An impact-resistant semiconductor chip packaging structure

Abstract

The invention discloses an impact-resistant semiconductor chip packaging structure, which comprises a semiconductor chip and a substrate, the semiconductor chip is installed on the substrate, foot holes are arranged on the substrate around the semiconductor chip, metal The legs of the wire frame, the wire frame is covered above the semiconductor chip, and the semiconductor chip, the substrate, the foot holes and the wire frame are all covered by an encapsulation material, and the encapsulation material is a mixture of epoxy resin and fiber threads , the technical solution of the present invention solves the abnormal situation of surface protrusions and cracks in the case of sudden changes in high and low temperatures, so that the packaged product can withstand the impact of external forces without mechanical damage, making semiconductor components suitable for application Used in harsh impact environments.

Description

technical field [0001] The invention relates to a semiconductor chip packaging structure, in particular to an impact-resistant semiconductor chip packaging structure. technical background [0002] The traditional semiconductor chip packaging method generally uses high temperature and high pressure to melt the solid packaging material at room temperature and inject it into the mold, and then re-cure quickly (5-50 seconds). During the processing of this packaging method, the packaged product needs to withstand high temperature and pressure. If the product to be packaged cannot withstand high temperature and high pressure, this kind of solid material packaging method cannot be used. Using liquid epoxy packaging materials at room temperature, injecting them into molds at low pressure, and using baking to cure can solve the shortcomings of the packaged materials themselves that are not resistant to high temperature and high pressure, but the glass transition temperature of liquid...

AI Technical Summary

Problems solved by technology

During the processing of this kind of packaging method, the packaged product needs to withstand high temperature and pressure. If the product to be packaged cannot withstand high temperature and high pressure, this kind of solid material packaging method cannot be used.

Using liquid epoxy packaging materials at room temperature, injecting them into molds at low pressure, and using baking to cure can solve the shortcomings of the packaged materials themselves that are not resistant to high temperature and high pressure, but the glass transition temperature of liquid epoxy packaging materials is low. After curing Epoxy packaging materials have low strength and are easily affected by high and low temperature mutations (such as reflow soldering, high and low temperature impact, etc.), and abnormal conditions such as surface protrusions and cracks occur, which affect the packaging quality

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