37results about How to "Improved breakdown voltage performance" patented technology

A semiconductor power device may include a lightly doped layer formed on a heavily doped layer. One or more devices are formed in the lightly doped layer. Each device may include a body region, a source region, and one or more gate electrodes formed in corresponding trenches in the lightly doped region. Each of the trenches has a depth in a first dimension, a width in a second dimension and a length in a third dimension. The body region is of opposite conductivity type to the lightly and heavily doped layers. The source region is formed proximate the upper surface. One or more deep contacts are formed at one or more locations along the third dimension proximate one or more of the trenches. The contacts extend in the first direction from the upper surface into the lightly doped layer and are in electrical contact with the source region.

In terms of achieving a reduction in the cost of an antenna switch, there is provided a technology capable of minimizing harmonic distortion generated in the antenna switch even when the antenna switch is particularly formed of field effect transistors formed over a silicon substrate. Between the source region and the drain region of each of a plurality of MISFETs coupled in series, a distortion compensating capacitance circuit is coupled which has a voltage dependency such that, in either of the cases where a positive voltage is applied to the drain region based on the potential of the source region and where a negative voltage is applied to the drain region based on the potential of the source region, the capacitance decreases to a value smaller than that in a state where the potential of the source region and the potential of the drain region are at the same level.

A semiconductor device includes: an epitaxial layer; a body layer, formed in the epitaxial layer, which includes a channel region; a source layer disposed in superposition on the body layer; a gate insulator, formed on the epitaxial layer, which is in a ring shape surrounding the source layer; a gate electrode formed through the gate insulator; a drift layer, formed in the epitaxial layer, which is in a ring shape surrounding the body layer; and a drain layer formed in the surface of the epitaxial layer and disposed opposite to the source layer. The body layer is disposed such that the boundary surface at an end in the gate-width direction is in contact with the undersurface of the gate insulator. The gate insulator has a thick film portion thicker than a part above the channel region in the gate-length direction at least in a part where the gate insulator is in contact with the boundary surface of the body layer at the end in the gate-width direction.

The present invention relates to a semiconductor device and a method for manufacturing the same. A RESURF layer (101) including a plurality of P-type implantation layers having a relatively low concentration of P-type impurity is formed adjacent to an active region (2). The RESURF layer (101) includes a first RESURF layer (11), a second RESURF layer (12), a third RESURF layer (13), a fourth RESURF layer (14), and a fifth RESURF layer (15) that are arranged sequentially from the P-type base (2) side so as to surround the P-type base (2). The second RESURF layer (12) is configured with small regions (11′) having an implantation amount equal to that of the first RESURF layer (11) and small regions (13′) having an implantation amount equal to that of the third RESURF layer (13) being alternately arranged in multiple. The fourth RESURF layer (14) is configured with small regions (13′) having an implantation amount equal to that of the third RESURF layer (13) and small regions (15′) having an implantation amount equal to that of the fifth RESURF layer (15) being alternately arranged in multiple.

Drain-extended MOS transistors (T1, T2) and semiconductor devices (102) are described, as well as fabrication methods (202) therefor, in which a p-buried layer (130) is formed prior to formation of epitaxial silicon (106) over a substrate (104), and a drain-extended MOS transistor (T1, T2) is formed in the epitaxial silicon layer (106). The p-buried layer (130) may be formed above an n-buried layer (120) in the substrate (104) for high-side driver transistor (T2) applications, wherein the p-buried layer (130) extends between the drain-extended MOS transistor (T2) and the n-buried layer (120) to inhibit off-state breakdown between the source (154) and drain (156).

A device comprises a substrate, an n-layer and a p-layer, an n-electrode, and a p-electrode. A step is formed at an outer circumference of the device. A protective film is formed so as to continuously cover a side surface and a bottom surface of the step. A field plate electrode connected with the p-electrode is formed on the protective film. When a distance from the pn junction interface to the surface of the protective film on the bottom surface of the step is defined as h (μm), a dielectric constant of the protective film is defined as ∈_s, and a thickness of the protective film at the pn junction interface on the side surface of the step is defined as d (μm), (∈_s·h)/d is 4 or more, and ∈_s/d is 3 (1/μm) or more.

Drain-extended MOS transistors (T1, T2) and semiconductor devices (102) are described, as well as fabrication methods (202) therefor, in which a p-buried layer (130) is formed prior to formation of epitaxial silicon (106) over a substrate (104), and a drain-extended MOS transistor (T1, T2) is formed in the epitaxial silicon layer (106). The p-buried layer (130) may be formed above an n-buried layer (120) in the substrate (104) for high-side driver transistor (T2) applications, wherein the p-buried layer (130) extends between the drain-extended MOS transistor (T2) and the n-buried layer (120) to inhibit off-state breakdown between the source (154) and drain (156).

A capacitor having improved surface breakdown voltage performance and a method for applying laser marking to capacitors which does not reduce capacitor surface breakdown voltage, can be applied using existing laser marking technologies and apparatus, and which results in a mark that is legible and clear, is disclosed. In a first exemplary embodiment a capacitor includes a laser mark which is located near one of the capacitor terminals. The exact location is not critical as long as the mark does not make physical contact with the terminal. Conventional laser marking technologies and apparatus may be used to fix the mark in the new location. In a second embodiment the laser mark is oriented so that a flat portion of the mark is is oriented closest to the adjacent terminal.

