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2results about How to "Avoid electrical connection" patented technology

A device with heat dissipation function for lithium battery pack

This invention relates to the field of lithium battery heat dissipation technology, specifically disclosing a heat dissipation device for lithium battery packs, comprising a support plate and a top plate. The support plate and the top plate are arranged longitudinally symmetrically in parallel. Multiple sets of coaxially corresponding mounting holes 1 and 2 are arrayed along the length direction on their opposite end faces. Hollow sealing rings are fixedly installed on the inner walls of both mounting holes 1 and 2. Two symmetrically arranged side plates 1 and 2 are fixedly connected to the two side edges of the support plate and the top plate. The support plate, the top plate, the side plates 1 and 2 together form a cavity structure for accommodating the lithium battery pack and heat dissipation components. Several fan support frames are arrayed along the length direction of the side plates 1 facing the inner side of the cavity, and each of the fan support frames is equipped with a corresponding heat dissipation fan. The air outlet direction of the heat dissipation fan faces the inner cavity. This invention addresses the problem of the single heat dissipation function of lithium batteries.
Owner:JIANGSU GAOTAI NEW ENERGY TECHNOLOGY CO LTD

Display substrate, manufacturing method and display device

ActiveCN115775818Bavoid short circuitAvoid circuit breakageElectrical conductorDisplay device
The application provides a display substrate and a manufacturing method and a display device. The display substrate comprises a back plate, a front body layer, and a display chip. The back plate is provided with a driving circuit. The front body layer is arranged on the back plate and comprises a conductor unit, a void and a front body. The conductor unit and the void are arranged in the front body. The display chip is arranged on the front body layer. Electrodes of the display chip are electrically connected to corresponding pads on the driving circuit through the conductor units. The application can improve the short circuit or open circuit phenomenon of the display chip caused by the warping of the transfer substrate.
Owner:CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD