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Method of manufacturing package component for light emitting diode and package structure thereof

A technology for light-emitting diodes and packaging components, which is applied in the field of manufacturing methods and packaging structures, can solve problems such as the inability to achieve consistent quality of LED packaging structures, and achieve the effects of improving the uniformity of LED light color, improving specifications, and uniform light color

Inactive Publication Date: 2015-04-29
GENESIS PHOTONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the above-mentioned problems in the prior art, the object of the present invention is to provide a manufacturing method and a packaging structure of a light-emitting diode packaging component to solve the problem that the known LED packaging process cannot achieve the same quality of the LED packaging structure, and to improve the light color of the LED. Uniformity

Method used

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  • Method of manufacturing package component for light emitting diode and package structure thereof
  • Method of manufacturing package component for light emitting diode and package structure thereof
  • Method of manufacturing package component for light emitting diode and package structure thereof

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Embodiment Construction

[0019] see figure 1 , which is a flow chart of the first preferred embodiment of the manufacturing method of the light emitting diode packaging component of the present invention. Such as figure 1 As shown, in the first preferred embodiment of the manufacturing method of LED packaging components of the present invention, the manufacturing method of LED packaging components at least includes steps S10, S20, S30, S40 and S50. In step S10, at least one light-emitting diode disposed on the substrate is put into photocurable resin, and the substrate and photocurable resin completely cover the light-emitting diode; in step S20, power is provided to the light-emitting diode to make the light-emitting diode emit more light A light ray, so that part of the light-curable resin is cured by the irradiation of light to form a male mold; in step S30, a separation procedure is performed to separate the male mold from another part of the light-curable resin, the light-emitting diode and the ...

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Abstract

A method of manufacturing package component for light emitting diode (LED) is disclosed. At least one LED is disposed on a substrate inside a photocuring resin, wherein the LED is covered completely by the substrate and the photocuring resin. Power is provided to the LED to make the LED emit plural light beams such that a portion of the photocuring resin is cured by the light beams to obtain a male mold. A separation process is performed to separate the male mold and the other portion of the photocuring resin, the LED and the substrate. A rollover process is performed to manufacture the female mold by the male mold, wherein the female mold has at least one accommodation space with a shape identical to that of the male mold. A forming process is performed to form a package component with a shape identical to that of the male mold.

Description

technical field [0001] The invention relates to a manufacturing method and a packaging structure, in particular to a manufacturing method and a packaging structure of a light emitting diode packaging component. Background technique [0002] Facing the era of global energy shortages, high oil prices and high electricity bills, and in response to the government's energy conservation and carbon reduction policies, power-saving lighting technology has become the mainstream of development, and a large number of technology developers have begun to develop alternatives to known lighting technologies. Light-emitting source, and an alternative product with low energy consumption. Among them, the light emitting diode (Light emitting diode, LED) lighting technology has become the most promising development product in the alternative light source. [0003] LED has the advantages of small size, long life, and low power consumption, so it is widely used in 3C product indicators and displ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/52
CPCH01L33/0095H01L33/505H01L33/54H01L2933/005H01L2933/0041H01L2933/0058H10K50/854H01L33/52H01L33/005H01L33/48H01L33/483H01L33/50H01L33/501H01L33/56H01L31/0203F21K9/90H10K50/84H10K50/841H10K50/844
Inventor 陈正言勤竣杰李允立
Owner GENESIS PHOTONICS INC