Method for pre-positioning circuit board in film-on-chip and flexible circuit board
A flexible circuit board and film-on-chip technology, which is applied in the direction of circuit board tool positioning, printed circuit, printed circuit, etc., can solve the problem that the circuit board affects the optimization of circuit wiring, so as to improve the space utilization rate and reduce the contact area Effect
Inactive Publication Date: 2018-02-27
SCIENBIZIP CONSULTINGSHENZHENCO
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Problems solved by technology
Since the suction cup needs an adsorption area with a diameter of at least 3 mm to adsorb the circuit board, the position of the suction cup often conflicts with the dense electronic components on the circuit board when the existing method adsorbs the flexible circuit board. It is necessary to change the wiring of the circuit board to affect the optimization of circuit layout
Method used
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[0025] Please refer to figure 1 and figure 2 , In a preferred embodiment of the present invention, a flexible circuit board 10 is provided with circuit traces 11 , a plating layer 13 and several adsorption points 15 . The plurality of suction points 15 are located in the empty space of the circuit trace 11 and distributed on both sides of the center of gravity of the flexible circuit board 10 . Each adsorption point 15 is recessed inwardly and coated with a layer of magnetic material 19, which can be iron, cobalt, nickel or alloy materials thereof. The suction points 15 are located in the vacant places of the circuit traces 11 and will not affect the wiring of the flexible circuit board 10, and the suction points 15 are distributed on both sides of the center of gravity of the flexible circuit board 10 so that the flexible circuit board can be moved Balance at 10.
[0026] Please refer to image 3 When the flexible circuit board is pre-positioned in a film-on-chip manufac...
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The invention discloses a method for pre-positioning a circuit board in a chip on a film. The method includes steps of arranging a plurality of suction points on the flexible circuit board; sucking the multiple suction points on the flexible circuit board by the aid of a plurality of magnetic heads so as to shift the flexible circuit board. The invention further relates to the flexible circuit board. The flexible circuit board is pre-positioned by the aid of the method. The flexible circuit board and the method for pre-positioning the circuit board in the chip on the film have the advantages that the flexible circuit board can be shifted by the aid of the method in a magnetic suction mode, so that the contact areas can be reduced as compared with the original sucker shifting mode, influence on electronic components on the circuit board can be prevented, and the space utilization rate of the flexible circuit board can be increased.
Description
technical field [0001] The invention relates to a circuit board pre-positioning method and a flexible circuit board, in particular to a circuit board pre-positioning method and a flexible circuit board applied in film-on-chip. Background technique [0002] The COF (Chip On Film, chip-on-film) process in the LCD panel manufacturing process is to heat-press the liquid crystal chip and the driving flexible circuit board as a soft board. The existing method is to shift and fix the flexible circuit board by suction cups, but as the circuit board becomes lighter and thinner, the size of the circuit board becomes smaller and smaller, and the wiring on the circuit board becomes denser. Since the suction cup needs an adsorption area with a diameter of at least 3 mm to adsorb the circuit board, the position of the suction cup often conflicts with the dense electronic components on the circuit board when the existing method adsorbs the flexible circuit board. It is necessary to change...
Claims
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IPC IPC(8): H05K3/30H05K1/18
CPCH05K3/0008H05K3/32H05K2201/10136H05K2203/1509
Inventor 吴政忠
Owner SCIENBIZIP CONSULTINGSHENZHENCO