Clamp for thermal resistance test of SMD packaged semiconductor device

Abstract

The invention discloses a clamp for a thermal resistance test of a SMD packaged semiconductor device and relates to the technical field of semiconductor testing. The clamp comprises a metal base, a PCB, an insulated locating block and a compressing block. A groove is formed in the metal base. The PCB circuit is arranged in the groove. The insulated locating block is arranged on the PCB. The insulated locking block is provided with a locating containing hole matched with the tested SMD device. The compressing block capable of downwards compressing a tested SMD device is arranged on the insulated locating block. A thermocouple probe containing hole corresponding to the electrode of the tested SMD device in position is formed in the bottom of the groove. Two electrode wiring holes are formed in the side faces of the groove. Two electrodes enabling pins of the tested SMD device to be connected with electrode wiring holes are arranged on the PCB. The clamp can guarantee that the good thermal conductivity between the tested SMD device and a constant-temperature platform is achieved, the temperature of a shell can be easily controlled within a required range, it is also guaranteed that the electrodes of the tested SMD device are insulated from one another, and normal operation of the test is guaranteed.

Description

technical field [0001] The invention relates to the technical field of semiconductor testing. Background technique [0002] The thermal characteristics of semiconductor devices are one of the important contents in reliability design. In order to ensure the reliability of the device in use, the structural design of the device should consider the heat dissipation characteristics of the device, and the quantitative calculation of these designs needs to be based on the thermal resistance parameters of the device. Therefore, the thermal resistance of a semiconductor device is an important parameter reflecting the thermal characteristics of the device. [0003] The resistance encountered by heat on the heat conduction path is thermal resistance. It is defined as the ratio of the temperature difference on the heat conduction path to the power consumption. The thermal resistance of the device junction to the case is the thermal resistance between the heat source junction of the c...

AI Technical Summary

Problems solved by technology

[0004] For semiconductor devices packaged in SMD (Surface Mount Devices, Surface Mount Devices), the three electrodes are all located on the bottom of the device and on the same plane. Since the part with a higher temperature of the casing is the bottom surface of the lead-out electrode during operation, the control casing When the temperature is high, it is necessary to stick the electrode surface to the temperature control platform and the thermocouple probe, but the temperature control platform is made of metal. If the device is directly attached to the temperature control platform, it will inevitably fail to test due to the short circuit of the electrodes.

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