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Silicone-modified epoxy resin and synthesis method as well as method for alleviating luminous attenuation with silicone-modified epoxy resin

A technology of epoxy resin and synthesis method, which is applied in the field of materials, can solve the problems of high hygroscopicity and poor flexibility of epoxy resin, and achieve the effects of low cost, easy operation and obvious improvement effect

Inactive Publication Date: 2015-07-22
广州惠利电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Epoxy resin has high hygroscopicity and poor flexibility

Method used

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  • Silicone-modified epoxy resin and synthesis method as well as method for alleviating luminous attenuation with silicone-modified epoxy resin
  • Silicone-modified epoxy resin and synthesis method as well as method for alleviating luminous attenuation with silicone-modified epoxy resin
  • