204results about How to "Avoid electrical connection" patented technology

A resistive switching device. The device includes a first electrode comprising a first metal material overlying the first dielectric material and a switching material comprising an amorphous silicon material. The device includes a second electrode comprising at least a second metal material. In a specific embodiment, the device includes a buffer material disposed between the first electrode and the switching material. The buffer material provides a blocking region between the switching material and the first electrode so that the blocking region is substantially free from metal particles from the second metal material when a first voltage is applied to the second electrode.

A circuit interrupting device having a reverse wiring protection function is disclosed. The circuit interrupting device includes a housing having a cover and a base, a mounting plate, and an electrical component mounting member, a pair of input hot and neutral conductors and a pair of output hot and neutral conductors, a differential transformer for detecting a leakage current, a disconnecting mechanism for connecting and disconnecting the output conductors to and from input conductors, and a mechanism for preventing reverse wiring, which includes a coil connected to the input hot and neutral conductors and a moveable piece that moves when the coil is energized. The input and output conductors are electrically connected only when the coil is energized by correctly connecting the power wires to the input conductors of the device. This device thus provides both leakage current protection and reverse wiring protection that protects against incorrect wiring during installation.

The present invention relates to a thin film solar cell, in particular in strip-like farm, a photovoltaic string assembly comprising at least two solar cells according to the invention, a method of manufacturing a solar cell according to the Invention, a method of electrically connecting at least two solar cells according to the invention and a method of producing a photovoltaic string assembly comprising the solar cells of the invention.

The present invention relates to a power tool with battery power supply comprising a main body and a detachable battery package which are connected with each other via a securing frame and a locking assembly. The securing frame includes a guiding device, an locking/unlocking button located on one of the main body and the battery package. An electrical connection is provided between a motor in the main body and the battery package, and includes a plurality of electrode connectors and corresponding electrode contact tabs. A mechanism for creating a non-mechanical force is located between the main body and the battery package for pushing the battery package out of the securing frame. With such a mechanism, when the battery package is required to be replaced by another one or detached for charging, it is merely necessary to press the unlocking button downward, and the battery package then automatically slides out of the securing frame via the effect of the force so as to facilitate detaching the battery package from the main body of the power tool.

A power connection apparatus of a vehicle is provided that includes a pair of substantially flat electrical conductor strips each having a first end and a second end. The first ends are adapted to be electrically coupled to integrated heater conductors in an automobile glazing. A film forms a protective coating over an intermediate section of the pair of electrical conductor strips. The film insulates and maintains a spaced relationship between the pair of substantially flat electrical conductors. A pair of wires is electrically coupled to the second ends. A first protective overmold seal is formed over the second ends of the pair of substantially flat electrical conductor strips for sealing the electric coupling of the second ends of electrical conductor strips and the wires.

An energy storage system including a battery cell, a tray for receiving the battery cell, and a rack for receiving the tray. The rack includes a connector unit. The connector unit is configured to connect to the tray inserted into the rack and to vibrate together with the tray when the tray vibrates due to, for example, an earth quake or external impact applied to the rack, thereby preventing an electric connection between the tray and the connector unit from being broken.

The portable radio multichannel electrocerebral data acquiring instrument consists of one electrocerebral data acquiring device and one electrocerebral data receiving device communicating mutually in radio communication mode. The electrocerebral data acquiring device includes multichannel electrocerebral electrodes, a pre-amplifier circuit, a post-amplifier circuit, a filter circuit, an A/D converter circuit, a monolithic computer and a radio communication sending circuit; and the electrocerebral data receiving device includes a radio communication receiver circuit, a monolithic computer based on USB interface and a computer. The electrocerebral signal is first amplified, filtered, A/D converted and sent, and then received and transmitted to the computer for real-time analysis and treatment. The present invention has no electric connection between the testee and the computer, and is flexible, safe and reliable.

In a spectroscopy module 1, a light detecting element 5 having a light passing hole 50 is used. Therefore, it is possible to prevent the relative positional relationship between the light passing hole 50 and a light detecting portion 5a of the light detecting element 5 from deviating. Moreover, the light detecting element 5 is electrically connected to a wiring 9 formed on a front plane 2a of a substrate 2 by face-down bonding, and a resin layer 79 is formed as an underfill resin between the substrate 2 and the light detecting element 5. Therefore, it is possible to improve the fixing strength between the substrate 2 and the light detecting element 5. Additionally, before the resin layer 79 is formed, a resin layer 78 is formed along a guide portion 77 that surrounds the passing hole 50. Thus, the resin layer 79 is prevented from penetrating into the light passing hole 50, which makes it possible to make a light be appropriately incident into the substrate 2.

A semiconductor device includes a substrate having an active region defined by a device isolation layer and at least a gate trench linearly extending in a first direction to cross the active region, the active region having a gate area at a bottom of the gate trench and a junction area at a surface of the substrate. The device further may include a first conductive line filling the gate trench and extending in the first direction, the first conductive line having a buried gate structure on the gate area of the active region. The device also may include a junction including implanted dopants at the junction area of the active region, and a junction separator on the device isolation layer and defining the junction. The junction separator may be formed of an insulative material and have an etch resistance greater than that of the device isolation layer.

