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Special oven for packaging

A technology of a baking oven and a baking board, which is applied in the field of baking ovens, can solve the problems of poor heat preservation performance and low baking speed, and achieves the effects of good heat preservation effect and accelerated baking speed.

Inactive Publication Date: 2015-05-06
SUZHOU HUACHONG PRECISION MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Packaging is a technology that packs integrated circuits with insulating plastic or ceramic materials. It not only plays the role of placing, fixing, sealing, protecting chips and enhancing thermal conductivity, but also serves as a bridge between the internal world of the chip and the external circuit. After the packaging is completed, it is necessary to use a baking oven to bake and cure it, but the traditional baking oven has poor thermal insulation performance during baking, and the baking rate is low, which cannot meet the current people's requirements.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] A special baking oven for packaging, including: a box body and a baking plate, the baking plate is fixedly installed inside the box body, the box body is made of polyurethane resin and phenolic resin polymerized at high temperature, according to the quality Proportioning by fraction: the content of the polyurethane resin accounts for 30%, and the content of the phenolic resin is 70%. The baking plate is formed by high-temperature fusion of metal aluminum and metal copper, and the proportioning is carried out according to the mass fraction: the The content of metal aluminum is 65%, and the content of said metal copper is 35%.

Embodiment 2

[0013] A special baking oven for packaging, including: a box body and a baking plate, the baking plate is fixedly installed inside the box body, the box body is made of polyurethane resin and phenolic resin polymerized at high temperature, according to the quality Proportioning by fraction: the content of the polyurethane resin is 40%, the content of the phenolic resin is 60%, the baking plate is formed by high-temperature fusion of metal aluminum and metal copper, and the proportioning is carried out according to the mass fraction: the The content of metal aluminum is 75%, and the content of said metal copper is 25%.

Embodiment 3

[0015] A special baking oven for packaging, including: a box body and a baking plate, the baking plate is fixedly installed inside the box body, the box body is made of polyurethane resin and phenolic resin polymerized at high temperature, according to the quality Proportioning of fractions: the content of the polyurethane resin accounts for 35%, the content of the phenolic resin is 65%, the baking plate is formed by high-temperature fusion of metal aluminum and metal copper, and the proportioning is carried out according to the mass fraction: the The content of metal aluminum is 70%, and the content of said metal copper is 30%.

[0016] Wherein, the thickness of the box is 10-15mm.

[0017] Different from the prior art, the present invention adopts a box made of polyurethane resin and phenolic resin at high temperature, which has excellent heat preservation effect, and can slow down the temperature loss in the oven during baking, saving energy consumption At the same time, t...

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Abstract

The invention discloses a special oven for packaging. The special oven for packaging comprises an oven body and a roasting plate, the roasting plate is firmly arranged in the oven body, the oven body is composed of polyurethane resin and phenolic resin in a high-temperature polymerization mode, and the oven body comprises 30-40% of polyurethane resin and 60-70% of phenolic resin by weight; the roasting plate is composed of metal aluminum and metal copper in a high-temperature fusion mode, and the roasting plate comprises 65-75% of metal aluminum and 25-35% of metal copper by weight. By means of said mode, the overall heat preservation effect is good, and the roasting speed can be fastened.

Description

technical field [0001] The invention relates to a baking oven, in particular to a baking oven dedicated for packaging. Background technique [0002] Packaging is a technology that packs integrated circuits with insulating plastic or ceramic materials. It not only plays the role of placing, fixing, sealing, protecting chips and enhancing thermal conductivity, but also serves as a bridge between the internal world of the chip and the external circuit. After the packaging is completed, it is necessary to use a baking oven to bake and cure it. However, the traditional baking oven has poor thermal insulation performance during baking, and the baking rate is low, which cannot meet the current people's requirements. Contents of the invention [0003] The main technical problem to be solved by the present invention is to provide a special baking oven for packaging, so that the overall heat preservation effect is better and the baking speed can be accelerated. [0004] In order to...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67098
Inventor 付冲
Owner SUZHOU HUACHONG PRECISION MACHINERY