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A camera module device without a circuit board and its assembly method

A technology of camera module and assembly method, which is applied to the parts of color TV, parts of TV system, electrical components, etc., can solve the problems of production cost not meeting expectations, low temperature resistance, high rate of defective products, etc., and achieve Realize the effects of interface standardization, high yield and easy processing

Inactive Publication Date: 2018-08-07
GUANGZHOU DALING INDAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage is that the SMD camera module is easy to burst when it is mounted by a SMT machine. The reason is that the material of the lens holder has low temperature resistance, the rate of defective products is high, and the production cost has not reached expectations.

Method used

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  • A camera module device without a circuit board and its assembly method
  • A camera module device without a circuit board and its assembly method
  • A camera module device without a circuit board and its assembly method

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Embodiment Construction

[0025] Below in conjunction with accompanying drawing, invention is described in further detail.

[0026] Such as Figure 3-4 As shown, a camera module device without a circuit board includes a chip assembly 01 and a lens assembly 02. The chip assembly 01 includes a photosensitive chip 11 and a chip base 12 ; the lens assembly 02 includes a lens 21 , a flexible gasket 23 and a lens holder 22 . The chip base 12 and the photosensitive chip 11 are bonded by glue curing. The lens 21 is connected to the lens holder 22 through threads, and the flexible gasket 23 is embedded in the lens holder 22 . The chip base 12 has several metal pins. The lens holder 22 has four female snaps, and the chip base 12 has four male snaps. The chip assembly 01 and the lens assembly 02 are connected through the four male snaps of the chip base 12 and the four female snaps of the lens holder 22 . The chip base 12 is welded and attached to the main board of the digital product through metal pins.

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PUM

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Abstract

The invention discloses a circuit-board-free camera module device applicable to portable digital equipment such as mobile phones, palm computers and notebook computers, wherein the camera module device comprises a chip assembly and a lens assembly, wherein the chip assembly comprises a light sensing chip and a chip base, and the lens assembly comprises a lens, a flexible gasket and a lens support frame. The camera module device has the advantages that the structure is simple, the cost is low, the assembly is easy, the energy is saved, and the emission is reduced.

Description

technical field [0001] The present invention relates to an image collector device, more specifically, relates to a camera module device without a circuit board and an assembly method thereof suitable for portable digital devices such as mobile phones, palmtop computers, and notebooks. Background technique [0002] A traditional camera module consists of a lens assembly (lens), a base (holder), an image sensor (CCD or CMOS) and a circuit board. The lens assembly corresponds to the photosensitive area of ​​the image sensor through the base and is assembled on the circuit board together. superior( figure 1 ); the image sensor is electrically connected to the internal circuit on the circuit board, and the image sensor and the circuit board convert the collected optical signal into a digital image signal, and then connect to the peripheral device (such as the main body of the mobile phone) through the connector on the circuit board. [0003] Due to the low integration level of t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/225
Inventor 凌代年
Owner GUANGZHOU DALING INDAL