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Preparation method of epoxy alloy material

A technology of alloy material and epoxy alloy, which is applied in the field of preparation of epoxy alloy material, can solve the problems of limitation, failure to meet expectations, limited temperature adjustment effect, etc.

Inactive Publication Date: 2015-07-01
TORAY ADVANCED MATERIALS RES LAB CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the regulating effect of temperature alone is limited
sometimes doesn't live up to expectations
Even with the adjustment of curing agents with different reaction speeds, there are limitations

Method used

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  • Preparation method of epoxy alloy material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] 5 parts by mass of polyethersulfone (PES) and 70 parts by mass of ethylene glycol glycidyl ether (EGDGE) were heated and dissolved evenly, and after cooling to room temperature, 25 parts by mass of 4,4'-diaminodiphenylmethane (DDM) were added And stir evenly, remove the air bubbles, pour into the mold, and pre-cure in the autoclave. Temperature 90°C, pressure 1MPa, curing for 4 hours. It was then post-cured at 130°C for 2 hours.

[0042] Phase separation distance: 1.7μm

[0043] Impact strength (Charpy): 4.7KJ / m 2 .

Embodiment 2

[0045] 5 parts by mass of polyethersulfone (PES) and 70 parts by mass of ethylene glycol glycidyl ether (EGDGE) were heated and dissolved evenly, and after cooling to room temperature, 25 parts by mass of 4,4'-diaminodiphenylmethane (DDM) were added And stir evenly, remove the air bubbles, pour into the mold, and pre-cure in the autoclave. Temperature 90°C, pressure 3MPa, curing for 4 hours. It was then post-cured at 130°C for 2 hours.

[0046] Phase separation distance: 736nm

[0047] Impact strength (Charpy): 5.2KJ / m 2 .

Embodiment 3

[0049] 5 parts by mass of polyethersulfone (PES) and 70 parts by mass of ethylene glycol glycidyl ether (EGDGE) were heated and dissolved evenly, and after cooling to room temperature, 25 parts by mass of 4,4'-diaminodiphenylmethane (DDM) were added And stir evenly, remove the air bubbles, pour into the mold, and pre-cure in the autoclave. Temperature 90°C, pressure 6MPa, curing for 4 hours. It was then post-cured at 200°C for 2 hours.

[0050] Phase separation distance: 350nm

[0051] Impact strength (Charpy): 5.7KJ / m 2 .

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Abstract

The invention discloses a preparation method of an epoxy alloy material. Aliphatic epoxy resin, a thermoplastic polymer and a curing agent capable of reacting with the epoxy resin are blended and then are cured and molded under stepwise temperature control and high pressure so that cured resin with a phase separation distance less than 2 micrometers is obtained. Through pressure adjustment, phase distance and phase morphology can be adjusted, and the epoxy polymer alloy with microphase separation characteristic can be effectively controlled and prepared. The preparation method has industrial production feasibility and realizes adjustment of microphase separation only by a temperature.

Description

technical field [0001] The invention belongs to the field of polymer alloy materials, and in particular relates to a preparation method of epoxy alloy materials. Background technique [0002] Epoxy resin is an excellent thermosetting resin, because of its good physical properties, electrical insulation properties, chemical corrosion resistance, heat resistance and adhesive properties, epoxy resins are used in coatings, floors, electronic packaging materials, adhesives to In the field of fiber-reinforced composite materials, from building construction, electronic power, sports equipment to aerospace and other fields, epoxy resin has shown extensive and important applications. Simple epoxy resins generally have low molecular weight, are liquid or viscous liquids, and have almost no mechanical properties. However, after adding the curing agent, due to the formation of a three-dimensional network cross-linked structure, its physical and mechanical properties, dielectric propert...

Claims

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Application Information

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IPC IPC(8): C08G59/50C08L63/00C08L81/06C08L33/12
Inventor 张艳红欧阳芬河野俊司
Owner TORAY ADVANCED MATERIALS RES LAB CHINA
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