Object dropping impact mitigation device

A falling and easing technology, applied in the directions of transportation and packaging, loading/unloading, electrical components, etc., can solve the problems of long conveying path, time-consuming, large-scale installation, etc., to reduce impact force, reduce kinetic energy, and simple structure. Effect
CN104703897AActive Publication Date: 2015-06-10MURATA MFG CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
MURATA MFG CO LTD
Publication Date
2015-06-10

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Abstract

A dropping impact mitigation device that mitigates the dropping impact of a falling object (C), having a plurality of filters (10-18) having provided stretched in parallel therein a plurality of wires (10b-18b) having intervals therebetween through which an object can pass, said filters being combined in the vertical direction in layers such that the filter wire positions differ vertically. When an object is dropped on to the filters, the object collides with one of the filter wires, the impact force is lessened by the deformation of the wire, and the object can readily pass between the wires, therefore the frequency with which said object collides with subsequent objects can be lowered, and breakages or fragmenting of the objects can be prevented.
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Description

technical field

[0001] The invention relates to a falling impact mitigating device for alleviating the falling impact of a free-falling object (such as patch components or particles, etc.), and suppressing and preventing the object from being damaged or deformed. The object in the present invention refers to a solid object that may be cracked, damaged, or deformed by a drop impact exceeding a specified value, and its raw material or application is not limited. Background technique

[0002] Conventionally, when transferring chip components such as multilayer ceramic capacitors in the manufacturing process, it was sometimes necessary to transfer the chip components from a transfer line at a certain height to another transfer line at a lower height. In this case, conventionally, the method of transporting the chip components by sliding them along a slider such as a chute is used, but in order to slide above a predetermined height, the chute itself becomes large, and the horizon...

Claims

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