A kind of chip carrier board and preparation method thereof
A carrier board and chip technology, which is applied in the field of optoelectronic communication, can solve the problems of poor heat dissipation, difficult processing of glass through holes, and large transmission loss of electrical interconnection lines, etc., and achieve the effects of good heat dissipation performance, excellent shape, and precise size
Active Publication Date: 2017-08-11
NAT CENT FOR ADVANCED PACKAGING CO LTD
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Problems solved by technology
[0004] In view of this, the embodiment of the present invention provides a chip carrier and its preparation method, which solves the problems of large transmission loss of the electrical interconnection circuit of the chip carrier, difficult processing of glass through holes and poor heat dissipation in the prior art.
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[0017] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0018] figure 1 is a schematic structural diagram of a chip carrier provided by an embodiment of the present invention. Such as figure 1 As shown: the chip carrier includes: a silicon carrier 1 and a glass carrier 2; the glass carrier 2 is glued on the silicon carrier 1; the surface of the glass carrier 2 is provided with an electrical interconnection circuit 21; wherein, the glass carrier 2 is provided with an optical path optimization unit array 22 , and the silicon substrate 1 is provided with a via array 11 ; When the chip carrier is in use, the chip 3 can be mounted on the glass carrier 2 to form a circuit connection with the electrical interconnection circuit 21, and the optical path can be formed by inserting an optical fiber into the through-hole array 1...
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The embodiment of the invention provides a chip substrate and a preparation method thereof. The chip substrate and the preparation method thereof solve the problems that in the prior art, for an existing chip substrate, the transmission loss of electrical interconnection circuits is large, machining of glass through holes is difficult, and the heat dissipation performance is poor. The chip substrate comprises a silicon substrate body and a glass substrate body which is adhered to the silicon substrate body, and the surface of the glass substrate body is provided with electrical interconnection circuits; a light path optimization unit array is arranged on the glass substrate body, the silicon substrate body is provided with a through hole array, and light path optimization units of the light path optimization unit array are arranged corresponding to through holes of the through hole array.
Description
technical field [0001] The invention relates to the technical field of photoelectric communication, in particular to a chip carrier board and a preparation method thereof. [0002] technical background [0003] The chips in the existing optical communication module need to be carried on a carrier board, and the transmission and interconnection of photoelectric signals are realized through the electrical interconnection lines and through holes on the carrier board. Chip carriers in the prior art are usually made of silicon or glass materials. However, preparing electrical interconnection lines on a chip carrier made of silicon material will cause relatively large transmission loss. However, if the chip carrier is made of glass material, it is difficult to make through holes with precise size and good shape because the glass material is difficult to process. In addition, the heat dissipation performance of glass material is poor, which is not conducive to the operation of the ...
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IPC IPC(8): G02B6/42
CPCG02B6/4201G02B6/4257
Inventor 薛海韵
Owner NAT CENT FOR ADVANCED PACKAGING CO LTD