A preparation method of a flexible thermoelectric device and the prepared flexible thermoelectric device

Abstract

The invention relates to a manufacturing method of a flexible thermo-electric device and the manufactured flexible thermo-electric device. The method comprises the steps that a red copper wire mesh with high electric conduction performance is adopted as an electrode material, the red copper wire mesh is directly fixed to a die substrate, high-temperature-resisting silica gel is adopted as a flexible substrate to replace a traditional ceramic substrate, P-N thermo-electric particles alternately fall into a grid die device, on the basis of achieving overall welding, line cutting of design patterns is carried out on cold and hot end faces, and each pair of P-N semiconductor thermo-electric particles is of a parallel-connection independent structure in electrology and series-connection thermology; basic curing operation of high-temperature-resisting flexile insulation is carried out on a device achieving adjustable gluing thickness, and the flexible device is obtained. The flexible device can be bent by a large angle, a semiconductor material body is not changed, semiconductor material components obtained after doping modification are not influenced, the application occasion of the thermo-electric device is widened, the device is not restricted to plane occasions any more, and heat stress generated in the work process of the thermo-electric device is released.

Description

technical field [0001] The invention belongs to the technical field of thermoelectric power generation devices, and in particular relates to a preparation method of a flexible thermoelectric device and the prepared flexible thermoelectric device. Background technique [0002] Thermoelectric devices are an important means to realize the application of thermoelectric materials. Thermoelectric devices have many advantages such as small size, light weight, no transmission mechanism, and no pollution release, making them have good application prospects and advantages in the fields of industrial waste heat recovery, automobile waste heat recovery, space power supply, and civil refrigeration. At present, most thermoelectric devices are planar rigid, or one side is flexible, or the ceramic substrate is only cut to release thermal stress, and they are not really flexible devices. Or it is a flexible device made into a thin film, but the thin film flexible device has high requirement...

AI Technical Summary

Problems solved by technology

Most of the current thermoelectric devices are planar rigid, or flexible on one side, or only cut the ceramic substrate to release thermal stress, not really flexible devices

Or it is a flexible device made into a thin film, but the thin film flexible device has high requirements for material deposition and preparation, the material preparation cycle is long and the controllability is poor

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