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A package and method of making the same

A packaging and device technology, applied in the field of packaging and its preparation, can solve problems affecting packaging effects, passivation layer peeling, device bending, etc., to reduce the possibility of peeling, reduce stress pull, and good packaging effect Effect

Active Publication Date: 2017-05-17
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when handling large-size OLED display devices, it is inevitable to bend the device
In the bending area, due to the large gap between the Young's modulus of the resin glue and the passivation layer, tangential tensile stress will be generated between the layers, causing the passivation layer to peel off from the OLED device, or the passivation layer is multi-layered. structure, especially in the case of inorganic-organic stacked structures, this tensile stress will cause peeling between passivation layers and affect the packaging effect

Method used

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  • A package and method of making the same
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  • A package and method of making the same

Examples

Experimental program
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Effect test

preparation example Construction

[0068] The embodiment of the present invention also provides a method for preparing a package, including:

[0069] forming the package, the package comprising:

[0070] first substrate;

[0071] a second substrate opposite to the first substrate;

[0072] electronic components located between the first substrate and the second substrate;

[0073] a protective layer covering the electronic components; and

[0074] bonding the first substrate and the second substrate to realize an adhesive layer for surface packaging;

[0075] It is characterized in that the package also includes:

[0076] An isolation layer located between the adhesive layer and the protective layer, the isolation layer is attached to the adhesive layer and the protective layer respectively, the constituent material of the isolation layer and the constituent material of the adhesive layer The adhesive force between them is smaller than the adhesive force between the constituent materials of the protective ...

example 1

[0099] A layer of SiNx with a thickness of 1 μm was prepared on the OLED device by chemical vapor deposition, covering the entire light-emitting area; a mixture of polytetrafluoroethylene and paraffin was sprayed on it to form a circular pattern with a diameter of 10 mm and an interval of 3 mm; on the cover plate Coating UV-curable epoxy resin adhesive material on the top, with a thickness of 20 μm; pressing the substrate and cover plate under vacuum to make the epoxy resin adhesive material completely cover the mixture of tetrafluoroethylene and paraffin; UV irradiation on the OLED device, Allow the encapsulant to cure.

example 2

[0101]A layer of SiNx with a thickness of 1 μm is prepared on the OLED device by chemical vapor deposition, covering the entire light-emitting area; a 0.5 μm thick polyacrylate is formed on it by spraying; and then prepared by chemical vapor deposition on it A layer of SiCN with a thickness of 1 μm, and then spray polyethylene on it to form a circular pattern with a diameter of 5 mm and an interval of 2 mm; coat a thermosetting epoxy resin adhesive on the cover plate—the encapsulation adhesive layer, with a thickness of 20 μm; The base plate and the cover plate are pressed together under vacuum, so that the epoxy resin glue material completely covers the polyethylene layer; the OLED device is heated to cure the encapsulation glue.

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Abstract

Examples of the present invention provide a packaging piece and its preparation method.Packaged parts include: the first substrate; the second substrate that is set up with the first substrate; the electronic component between the first and second substrates; the protective layer of the electronic component;A substrate and the second substrate to realize the adhesion layer of the surface packaging; the sealing parts also include: the isolation layer between the bonding layer and the protective layer, respectivelyFollow -up with the protective layer, the adhesion between the constituent material of the isolation layer and the composition of the adhesive layer is less than the attachment between the composition material of the protective layer and the composition material of the adhesive layer and the composition of the adhesive layer.Strong.Examples of the present invention can achieve better packaging effects of electronic components.

Description

technical field [0001] Embodiments of the present invention relate to the field of electronic components, in particular to a package and a preparation method thereof. Background technique [0002] Since organic light-emitting diode (OLED) devices are exposed to water and oxygen during operation, parts will be corroded and damaged, so it is particularly important to choose a good packaging method for OLED devices. [0003] At present, in the OLED device packaging technology, especially in the large-size OLED device packaging technology, the use of resin glue for surface packaging is widely used. At the same time, in order to increase the effect of blocking water and oxygen and prevent the glue from directly contacting the OLED device. A passivation layer is added between the OLED device and the glue. [0004] However, when a large-size OLED display device is transported, it is inevitable that the device will be bent. In the bending area, due to the large gap between the You...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31H01L21/56H01L27/32H10K99/00
CPCH10K77/111H10K2102/311H10K59/873H10K50/8428H10K50/844H10K71/00
Inventor 罗程远
Owner BOE TECH GRP CO LTD