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Packaging assembly and preparation method thereof

A package and device technology, applied in the field of package and its preparation, can solve the problems of passivation layer peeling, device bending, affecting the packaging effect, etc., to achieve reduced stress pull, good packaging effect, and reduce the possibility of peeling Effect

Active Publication Date: 2015-05-27
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when handling large-size OLED display devices, it is inevitable to bend the device
In the bending area, due to the large gap between the Young's modulus of the resin glue and the passivation layer, tangential tensile stress will be generated between the layers, causing the passivation layer to peel off from the OLED device, or the passivation layer is multi-layered. structure, especially in the case of inorganic-organic stacked structures, this tensile stress will cause peeling between passivation layers and affect the packaging effect

Method used

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  • Packaging assembly and preparation method thereof
  • Packaging assembly and preparation method thereof
  • Packaging assembly and preparation method thereof

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Experimental program
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preparation example Construction

[0068] The embodiment of the present invention also provides a method for preparing a package, including:

[0069] forming the package, the package comprising:

[0070] first substrate;

[0071] a second substrate opposite to the first substrate;

[0072] electronic components located between the first substrate and the second substrate;

[0073] a protective layer covering the electronic components; and

[0074] bonding the first substrate and the second substrate to realize an adhesive layer for surface packaging;

[0075] It is characterized in that the package also includes:

[0076] An isolation layer located between the adhesive layer and the protective layer, the isolation layer is attached to the adhesive layer and the protective layer respectively, the constituent material of the isolation layer and the constituent material of the adhesive layer The adhesive force between them is smaller than the adhesive force between the constituent materials of the protective ...

example 1

[0099] A layer of SiNx with a thickness of 1 μm was prepared on the OLED device by chemical vapor deposition, covering the entire light-emitting area; a mixture of polytetrafluoroethylene and paraffin was sprayed on it to form a circular pattern with a diameter of 10 mm and an interval of 3 mm; on the cover plate Coating UV-curable epoxy resin adhesive material on the top, with a thickness of 20 μm; pressing the substrate and cover plate under vacuum to make the epoxy resin adhesive material completely cover the mixture of tetrafluoroethylene and paraffin; UV irradiation on the OLED device, Allow the encapsulant to cure.

example 2

[0101]A layer of SiNx with a thickness of 1 μm is prepared on the OLED device by chemical vapor deposition, covering the entire light-emitting area; a 0.5 μm thick polyacrylate is formed on it by spraying; and then prepared by chemical vapor deposition on it A layer of SiCN with a thickness of 1 μm, and then spray polyethylene on it to form a circular pattern with a diameter of 5 mm and an interval of 2 mm; coat a thermosetting epoxy resin adhesive on the cover plate—the encapsulation adhesive layer, with a thickness of 20 μm; The base plate and the cover plate are pressed together under vacuum, so that the epoxy resin glue material completely covers the polyethylene layer; the OLED device is heated to cure the encapsulation glue.

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PUM

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Abstract

An embodiment of the invention provides a packaging assembly and a preparation method thereof. The packaging assembly comprises a first substrate, a second substrate opposite to the first substrate, an electronic component located between the first substrate and the second substrate, a protecting layer covering the electronic component, a bonding layer for bonding the first substrate and the second substrate to realize surface packaging, as well as an isolating layer located between the bonding layer and the protecting layer, wherein the isolating layer is attached to the bonding layer and the protecting layer respectively; adhesion force between a component material of the isolating layer and a component material of the bonding layer is smaller than that of the component material of the protecting layer and the component material of the bonding layer. According to the embodiment of the invention, the electronic component can be better packaged.

Description

technical field [0001] Embodiments of the present invention relate to the field of electronic components, in particular to a package and a preparation method thereof. Background technique [0002] Since organic light-emitting diode (OLED) devices are exposed to water and oxygen during operation, parts will be corroded and damaged, so it is particularly important to choose a good packaging method for OLED devices. [0003] At present, in the OLED device packaging technology, especially in the large-size OLED device packaging technology, the use of resin glue for surface packaging is widely used. At the same time, in order to increase the effect of blocking water and oxygen and prevent the glue from directly contacting the OLED device. A passivation layer is added between the OLED device and the glue. [0004] However, when a large-size OLED display device is transported, it is inevitable that the device will be bent. In the bending area, due to the large gap between the You...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L21/56H01L27/32
CPCH10K77/111H10K2102/311H10K59/873H10K50/8428H10K50/844H10K71/00
Inventor 罗程远
Owner BOE TECH GRP CO LTD