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41results about How to "Lower Antenna Costs" patented technology

Full-parallel-feed common-caliber dual-polarized waveguide slot filtering antenna array system

The invention relates to a full-parallel-feed common-caliber dual-polarized waveguide slot filter antenna array system, which is formed by symmetrically arranging four 1/4 antenna array planes througha sum-difference feed network, and each 1/4 antenna array plane is cascaded with a linear frequency-variable coupling filter; each 1/4 antenna array surface comprises a power division waveguide layerand a plurality of sub-array antenna units arranged above the power division waveguide layer; each sub-array antenna unit comprises dual-polarized radiation antenna units which are arranged accordingto a 2 * 2 structure; each dual-polarization radiation antenna unit comprises a dual-polarization cross-shaped slot unit radiation layer, a four-ridge transmission waveguide layer, a dual-polarization coupling slot layer, a vertical polarization feed network layer, a horizontal polarization coupling slot layer and a horizontal polarization feed network layer which are sequentially arranged from top to bottom. According to the invention, linear polarization radiation in two directions can be realized, interference signals outside the working bandwidth can be effectively suppressed, and the antenna has the advantages of broadband, high gain, low sidelobe, low cross polarization and high integration level.
Owner:SHANGHAI RADIO EQUIP RES INST

Bottomless paper RFID label based on conductive ink printed antenna

The present invention relates to a bottomless paper RFID label based on a conductive ink printed antenna, and to the label technology field. The label comprises a parting agent coating, an impermeable layer, a thermal paper layer, a RFID label layer, a bottom layer, a gluing layer and a tearing wire, wherein the RFID label layer is bound between the lower surface of the thermal paper layer and the upper surface of the bottom layer, the gluing layer is coated at the lower surface of the bottom layer, the impermeable layer is coated at the upper surface of the thermal paper layer, the parting agent coating is coated on the impermeable layer, the tearing wire is processed between adjacent labels. The bottom layer is insulation base materials. The RFID label layer is formed by connecting an antenna prepared by conductive ink printing and a RFID chip through the conductive adhesive. The impermeable layer is prepared through carboxylic butadiene-styrene latex, PVA, styrene-acrylic emulsion, perfluor carboxylic acid oil-proofing agent, starch and distilled water in proportion. The parting agent coating is silicone oil, and the gluing layer is adhesive sticker. The bottomless paper RFID label based on the conductive ink printed antenna saves the bottom papers and employs the conductive ink printed antenna so as to greatly reduce the cost of the RFID label and play an important effect on the promotion of the popularization and the application.
Owner:竹林伟业科技发展(天津)股份有限公司

Silicon-based broadband wide-angle scanning antenna unit

The invention discloses a silicon-based broadband wide-angle scanning antenna unit which consists of a rectangular patch 1, a glass substrate 2, a slot coupling feed layer 3, a silicon-based substrateintegrated waveguide back cavity 4 and an impedance conversion layer 6 from top to bottom. A silicon-based metallized shielding through hole 5 penetrating through the upper surface and the lower surface of the silicon-based substrate integrated waveguide back cavity 4 is formed in the silicon-based substrate integrated waveguide back cavity 4; and the silicon-based metallized shielding through hole 5 connects the connecting slot coupling feed layer 3 with the impedance conversion layer 6, the impedance conversion layer 6 is a common-ground coplanar waveguide structure, and a middle strip-shaped extension part is a microstrip feed transmission line 7. The silicon-based broadband wide-angle scanning antenna unit disclosed by the invention is realized by adopting a standardized glass substrate, a silicon substrate and a standardized wiring, through hole and copper-tin bonding process so that the process complexity and the processing cost are reduced, and the whole structure has the advantages of a low profile, high reliability, a simple process, low cost and the like.
Owner:CHINA ELECTRONICS TECH GRP CORP NO 14 RES INST
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