Double-terminal ESD integrated protection device with wide range, high current and high maintenance voltage and its preparation method
A high maintenance voltage and device protection technology, which is applied in the fields of electrical solid state devices, semiconductor/solid state device manufacturing, electrical components, etc. Compression, the effect of reducing production costs
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Embodiment 1
[0039] Embodiment 1 A double-terminal ESD integrated protection device with wide range, high current and high sustain voltage
[0040] This embodiment is a double-terminal ESD integrated protection device with a wide range of high current and high sustain voltage, such as figure 1 As shown, it includes:
[0041] The metal layer 1, the N+ substrate 100, the N- epitaxial layer 200, and the silicon dioxide layer 700 are sequentially provided from bottom to top. The top of the N-epitaxial layer 200 is provided with two symmetrical, penetrating silicon dioxide layers. In the P+ active region 600, a guard ring 301 is provided on the periphery of the P+ active region 600, and a field limiting ring 300 is symmetrically arranged on the periphery of the guard ring 301. The two P+ active regions 600 lead out two A metal electrode 800 is used as two electrodes of a double-terminal ESD integrated protection device.
[0042] The N− epitaxial layer 200 in this embodiment is formed by using...
Embodiment 2
[0045] Example 2 A preparation method of a double-terminal ESD integrated protection device with a wide range of high current and high sustain voltage
[0046] This embodiment provides a method for preparing an open-circuit protection integrated chip in Embodiment 1, comprising the following steps:
[0047] (1) An N- epitaxial layer 200 is epitaxially formed on the prepared N+ substrate 100 . Such as figure 2 As shown, in this embodiment, heavy doping diffusion or implantation of N-type material is first performed on the silicon wafer to form an N+ substrate 100, and then the doped layer or implanted layer on the back is ground away to obtain a substrate with better concentration and better Substrate with heat absorption and treatment effects, and then after the above substrate is chemical vapor polished, the N- epitaxial layer is grown by N- single crystal epitaxial growth on the N+ substrate 100, which is the voltage bearing layer 200, forming a drift area to withstand the ...
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