A corrosion-resistant heat-resistant physical and chemical board
A physical and chemical board, corrosion-resistant technology, applied in the field of physical and chemical boards, can solve the problems of corrosion resistance, heat resistance and service life of physical and chemical boards that cannot meet market demand, long curing time, and high curing temperature, and achieves heat resistance and chemical corrosion resistance. Excellent performance, overcoming the effect of high curing temperature and high bond strength
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Embodiment 1
[0018] A corrosion-resistant and heat-resistant physical and chemical board proposed by the present invention comprises, by weight: 80 parts of physical and chemical substrates, 8 parts of physical and chemical films and 0.6 parts of modified phenolic resins, and the physical and chemical substrates and the physical and chemical films are bonded through modified phenolic resins;
[0019] The raw materials of physical and chemical substrates include by weight: 60 parts of wood fiber, 30 parts of modified phenolic resin, 4 parts of curing agent, and 1 part of buffering agent;
[0020] The raw materials of the physical and chemical film include by weight: 50 parts of vinyl ester resin, 5 parts of dimethyldiethoxysilane, 30 parts of phenolic resin, 1 part of alumina fiber, 40 parts of kaolin, and 1 part of titanium dioxide;
[0021] In the preparation process of the modified phenolic resin, 75 parts of wheatgrass lignin, 15 parts of formaldehyde and 3 parts of sodium hydroxide were...
Embodiment 2
[0023] A corrosion-resistant and heat-resistant physical and chemical board proposed by the present invention comprises, in parts by weight: 90 parts of physical and chemical substrates, 4 parts of physical and chemical films and 0.9 parts of modified phenolic resins, and the physical and chemical substrates and the physical and chemical films are bonded through modified phenolic resins;
[0024] The raw materials of physical and chemical substrates include by weight: 50 parts of wood fiber, 40 parts of modified phenolic resin, 2 parts of curing agent, and 2 parts of buffering agent;
[0025] The raw materials of the physical and chemical film include by weight: 30 parts of vinyl ester resin, 10 parts of dimethyldiethoxysilane, 20 parts of phenolic resin, 3 parts of alumina fiber, 35 parts of kaolin, and 2 parts of titanium dioxide;
[0026] In the preparation process of the modified phenolic resin, 60 parts of wheatgrass lignin, 20 parts of formaldehyde and 1 part of sodium hy...
Embodiment 3
[0028] A corrosion-resistant and heat-resistant physical and chemical board proposed by the present invention comprises, in parts by weight: 86 parts of physical and chemical substrates, 5 parts of physical and chemical films and 0.7 parts of adhesive, and the physical and chemical substrates are bonded to the physical and chemical films through adhesives;
[0029] The raw materials of physical and chemical substrates include by weight: 56 parts of wood fiber, 34 parts of modified phenolic resin, 2.8 parts of curing agent, and 1.5 parts of buffering agent;
[0030] The raw materials of the physical and chemical film include by weight: 36 parts of vinyl ester resin, 7 parts of dimethyldiethoxysilane, 25 parts of phenolic resin, 1.7 parts of alumina fiber, 37 parts of kaolin, and 1.4 parts of titanium dioxide;
[0031] In the preparation process of the modified phenolic resin, 72 parts of wheatgrass lignin, 18 parts of formaldehyde and 2 parts of sodium hydroxide were sent into t...
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