The invention provides an isolating pillar, a manufacturing method of the isolating pillar, a display panel and a display device and relates to the field of display technologies. The problem that every two adjacent strip-shaped electrodes in a plurality of first strip-shaped electrodes formed by an existing isolating pillar are likely to be connected is solved. The isolating pillar comprises a first material pattern and a second material pattern located on the first material pattern. The first material pattern comprises an upper surface, a lower surface, a first isolating side face and a second isolating side face, wherein the upper surface is opposite to the lower surface, and the first isolating side face and the second isolating side face are opposite and are located between the upper surface and the lower surface. The second material pattern comprises an upper surface and a lower surface which are opposite to each other, the upper surface of the first material pattern makes direct contact with the lower surface of the second material pattern, and the projections, in the plane where the lower surface of the second material pattern is located, of the first isolating side face and the second isolating side face of the first material pattern are located among edges of the lower surface of the second material pattern. The isolating pillar is applied to the PMOLED display panel and a manufacturing method thereof.

An image forming apparatus, comprising: a frame body to which an attachment unit is detachably attachable, the attachment unit being configured to have an input electrode and to be used for image formation on a recording medium; a power source substrate configured to have an output electrode for outputting a voltage and to be attached to the frame body from an opposite side with respect to a side on which the attachment unit is attached; and a connection electrode configured to electrically connect the output electrode to the input electrode of the attachment unit, wherein the frame body comprises an insertion part into which the connection electrode is inserted from an opposite side with respect to a side on which the power source substrate is attached.

The invention discloses an image sensor module and a forming method of the image sensor module. The image sensor module comprises a PCB substrate, a metal layer, an image sensing chip, a signal processing chip and welding protrusions. The PCB substrate is provided with a hole penetrating through the PCB substrate, the metal layer is arranged on the surface of the PCB substrate, the image sensing chip is inversely arranged above the PCB substrate, the image sensing chip is provided with an image induction area and a bonding pad surrounding the image induction area which is arranged above the hole, the bonding pad is electrically connected with the metal layer, the signal processing chip is inversely arranged above the PCB substrate, the signal processing chip is electrically connected with the metal layer, and the welding protrusions are arranged on the surface of the metal layer. The packaging performance of the image sensor module is improved, and the production cost of the image sensor module is reduced.

An extension rod for a power tool may include a plurality of rod portions, with a first connector and a second connector connecting two of the rod portions. The second connector has a sleeve and a primary fastener. The first connector has a guide rod sized for insertion into the sleeve. The first connector also has a secondary fastener engaging with the primary fastener. A first guide ring, a second guide ring, and a third guide ring are located between the guide rod and the sleeve. The first guide ring, the second guide ring, and the third guide ring each include respective conical faces. At least one of the first, second, and third guide rings defines a notch.

An integrated circuit chip includes first and second electrode terminals electrically connected to an internal circuit, and a dummy bump arranged between the first and second electrode terminals on a back surface thereof. A wiring pattern includes first lines electrically connected to the first electrode terminals below the back surface of the integrated circuit chip and extend in the direction toward a display region outside the integrated circuit chip, and second lines electrically connected to the second electrode terminals below the back surface of the integrated circuit chip and extend in the direction opposite to the display region outside the integrated circuit chip. The dummy bump is configured to avoid at least one of the electrical connection between the dummy bump and all of the first lines and all of the second lines and the electrical connection between the dummy bump and the internal circuit.

The present invention provides a semiconductor structure and a manufacture method thereof. The manufacture method of the semiconductor structure comprises: providing a first wafer and a second wafer, the first wafer being provided with a first metal layer, the second layer being provided with a second metal layer; forming a first material layer at the surface of the first wafer; forming a second material layer at the surface of the second wafer; performing alignment processing and bonding processing of the first wafer and the second wafer to align the first material layer with the second material layer and contact the surface of the first material layer with the surface of the second material layer; performing heat processing of the first material layer and the second material after the bonding processing to mutually fuse the first material layer and the second layer so that the alignment precision between the first metal layer and the second layer is improved. The surface tension generated by mutually fusing the first material layer and the second material layer is employed to get close the first material layer to the second material layer, so that the alignment precision between the first metal layer and the second layer is improved and the bonding offset is decreased.

The invention relates to a semiconductor component and a sensor component with data transmission devices, for wireless transmission the semiconductor component having a main coupling element and the sensor component having a sensor coupling element. The invention affords the possibility of multiple sensor applications without direct electrical contact between sensor component and semiconductor component, which may have a logic chip.

In a method and an arrangement for powering up a DC distribution system in a hybrid vehicle power train, the power train includes an electric storage system, an internal combustion engine, an electric motor/generator, a clutch device to connect the electric motor/generator to the internal combustion engine, a power electronics unit with a voltage regulator connected to the electric motor/generator, and an electronic control unit for controlling the power train. The electric storage system and the electric motor/generator are connectable to one or more electrical loads for driving the vehicle. The powering up includes initializing internal combustion engine ignition, initializing a diagnostics test of power train components, cranking the internal combustion engine, requesting pre-charge of the electrical loads from the power electronics unit, connecting the electric storage system to the electrical loads when the pre-charge and the diagnostics test are completed, and resuming normal operation for the power electronics unit.