Electronic device and circuit module thereof

Abstract

The invention relates to an electronic device and a circuit module thereof. The circuit module is electrically connected with a circuit substrate unit, the circuit substrate unit comprises a power output end, the circuit module comprises a substrate, a step-up circuit and a plasmatron, the substrate is provided with at least one through hole, and the substrate is used for connection with the circuit substrate unit in a direction opposite to the thickness side; the step-up circuit, which is arranged on the substrate, comprises at least one conductive circuit and a plurality of electronic elements electrically connected with the conductive circuit, the conductive circuit comprises a power input end capable of electrically connecting with the power output end and two power output ends, and the electronic elements are inserted in the through holes; the two opposite ends of the plasmatron are provided with electrodes which are electrically connected with the power output ends. The electronic device comprises the circuit module and the circuit substrate unit electrically connected with the circuit module, and the circuit substrate unit is connected with the substrate of the circuit module in a direction opposite to the thickness side. When plugged in a mainboard, the electronic device does not easily occupies a space, so that more electronic devices can be plugged in the mainboard.

Description

technical field [0001] The invention relates to an electronic device and its circuit module. Background technique [0002] The circuit module of a general electronic device includes a circuit substrate, a plurality of electronic components and a connection port. Several electronic components are directly welded on the circuit substrate, and the connection port is electrically connected to the circuit substrate and can be assembled on the computer motherboard. , when the circuit module is connected to the motherboard, the power of the motherboard can be transmitted for use by the circuit module. The circuit module disclosed in Taiwan Patent M456042 belongs to this category. [0003] However, the electronic components of this type of circuit module are directly glued on the circuit substrate, and some of the electronic components are inevitably thicker. When they are arranged on the substrate, the circuit module will be too thick; in addition, each The distance between the s...

AI Technical Summary

Problems solved by technology

[0003] However, the electronic components of this type of circuit module are directly glued on the circuit substrate, and some of the electronic components are inevitably thicker. When they are arranged on the substrate, the circuit module will be too thick; in addition, each The distance between the slots of the mainboard has specific specifications, so the inserted electronic device must meet its thickness limit. If the circuit module is covered with other shells, and then the circuit module is plugged into the mainboard, It will take up a lot of space, causing some slots to be idle

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