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Preparation method of hollow silica/polyacrylate composite film

A polyacrylate and silicon dioxide technology, which is applied in the field of preparation of polyacrylate composite films, can solve the problems of poor mechanical properties, poor alkali resistance, general thermal insulation effect, etc., and achieves improved tensile strength, improved alkali resistance, The effect of improving mechanical properties and alkali resistance

Active Publication Date: 2018-05-15
SHAANXI UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to its structural limitations, polyacrylate films still have some defects, such as poor alkali resistance, general heat preservation effect, and medium mechanical properties. In order to broaden its application range, it is of great significance to improve these properties of polyacrylate films.

Method used

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  • Preparation method of hollow silica/polyacrylate composite film

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preparation example Construction

[0015] The preparation method of the hollow silicon dioxide / polyacrylate composite film that the present invention relates to comprises the following steps:

[0016] (1) Disperse 0.48-0.552g of hollow silica particles (hydrophilic) in 10-15mL of distilled water, and ultrasonically treat them for 5-10min to obtain a stable suspension of hollow silica particles. ~30.0g of polyacrylate emulsion with a solid content of 40~50% was mixed and stirred for 5~8 hours, and the obtained product was hollow silica / polyacrylate composite emulsion;

[0017] (2) Weigh 12-20g of the hollow silica / polyacrylate composite emulsion to form a film in an 8cm*8cm petri dish to obtain a hollow silica / polyacrylate composite film.

[0018] In step (1), the hollow particle diameter of the hollow silica particles is between 150nm and 500nm, and the wall thickness is between 10nm and 30nm;

[0019] In step (2), the film forming temperature is between 15°C and 30°C.

Embodiment 1

[0021] (1) Disperse 0.48g of hollow silica particles in 15mL of distilled water and ultrasonically treat them for 5min to obtain a stable suspension of hollow silica particles. The acrylate emulsion was mixed and stirred for 8 hours, and the resulting product was hollow silica / polyacrylate composite emulsion;

[0022] (2) Weigh 12g of hollow silica / polyacrylate composite emulsion to form a film in an 8cm*8cm petri dish to obtain a hollow silica / polyacrylate composite film.

[0023] In step (1), the hollow particle diameter of the hollow silica particles is 500nm, and the wall thickness is 10nm;

[0024] In step (2), the film forming temperature is 30°C.

Embodiment 2

[0026] (1) Disperse 0.516g of hollow silica particles in 12mL of distilled water and ultrasonically treat them for 7 minutes to obtain a stable suspension of hollow silica particles. The acrylate emulsion was mixed and stirred for 6 hours, and the resulting product was hollow silica / polyacrylate composite emulsion;

[0027] (2) Weigh 16g of hollow silica / polyacrylate composite emulsion to form a film in an 8cm*8cm petri dish to obtain a hollow silica / polyacrylate composite film.

[0028] In step (1), the hollow particle diameter of the hollow silica particles is 320nm, and the wall thickness is 20nm;

[0029] In step (2), the film forming temperature is 22°C.

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Abstract

The invention relates to a method for preparing a hollow silicon dioxide / polyacrylate composite film. Hollow silica microspheres not only have a hollow structure, but also have the properties of silica, adding them to polyacrylate can improve the hygienic performance and mechanical properties of polyacrylate film. In the present invention, hollow silica particles are dispersed in distilled water, and a stable suspension of hollow silica particles is obtained by ultrasonic treatment, and mixed with polyacrylate emulsion at room temperature to obtain hollow silica / polyacrylate composite emulsion; placed in a petri dish In the process of film formation, the hollow silica / polyacrylate composite film is obtained. The invention utilizes the internal cavity of the hollow silicon dioxide particles to store air to improve the thermal insulation of the polyacrylate film, and utilizes the rigidity and stability of the silicon dioxide to improve the mechanical properties and alkali resistance of the polyacrylate film.

Description

technical field [0001] The invention relates to a preparation method of a polyacrylate composite film, in particular to a preparation method of a hollow silica / polyacrylate composite film. Background technique [0002] Hollow silica microspheres are a class of materials with a unique shape, with particle sizes ranging from nanometers to micrometers, and have the characteristics of large specific surface area, high melting point, and good stability. Due to its hollow interior, the arbitrary design of sound, light, heat, and mechanical properties can be effectively realized by adjusting the cavity size and wall thickness, and it has broad application prospects in industry. [0003] Polyacrylate emulsions are widely used in coatings, adhesives, leather manufacturing and other fields due to their excellent weather resistance, adhesion, simple production process, and low cost. However, due to the limitation of its structure, polyacrylate film still has some defects, such as poor...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/18C08L33/04C08K9/00C08K7/26C08K3/36
Inventor 鲍艳李淼马建中沈福斌
Owner SHAANXI UNIV OF SCI & TECH