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Method for printing carbon film plate carbon key

A carbon membrane plate and carbon bond technology, which is applied in chemical/electrolytic methods to remove conductive materials and form conductive patterns, can solve problems such as easy errors and affect production quality, improve production quality and efficiency, and optimize processes. Effect

Active Publication Date: 2015-04-22
福州瑞华印制线路板有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the carbon bond of the light board needs to be accurately placed on the top of each printed copper, it needs accurate positioning. Errors are prone to occur during the positioning process, which affects the production quality.

Method used

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  • Method for printing carbon film plate carbon key
  • Method for printing carbon film plate carbon key
  • Method for printing carbon film plate carbon key

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] Such as figure 2 with image 3 As shown, a method of carbon bond printing on a carbon film plate ensures product quality, thereby improving production efficiency.

[0019] The present invention is realized as follows: A method for printing carbon bonds on a carbon film plate requires a light plate, such as image 3 As shown in the middle state (a), the light board includes an upper copper layer 2 and a lower substrate 1, and the method includes the following steps:

[0020] Step 10. Print carbon bond 3 on the copper layer 2 of the light board, and cure it. The carbon bond 3 is cured by heat curing, such as image 3 As shown in the middle state (b);

[0021] Step 20: Print the circuit, only perform circuit printing with resist ink on the area without carbon bond, and then perform exposure and development;

[0022] Step 30. Acid etching: etch the metal without carbon bond coverage and the metal without ink protection on the light board to obtain the upper carbon bond and lower...

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PUM

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Abstract

The invention provides a method for printing a carbon film plate carbon key. A light plate is needed to be provided. The light plate comprises a copper layer on the upper layer and base materials on the lower layer. The method for printing the carbon film plate carbon key comprises the following steps of the step 10 that the carbon key is printed on the light plate and solidified; the step 20 that a circuit is printed; the step 30 that acid etching is performed by etching metal covered by free of the carbon key and metal protected by free of printing ink on the light plate; the step 40 that a character is solder resisted; the step 50 that forming is performed, and factory quality guarantee detection and leaving factory packaging are performed on a carbon film plate finally. Through the method of printing the carbon key firstly and printing the circuit secondly, the method for printing the carbon film plate carbon key avoids a misplacing phenomenon occurring in the positioning process, guarantees the accurate position of every carbon key, and improves the production quality and efficiency greatly.

Description

Technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a method for printing carbon bonds of carbon film plates. Background technique [0002] Carbon film boards are widely used in electronic products with buttons, such as game consoles, computer keyboards, remote controls and other electronic products. In the existing carbon film board carbon key printing process, the printed carbon keys are placed after the circuit printing. Such as figure 1 As shown, the specific steps are: step 1, circuit printing of the light board; step 2, acid etching; step 3, printing carbon bonds and thermal curing; step 4, solder mask characters; step 5, forming, after forming the finished product factory inspection And packaging. Because the carbon bond of the light board needs to accurately fall on top of each printed copper, it needs to be accurately positioned. Errors are prone to occur during the positioning process, which affects the production ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/12H05K3/06
Inventor 陈跃生林书芳
Owner 福州瑞华印制线路板有限公司
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