Diode structure for reducing anode hole injection
A hole injection and diode technology, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as large dynamic loss, increased leakage, and increased contact resistance, achieving compact structure, reducing dynamic loss, and reducing hole injection. amount of effect
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[0012] The present invention will be further described below in conjunction with specific drawings and embodiments.
[0013] Such as figure 2 As shown: in order to effectively reduce the dynamic loss of the diode by reducing the anode hole injection, the present invention includes a semiconductor substrate, which includes a P conductive region 2 and an N conductive region 3 for forming a PN junction; in the P An N+ region 5 with a doping concentration higher than that of the N conductive region 3 is disposed between the conductive region 2 and the N conductive region 3 .
[0014] The semiconductor substrate includes a silicon substrate. An anode metal 1 for ohmic contact with the P conductive region 2 is arranged on the front of the semiconductor substrate, and a cathode metal 4 for ohmic contact with the N conductive region 3 is arranged on the back of the semiconductor substrate.
[0015] Specifically, the material of the semiconductor substrate may be silicon, the upper s...
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