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A corrosion-resistant heat-resistant physical and chemical board

A physical and chemical board, corrosion-resistant technology, applied in the field of physical and chemical boards, can solve the problems of corrosion resistance, heat resistance and service life of physical and chemical boards that cannot meet market demand, long curing time, and high curing temperature, and achieves heat resistance and chemical corrosion resistance. Excellent performance, overcoming the effect of high curing temperature and high bond strength

Active Publication Date: 2017-11-17
ANHUI XIMA OUMEIJIA DECORATIVE MATERIAL IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the gradual increase of laboratory equipment at present, the physical and chemical board used in the laboratory is used more and more widely as an indispensable material. Phenolic resin has high bonding strength, water resistance, heat resistance, wear resistance and good chemical stability. It is widely used in the physical and chemical board industry due to its advantages, but it has disadvantages such as high cost, high curing temperature and long curing time. The current physical and chemical boards are increasingly unable to meet market demand in terms of corrosion resistance, heat resistance and service life.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A corrosion-resistant and heat-resistant physical and chemical board proposed by the present invention comprises, by weight: 80 parts of physical and chemical substrates, 8 parts of physical and chemical films and 0.6 parts of modified phenolic resins, and the physical and chemical substrates and the physical and chemical films are bonded through modified phenolic resins;

[0019] The raw materials of physical and chemical substrates include by weight: 60 parts of wood fiber, 30 parts of modified phenolic resin, 4 parts of curing agent, and 1 part of buffering agent;

[0020] The raw materials of the physical and chemical film include by weight: 50 parts of vinyl ester resin, 5 parts of dimethyldiethoxysilane, 30 parts of phenolic resin, 1 part of alumina fiber, 40 parts of kaolin, and 1 part of titanium dioxide;

[0021] In the preparation process of the modified phenolic resin, 75 parts of wheatgrass lignin, 15 parts of formaldehyde and 3 parts of sodium hydroxide were...

Embodiment 2

[0023] A corrosion-resistant and heat-resistant physical and chemical board proposed by the present invention comprises, in parts by weight: 90 parts of physical and chemical substrates, 4 parts of physical and chemical films and 0.9 parts of modified phenolic resins, and the physical and chemical substrates and the physical and chemical films are bonded through modified phenolic resins;

[0024] The raw materials of physical and chemical substrates include by weight: 50 parts of wood fiber, 40 parts of modified phenolic resin, 2 parts of curing agent, and 2 parts of buffering agent;

[0025] The raw materials of the physical and chemical film include by weight: 30 parts of vinyl ester resin, 10 parts of dimethyldiethoxysilane, 20 parts of phenolic resin, 3 parts of alumina fiber, 35 parts of kaolin, and 2 parts of titanium dioxide;

[0026] In the preparation process of the modified phenolic resin, 60 parts of wheatgrass lignin, 20 parts of formaldehyde and 1 part of sodium hy...

Embodiment 3

[0028] A corrosion-resistant and heat-resistant physical and chemical board proposed by the present invention comprises, in parts by weight: 86 parts of physical and chemical substrates, 5 parts of physical and chemical films and 0.7 parts of adhesive, and the physical and chemical substrates are bonded to the physical and chemical films through adhesives;

[0029] The raw materials of physical and chemical substrates include by weight: 56 parts of wood fiber, 34 parts of modified phenolic resin, 2.8 parts of curing agent, and 1.5 parts of buffering agent;

[0030] The raw materials of the physical and chemical film include by weight: 36 parts of vinyl ester resin, 7 parts of dimethyldiethoxysilane, 25 parts of phenolic resin, 1.7 parts of alumina fiber, 37 parts of kaolin, and 1.4 parts of titanium dioxide;

[0031] In the preparation process of the modified phenolic resin, 72 parts of wheatgrass lignin, 18 parts of formaldehyde and 2 parts of sodium hydroxide were sent into t...

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PUM

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Abstract

The invention discloses a corrosion-resistant and heat-resistant physical and chemical board, which comprises: 80-90 parts of physical and chemical base material, 4-8 parts of physical and chemical film and 0.6-0.9 parts of adhesive in parts by weight. The physical and chemical base material and the physical and chemical film are glued together. The raw materials of physical and chemical substrates include by weight: 50-60 parts of wood fiber, 30-40 parts of modified phenolic resin, 2-4 parts of curing agent, and 1-2 parts of buffering agent; the raw materials of physical and chemical film are by weight Parts include: 30-50 parts of vinyl ester resin, 5-10 parts of dimethyldiethoxysilane, 20-30 parts of phenolic resin, 1-3 parts of alumina fiber, 35-40 parts of kaolin, 1-10 parts of titanium dioxide 2 servings. The invention has low cost, excellent corrosion resistance and heat resistance, and long service life.

Description

technical field [0001] The invention relates to the technical field of physical and chemical plates, in particular to a corrosion-resistant and heat-resistant physical and chemical plate. Background technique [0002] With the gradual increase of laboratory equipment at present, the physical and chemical board used in the laboratory is used more and more widely as an indispensable material. Phenolic resin has high bonding strength, water resistance, heat resistance, wear resistance and good chemical stability. Due to its advantages, it is widely used in the physical and chemical board industry, but it has disadvantages such as high cost, high curing temperature and long curing time. The current physical and chemical boards are increasingly unable to meet market demand in terms of corrosion resistance, heat resistance and service life. Contents of the invention [0003] The invention provides a corrosion-resistant and heat-resistant physical and chemical board, which has lo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B7/12B32B21/02B32B21/08C08G8/28C08L101/06C08L61/06C08K13/04C08K7/08C08K5/5419C08K3/34C08K3/22
Inventor 徐学武
Owner ANHUI XIMA OUMEIJIA DECORATIVE MATERIAL IND
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