Method for adhesively connecting target and backboard

A connection method and target technology, which are applied in metal processing, metal processing equipment, manufacturing tools, etc., can solve the problems of difficult target welding operation, increased leveling process, large thermal stress, etc., so as to avoid thermal deformation and meet the Connection requirements, effect of low connection temperature
CN104690487AInactive Publication Date: 2015-06-10GRIKIN ADVANCED MATERIALS
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
GRIKIN ADVANCED MATERIALS
Publication Date
2015-06-10
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention belongs to the technical field of manufacturing of targets, and particularly relates to a method for adhesively connecting a target and a backboard. The method comprises the following steps: providing the target and the backboard; processing an adhesion surface of the target and the backboard; evenly coating and adhering required organic glue on the adhesion surface of the target and the backboard; adhering the target and the backboard, and using a normal-temperature solidifying or low-temperature solidifying mode to guarantee reliable adhesion. The organic glue is used in adhesion to achieve the reliable connection of the target at the normal temperature or low temperature, the excellent thermal conductivity and electric conductivity and the enough connection strength are guaranteed in the sputtering process of the target, meanwhile, the connection temperature is reduced, so that the problems of target fragmentation, deformation and the like possibly caused by high-temperature heating are avoided, the requirement of connection of the special target at the normal temperature is met, meanwhile, the operation difficulty is lowered, and the yield is improved.
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Description

technical field

[0001] The invention belongs to the technical field of target material manufacturing, and in particular relates to an adhesive connection method between a target material and a back plate. Background technique

[0002] Sputtering coating is a common process in the manufacture of chips and devices such as integrated circuits, flat-panel displays, and solar cells. The sputtering target assembly is usually composed of a target that meets the sputtering requirements and a backplane. The back plate has a certain strength, provides support when the target assembly is installed on the sputtering machine, and has good thermal and electrical conductivity.

[0003] At present, the main connection methods between the target and the backplane are mechanical connection and welding. Among them, it is difficult to be completely dense on the butt surface that mechanically connects the target and the backplane, and the existing gaps will lead to a decrease in the bonding str...

Claims

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