivity micro-mechanical accelerometer has the advantages of simple structure, convenience in manufacturing, low cost and small temperature drift.

Description

technical field [0001] The invention relates to the field of micro-mechanical sensors, in particular to a folded-beam type high-sensitivity micro-mechanical accelerometer. Background technique [0002] Compared with traditional accelerometers, micro-machined accelerometers based on MEMS technology have outstanding advantages such as small size, light weight, low cost, and high reliability, so they are widely used in automobile motion state control systems, camera stabilization systems, and sports machinery control In fields such as high-sensitivity accelerometers, as an indispensable part of a precise control system, its role is becoming more and more significant. [0003] At present, there are mainly the following ways to improve the sensitivity of the accelerometer, which are to reduce the electrode gap, reduce the stiffness of the support beam, and increase the mass of the movable mass, among which reducing the electrode gap will easily lead to an increase in the relative...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01P15/00G01P15/125
Inventor 肖定邦吴芳侯占强吴学忠李青松陈志华王兴华张旭李文印吴宇列
Owner NAT UNIV OF DEFENSE TECH
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