The invention discloses a method for improving breakdown voltage for a self-aligning contact hole, which comprises the following steps: 1, depositing polycrystalline silicon, an oxidation film layer and a hard mask layer on an oxide layer on a silicon substrate in turn; 2, etching the hard mask layer, the oxidation film layer and the polycrystalline silicon from the top down in turn to form a polycrystalline silicon gate, and making a top angle at the top of the polycrystalline silicon become circular; 3, growing an oxidation film layer on the lateral surface of the polycrystalline silicon gate; 4, growing a side wall; and 5, etching the self-aligning contact hole. A polycrystalline silicon structure comprises a polycrystalline silicon layer, the oxidation film layer and the hard mask layer from the bottom up in turn. The oxidation film layer as a polycrystalline silicon gate structure is arranged between the hard mask layer and the polycrystalline silicon layer, the top angle at the top of the polycrystalline silicon gate is made to be circular, and the thicker oxidation film and nitride film are formed at the top angle of the top of the grate, so as to improve the breakdown voltage performance for the self-aligning contact hole.

The invention discloses an HEMT (high electron mobility transistor) device with a back field plate structure. The HEMT device comprises a silicon substrate, a GaN epitaxial layer, an AlGaN barrier layer and an Si3N4 passivated protection layer sequentially from bottom to top; a gate electrode, a source electrode and a drain electrode are arranged on the AlGaN barrier layer; a groove with the crosssection in a right trapezoid shape is formed in the silicon substrate; the groove opens downwards, and the top of the groove is the lower surface of the AlGaN barrier layer; a back field plate structure is arranged on part of lower surface of the silicon substrate, the slope of the groove and part of top of the groove. The invention also discloses a preparation method of the HEMT device adoptingthe back field plate structure. By use of substrate isolation and back field plate technologies, substrate breakdown of the device is avoided, the breakdown voltage of the GaN HEMT device is increased, the field intensity peak value of the drain side of the gate electrode is reduced, the cooling performance of the device is improved, and the HEMT device has important significance in realizing high-performance and high-reliability gallium nitride based devices.

The electro-optical device includes a first electrode for inverting a polarity, a second electrode opposite to the first electrode, and liquid crystals interposed between these electrodes. Before a polarity inversion timing, the scanning line driver circuit simultaneously selects two or more scanning lines of the plural scanning lines, and the data line driver circuit outputs an offset potential with the polarity opposite to that of the potential of the first electrode thereafter, to a data line. On the other hand, after the polarity inversion timing, the scanning line driver circuit individually selects each of the plural scanning lines, and the data line driver circuit outputs the data potential corresponding to the potential polarity of the first electrode thereafter, to the data line.

The invention discloses a process for machining a mesa diode. The process comprises the following steps of producing a diffusion sheet; photoetching a trench; corroding a circular trough mesa; growingsilicon dioxide film on the circular trough mesa and performing a cleaning treatment; coating glass powders; baking glass powders; performing glass passivation; and performing surface corrosion and cleaning. The process is characterized by preparing a mixed acid etching solution by mixing nitric acid, hydrofluoric acid, and glacial acetic acid in a volume ratio of 5:3:1; then etching the photoetched silicon wafer into the mixed acid etching solution to obtain the PN-junction mesa trench of each chip; and etching the mesa diode PN-junction into a circular shape. The circular shape has a smoothcurved surface and can have the highest breakdown voltage so as to improve the breakdown voltage effect of a device.

A bipolar type semiconductor device capable of attaining high current gain and high cut-off frequency and performing a satisfactory transistor operation also in a high current region while maintaining a high breakdown voltage performance, as well as a method of manufacturing the semiconductor device, are provided. In a collector comprising a first semiconductor layer and a second semiconductor layer narrower in band gap than the first semiconductor layer, an impurity is doped so as to have a peak of impurity concentration within the second collector layer and so that the value of the peak is higher than the impurity concentration at any position within the first collector layer. It is preferable to adjust the concentration of the doped impurity in such a manner that a collector-base depletion layer extends up to the first collector layer.

The invention provides a bidirectional transient voltage suppressor and a manufacture method thereof. The manufacture method comprises steps of providing a substrate of a second conductive type, etching the substrate so as to form a ditch, forming a second epitaxial layer and a third epitaxial layer of the second conductive type on the side wall of the ditch, forming a forth epitaxial layer of a first conductive type on the upper surface of the substrate, forming a fifth epitaxial layer of the first conductive type on the lower surface of the substrate, forming a first metal layer on the uppersurface of the fourth epitaxial layer, and forming a second metal layer on the lower surface of the fifth epitaxial layer. The anti-breakdown voltage capability of the bidirectional transient voltagesuppressor is improved through multiple groups of PN junctions; the bidirectional transient voltage suppressor has a multi-path bidirectional function so as to protect multiple circuits simultaneously in use, and application cost of the power device is lowered. The bidirectional transient voltage suppressor requires etching for only once, so that the manufacture cost is lowered.

The invention discloses an annular isolation structure in a high-voltage BCD structure, and a manufacturing method thereof, and relates to the field of semiconductor manufacturing. The manufacturing method of the annular isolation structure in the high-voltage BCD structure comprises the following steps: forming the annular isolation structure between a high-voltage circuit region and a low-voltage circuit region, wherein the annular isolation structure is composed of a first-type well region and a first-type buried layer; defining second-type buried layer patterns on two sides of the annular isolation structure through a photoetching process, wherein the left side of the annular isolation structure comprises at least two second-type buried layer patterns with different widths; and forming second-type buried layers in the substrate corresponding to the second-type buried layer patterns through an ion implantation process. The problem that a buried layer on the left side of an existing annular isolation structure is prone to breakdown is solved. The effects of improving the concentration distribution of the buried layers on the two sides of the annular isolation structure and improving the breakdown voltage of the annular isolation structure are achieved.