Silicon-piezoresistive temperature compensation assessment method

Abstract

The invention relates to a temperature compensation assessment method based on the silicon-piezoresistant principle, and belongs to the technology of silicon-piezoresistant temperature compensation. Resistance values of four force-sensitive resistors, which form a Wheatstone bridge of a silicon piezoresistant chip, in different temperatures and pressures are used as input values, different compensation circuit structures, compensation devices and compensation device parameters are used as variables, a mathematical model is established, the different compensation circuit structures are analyzed and automatically calculated to obtain compensation results related to the variables, and theoretical compensation results in the temperatures and pressures are used to roughly estimate whether an intermediate compensation variable is proper and estimate the selection range of the intermediate compensation variable. The mathematical model which can automatically process data in a batch manner is established on the theoretical analysis basis, and assessment for a certain temperature compensation algorithm can be rapidly and accurately obtained via the mathematic module before a product is realized, and the method is highly in practical values.

Description

technical field [0001] The invention belongs to silicon piezoresistive temperature compensation technology, and relates to a temperature compensation evaluation method based on the silicon piezoresistive principle. Background technique [0002] Since the silicon piezoresistive sensor is made of semiconductor silicon, it is greatly affected by temperature. When the ambient temperature changes drastically, temperature is the biggest obstacle affecting the pressure measurement accuracy. In order to improve the pressure measurement accuracy of the sensor, in addition to maintaining the consistency of the process when making the silicon piezoresistive chip, it is also necessary to perform a temperature compensation to eliminate the difference in chip performance. [0003] Since the sensor is used in different occasions, its requirements are also very different. In actual temperature compensation, the change of a certain parameter will have an inestimable impact on the compensatio...

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Problems solved by technology

[0003] Since the sensor is used in different occasions, its requirements are also very different. In the actual temperature compensation, the change of a certain parameter will have an inestimable impact on the compensation result, so it is difficult to quickly and accurately determine the compensation parameters.

[0004] In general, the temperature compensation of the existing silicon piezoresistor needs to assemble the corresponding circuit for test verification and analysis, which will waste a lot of manpower, material resources, financial resources and time investment

At the same time, this method can only be limited to small-scale research and trial production, and cannot realize automatic and mass production

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