Printed circuit board and method for manufacturing printed circuit board

Abstract

The invention provides a printed circuit board. The printed circuit board comprises multiple daughter boards, wherein the daughter boards comprise a first daughter board located on the outermost side of the printed circuit board; at least one first through hole is formed in the first daughter board and penetrates through back drilling surface and a compression joint surface of the first daughter board; the wall of the first through hole is plated with a conductive metal layer; a first step hole is formed in the first daughter board in a back drilling manner and is communicated with the first through hole; the projection of the first step hole on the back drilling surface of the first daughter board covers the projection of the first through hole on the back drilling surface of the first daughter board; the first step hole is separated from other holes formed in the first daughter board. The invention further provides a manufacturing method of the printed circuit board. According to the printed circuit board and the method, the step hole is formed, so that accommodation space for accommodating a fluid is formed, and the fluid can be prevented from flowing into a blind hole of the printed circuit board.

Description

technical field [0001] The invention relates to the field of electronic devices, in particular to a printed circuit board and a method for manufacturing the printed circuit board. Background technique [0002] With the development of science and technology, people have higher and higher requirements for the integration of integrated circuit boards. Ordinary single-sided crimping cannot meet the needs of system capacity. Double-sided crimping blind hole design is adopted, that is, two sub-boards are superimposed to form a mother board. Board structure, which can realize double-sided crimping and expand the capacity of the backplane. In addition, the demand for high-speed performance makes the density of the crimping connectors smaller and smaller, and the pitch of the crimping blind holes on the corresponding printed circuit board is getting smaller and smaller. [0003] When crimping the sub-board to form the mother board or processing the through-hole of the mother board, ...

AI Technical Summary

Problems solved by technology

[0004] In the prior art, pre-opened prepreg combined with copper foil is used to protect the crimped blind hole of the sub-board against infiltration. The prepreg has certain fluidity at high temperature. Therefore, the fluid material constituting the prepreg can easily enter the blind hole. , corrodes the hole wall and affects the electrical performance of the entire printed circuit board

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