Chemical copper plating solution and chemical copper plating method

Abstract

The invention discloses a chemical copper plating solution and a chemical copper plating method. The chemical copper plating solution is characterized by being a water solution comprising 5-30g / L of copper salt, 5-20ml / L of a reducing agent, 10-40g / L of a complexing agent, 8-20g / L of a pH adjustor, 5-15g / L of a pH buffer, 5-50mg / L of organic matter Q, 0-1g / L of ferrite, 0-5g / L of a surfactant, 1-100mg / L of a stabilizer, 5-3mg / L of an accelerator and 10-20ml / L of methanol; the pH value of the chemical thick copper plating solution is 12.0-13.5. The chemical thick copper plating solution is used in the chemical copper plating process of circuit board direct metallization, the stability of the plating solution is good and the appearance of the plating is bright with a metallic luster and the impurity content is few, the thickness of the plating layer is more than 30 nm and the thickness of the plating layer is greatly increased. The plating speed of the chemical copper plating solution can be quickened to reach 20nm / hr.

Description

technical field [0001] The invention relates to the field of non-metal electroless plating, in particular to an electroless copper plating solution and a corresponding electroless copper plating method. Background technique [0002] Electroless plating is a method of using a chemical reducing agent to make metal ions form a metal or metal layer on a catalytically active plated piece. It does not require a power source and has simple process equipment. It can be used on non-metallic (non-conductor) such as plastic, glass, ceramics and Conducted on the surface of semiconductor materials, the thickness of the coating is very uniform, and the bonding force is good. Based on the characteristics that electroless plating is superior to electroplating, it has been widely used in the field of circuit board manufacturing. [0003] Electroless plating copper, commonly known as sinking copper. It is a self-catalyzed redox reaction. During the electroless copper plating process, Cu 2...

AI Technical Summary

Problems solved by technology

The existing electroless copper plating solution has slow plating speed and thin coating. When the coating reaches 3-4 microns, the plating speed will be extremely slow or even stagnant. It is difficult to meet the requirements of the circuit board for the thickness of the coating.

[0013] In general, the higher the plating speed, the more difficult it is to control the stability

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