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Heat exchange unit

A heat exchange unit, heat exchanger technology, applied in the direction of electrical components, thermoelectric devices using only the Peltier or Seebeck effect, electric solid devices, etc., to optimize surface roughness, improve adhesion, and prevent cracks and cracks.

Inactive Publication Date: 2010-08-04
YAMAHA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This defect occurs repeatedly even when the insulating resin layer is hardened by applying varnish resin

Method used

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Embodiment Construction

[0039] The invention will be described in more detail by way of example with reference to the accompanying drawings.

[0040] 1. The first embodiment

[0041] will refer to Figures 1A to 1C A heat exchange unit 10 according to a first embodiment of the present invention is described. Such as Figure 1CAs shown, the heat exchanging unit 10 includes a first exchanger (used as a heat sink for heat dissipation or endothermic air cooling) 11, an insulating layer 12 formed on the surface of the first heat exchanger 11, an insulating layer arranged on the insulating layer The lower electrode on 12 (used as a heat dissipation or heat absorption electrode) 13, a plurality of thermoelectric elements 14 connected to the lower electrode 13, the upper electrode connected to the thermoelectric element 14 (used as a heat dissipation or heat absorption electrode) 15, the second A second heat exchanger (used as a cooling source for heat dissipation or heat absorption air cooling) 16 and an...

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PUM

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Abstract

A heat exchange unit is constituted of a thermoelectric module and a heat exchanger. The thermoelectric module includes an upper electrode, a lower electrode, and a plurality of thermoelectric elements interposed between the upper electrode and the lower electrode, wherein the heat exchanger composed of aluminum or aluminum alloy having high thermal conductivity is attached to the upper electrode and / or the lower electrode via an insulating layer. The surface roughness of the heat exchanger adjoined to the insulating layer is controlled to be less than 4.7 [mu]m and greater than 0.1 [mu]m. This prevents cracks and fractures from being formed in the insulating layer, which is thus improved in adhesion with the heat exchanger. Thus, it is possible to demonstrate high heat-absorption / dissipation performance and high reliability in the heat exchange unit due to a reduced thermal resistance between the thermoelectric module and the heat exchanger.

Description

technical field [0001] The invention relates to a heat exchange unit, which includes a thermoelectric module, in which thermoelectric elements of different types are alternately arranged and electrically connected in series between heat-absorbing electrodes and heat-dissipating electrodes. Background technique [0002] Generally, thermoelectric modules have been developed and designed such that thermoelectric elements composed of P-type semiconductors and N-type semiconductors are alternately arranged and connected in series and held between heat-absorbing electrodes and heat-dissipating electrodes via metals such as brazing metals. . Various documents disclose a heat exchange unit in which a heat exchanger is coupled to a heat sink electrode or a heat sink electrode of a thermoelectric module in order to improve heat dissipation efficiency. [0003] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2003-332642 [0004] Patent Document 2: Japanese U...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/04H01L35/30
CPCH01L2924/0002H01L23/427H01L35/30H01L23/38H10N10/13H01L2924/00
Inventor 堀尾裕磨
Owner YAMAHA CORP
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