Flexible lining substrate and manufacture method, display substrate and display device

A flexible substrate and display substrate technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of shortened component life, component damage, poor absorption and release, etc., to achieve good absorption The effect of heat and the ability to dissipate

Active Publication Date: 2015-06-24
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, no matter in the process of forming the components on the substrate or in the working state after forming the flexible display panel, the formed components will generate a large amount of heat, and the flexible substrate absorbs and releases heat equally. Not very good, so it is easy to cause excessive heat accumulation on each component, which will shorten the life of the component, or even directly cause damage to the component

Method used

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  • Flexible lining substrate and manufacture method, display substrate and display device
  • Flexible lining substrate and manufacture method, display substrate and display device
  • Flexible lining substrate and manufacture method, display substrate and display device

Examples

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Embodiment 1

[0026] Such as figure 1 As shown, this embodiment provides a flexible substrate 10 , including a flexible substrate 11 and a phase change material 12 disposed in the flexible substrate 11 .

[0027] Those skilled in the art can understand that the phase change material 12 refers to a substance that changes physical properties and provides latent heat as temperature changes. The process of changing physical properties is called a phase change process, and at this time the phase change material 12 will absorb or release a large amount of latent heat. Taking the solid-liquid phase change as an example, when heated to the melting temperature, a phase change from solid to liquid occurs. During the melting process, the phase change material 12 absorbs and stores a large amount of latent heat; when the phase change material 12 cools, The stored heat must be dissipated to the environment within a certain temperature range, and undergo a reverse phase transition from liquid to solid. ...

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Abstract

The invention provides a flexible lining substrate and manufacture method, a display substrate and a display device, belongs to the technical field of display and solves the problems that the heat absorption and radiation capacities of an existing flexible lining substrate are poor. The flexible lining substrate comprises a substrate body and phase change material arranged in the substrate body. The flexible lining substrate has fine heat absorption and radiation capabilities; when the flexible lining substrate is applied to the display substrate, the proper display substrate temperature can be maintained well.

Description

technical field [0001] The invention belongs to the field of display technology, and in particular relates to a flexible substrate substrate and a preparation method thereof, a display substrate, and a display device. Background technique [0002] At present, polyimide (Polyimide, PI) is usually used as the material of the flexible substrate substrate. However, no matter in the process of forming each element on the substrate or in the working state after forming the flexible display panel, the formed elements will generate a large amount of heat, and the flexible substrate absorbs and releases heat equally. Not very good, so it is easy to cause excessive heat accumulation on each component, which will shorten the life of the component, or even directly cause damage to the component. Contents of the invention [0003] The technical problems to be solved by the present invention include, aiming at the above-mentioned problems existing in the existing flexible substrates, p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L21/77
CPCH01L27/1218H01L27/1262
Inventor 李钊
Owner BOE TECH GRP CO LTD
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