Flexible circuit board and manufacturing method thereof
A manufacturing method and circuit board technology, which are applied in the directions of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve the problems of peeling, bulging, and weak bonding force of the copper layer.
Active Publication Date: 2017-08-22
AVARY HLDG (SHENZHEN) CO LTD +1
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Problems solved by technology
However, for the rigid-flex board of the multi-layer soft board with the inner layer partially exposed, because the exposed inner layer soft board surface is made of high molecular polymer materials such as PI or LCP, the surface of the material and the copper layer in the electroplating process Therefore, in the electroless copper plating process, it is easy for the chemical solution to penetrate into the bottom of the copper layer, resulting in raised blisters, and even some of the copper layer will peel off and contaminate other process baths
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[0017] An embodiment of the present invention provides a method for manufacturing a flexible circuit board 10, including steps:
[0018] For a first step, see figure 1 , providing a multilayer circuit substrate 11 .
[0019] In this embodiment, the multilayer circuit substrate 11 includes a flexible circuit board 12 and a rigid circuit substrate 13, and the flexible circuit substrate 12 includes a base layer 110, a first conductive circuit layer disposed on opposite sides of the base layer 110 111, the second conductive circuit layer 112, and the first covering layer 121 and the second covering layer 122 respectively formed on the first conductive circuit layer 111 and the second conductive circuit layer 112. The rigid circuit substrate 13 includes a first rigid substrate 131 and a second rigid substrate 132, the first rigid substrate 131 and the second rigid substrate 132 cover the first covering layer 121 and the second covering layer 122 respectively, so The first rigid s...
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The invention provides a flexible circuit board which comprises a flexible circuit substrate, a hard circuit substrate and a high-polymer material layer. The flexible circuit substrate comprises a substrate layer, a first conductive circuit layer formed on the substrate layer and a first covering layer formed on the first conductive circuit layer. The hard circuit substrate comprises a first hard substrate body. The first hard substrate body partially presses the first covering layer. The region, covered with the first hard substrate body, of the flexible circuit substrate is a hard region. The region, without being covered by the hard substrate body, of the flexible circuit substrate is a flexible region. The high-polymer material layer is formed on the first covering layer of the soft region. The invention further relates to a flexible circuit board manufacturing method.
Description
technical field [0001] The invention relates to a flexible circuit board and a manufacturing method thereof. Background technique [0002] At present, after lamination of multi-layer flexible boards or rigid-flex boards and drilling of the outer layers, copper plating must be used to conduct the outer layer copper foil and the inner layer copper foil lines. However, for the rigid-flex board of the multi-layer soft board with the inner layer partially exposed, because the exposed inner layer soft board surface is made of high molecular polymer materials such as PI or LCP, the surface of the material and the copper layer in the electroplating process Therefore, in the electroless copper plating process, it is easy for the chemical solution to penetrate into the bottom of the copper layer, resulting in raised blisters, and even some of the copper layer will peel off and contaminate other process baths. Contents of the invention [0003] In view of this, it is necessary to pr...
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IPC IPC(8): H05K1/02H05K3/00
Inventor 许凯翔李克伦黄黎明
Owner AVARY HLDG (SHENZHEN) CO LTD