Manufacturing method of flexible thermo-electric device and manufactured flexible thermo-electric device

A thermoelectric device and device technology, applied in the field of thermoelectric power generation devices, can solve the problems of poor controllability, non-flexible devices, long material preparation cycle, etc., and achieve the effects of releasing thermal stress, broadening application occasions, and bending at a large angle

Active Publication Date: 2015-07-08
FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the current thermoelectric devices are planar rigid, or flexible on one side, or only cut the ceramic substrate to release thermal stress, not really flexible devices
Or it is a flexible device made into a thin film, but the thin film flexible device has high requirements for material deposition and preparation, the material preparation cycle is long and the controllability is poor

Method used

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  • Manufacturing method of flexible thermo-electric device and manufactured flexible thermo-electric device
  • Manufacturing method of flexible thermo-electric device and manufactured flexible thermo-electric device
  • Manufacturing method of flexible thermo-electric device and manufactured flexible thermo-electric device

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Embodiment Construction

[0027] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to specific embodiments and accompanying drawings. However, those skilled in the art know that the present invention is not limited to the accompanying drawings and the following embodiments.

[0028] like figure 1 , 2 , 3, 4, and 5, the preparation method of the flexible thermoelectric device proposed by the present invention includes the following steps:

[0029] (1) According to the application requirements, the size of P-N type semiconductor particles is 4.5×4.5×2.5 (mm), and the thermoelectric device with 49 pairs of P-N semiconductor particles is designed and cut.

[0030] (2) The copper wire mesh 5 is flatly fixed on the lower substrate 6 of the mold, the mask 4 is covered, and the solder "scratch coating" operation on the A side of the device is performed.

[0031] (3) Remove the m...

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Abstract

The invention relates to a manufacturing method of a flexible thermo-electric device and the manufactured flexible thermo-electric device. The method comprises the steps that a red copper wire mesh with high electric conduction performance is adopted as an electrode material, the red copper wire mesh is directly fixed to a die substrate, high-temperature-resisting silica gel is adopted as a flexible substrate to replace a traditional ceramic substrate, P-N thermo-electric particles alternately fall into a grid die device, on the basis of achieving overall welding, line cutting of design patterns is carried out on cold and hot end faces, and each pair of P-N semiconductor thermo-electric particles is of a parallel-connection independent structure in electrology and series-connection thermology; basic curing operation of high-temperature-resisting flexile insulation is carried out on a device achieving adjustable gluing thickness, and the flexible device is obtained. The flexible device can be bent by a large angle, a semiconductor material body is not changed, semiconductor material components obtained after doping modification are not influenced, the application occasion of the thermo-electric device is widened, the device is not restricted to plane occasions any more, and heat stress generated in the work process of the thermo-electric device is released.

Description

technical field [0001] The invention belongs to the technical field of thermoelectric power generation devices, and in particular relates to a preparation method of a flexible thermoelectric device and the prepared flexible thermoelectric device. Background technique [0002] Thermoelectric devices are an important means to realize the application of thermoelectric materials. Thermoelectric devices have many advantages such as small size, light weight, no transmission mechanism, and no pollution release, which make them have good application prospects and advantages in the fields of industrial waste heat recovery, automobile waste heat recovery, space power supply, and civil refrigeration. Most of the current thermoelectric devices are planar rigid, or flexible on one side, or just cut the ceramic substrate to release thermal stress, which are not truly flexible devices. Or it is a flexible device made of a thin film, but the thin-film flexible device has high requirements ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L35/34
Inventor 林紫雄吴立明
Owner FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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