Measurement Method for Automatically Adjusting Sampling Inspection Frequency According to Integrated Circuit Process Capability Index

Abstract

The invention discloses a measurement method for automatically adjusting the sampling frequency according to the integrated circuit process capability index. An operation module of the process capability index is embedded behind each different process module of the production execution system, and connected to a server for controlling product measurement. The calculation module collects process measurement data according to the set time period, calculates the process capability index, and transmits the obtained calculation results to the server. The server automatically adjusts the product sampling frequency according to the defined corresponding to different process capability indexes. The frequency of sampling inspections for product testing can be fed back to the production execution system; when the process capability index drops, the frequency of sampling inspections for measurement can be automatically increased, and when the index of process capability returns to a reasonable level, the frequency of sampling inspections for measurement can be automatically reduced. The measurement resources are efficiently allocated to the most needed process, so that cost and production risk can be effectively controlled to the greatest extent.

Description

technical field [0001] The invention relates to the technical field of semiconductor integrated circuit detection, and more specifically, to a measurement method that can automatically adjust the sampling frequency according to the level of the integrated circuit process capability index. Background technique [0002] The manufacture of integrated circuits is a very complex process, mainly including several major process modules such as photolithography, etching, film growth, ion implantation and cleaning. In actual production, in order to detect abnormal problems in the production process in time, a variety of measuring equipment is often equipped to measure such as graphic size, thickness, alignment, etc. [0003] see figure 1 , figure 1 It is a schematic flow chart of the production and operation of the existing integrated circuit process. Its operation process is as follows figure 1 As shown, corresponding measuring devices 4 , 5 and 7 are provided between process fl...

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Problems solved by technology

[0007] However, because the current process measurement system cannot identify the process capability, the process with better process (higher Cpk) may measure too much product, wasting a lot of measurement resources; while the process with poorer process (Cpk Low) the measurement of the product is too small, which increases the risk of production

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