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High-performance double-bond-containing epoxy resin/liquid rubber adhesive

A technology of epoxy resin and liquid rubber, which is applied in the direction of modified epoxy resin adhesives, rubber-derived adhesives, carboxyl rubber adhesives, etc., can solve the problems of sulfur rarely reported, and achieve the effect of high bonding strength

Pending Publication Date: 2015-06-10
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] Although vulcanizing agents such as sulfur are widely used in the rubber industry, there are few reports on their application in epoxy resin curing.

Method used

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  • High-performance double-bond-containing epoxy resin/liquid rubber adhesive
  • High-performance double-bond-containing epoxy resin/liquid rubber adhesive
  • High-performance double-bond-containing epoxy resin/liquid rubber adhesive

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0037] The present invention is illustrated below in conjunction with specific examples, but is not limited to the following examples.

[0038] Mix 100 parts of epoxy resin containing double bonds, 0-100 parts of liquid rubber, 10-60 parts of epoxy resin curing agent, 3-20 parts of vulcanizing agent, and 0-8 parts of vulcanization accelerator. Mechanically stir evenly.

[0039] Embodiment 1-7 is the embodiment of diallyl bisphenol A epoxy resin (DADGEBA), liquid acrylonitrile-butadiene rubber (NBR) and curing system, and concrete implementation formula is listed in table 1.

[0040] All liquid rubbers and curing systems containing double bonds and epoxy rings, all unsaturated double bonds described above in the present invention can replace the diallyl bisphenol A epoxy resin (DADGEBA ), liquid nitrile rubber (NBR) and curing systems.

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PUM

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Abstract

The invention discloses a high-performance double-bond-containing epoxy resin / liquid rubber adhesive, belonging to the technical field of adhesives. The epoxy resin refers to an epoxy resin containing an epoxy ring and unsaturated double bonds; the rubber refers to liquid rubber containing unsaturated bonds; and a curing system comprises a general epoxy resin curing agent, a vulcanizing agent and a vulcanization accelerator. The preparation method comprises the following steps: mixing 100 parts of epoxy resin containing double bonds, 0-100 parts of liquid rubber, 10-60 parts of an epoxy curing agent, 3-20 parts of a vulcanizing agent and 0-8 parts of a vulcanization accelerator according to the ratio, and mechanically and uniformly stirring at normal temperature or in a heating mode, wherein the curing temperature is 140-200 DEG C, and the curing time refers to 2-4 hours. The adhesive disclosed by the invention can serve as a metal and rubber adhesive and has high bonding strength.

Description

technical field [0001] The invention relates to a high-performance double bond-containing epoxy resin / liquid rubber adhesive, which belongs to the technical field of adhesives. Background technique [0002] Adhesives are natural or synthetic, organic or inorganic substances that connect two or more parts or materials together through interface adhesion and material cohesion. [0003] Because epoxy resin has the advantages of high bonding strength, wide bonding surface, low shrinkage, good stability, high mechanical strength, and good processability, epoxy resin has become one of the most important thermosetting resins, and its consumption fields are mainly It is distributed in coatings, electronics, composite materials, construction, etc. Among them, coatings and electronics are the two largest consumption areas of epoxy resin. [0004] The epoxy resins that have been commercialized are generally glycidyl ether type, glycidyl amine type, glycidyl ester type, etc. In order t...

Claims

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Application Information

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IPC IPC(8): C09J163/10C09J109/02C09J113/00C09J115/00C09J109/00C09J133/04C09J109/06C09J11/06
Inventor 张军营贾春花程珏
Owner BEIJING UNIV OF CHEM TECH
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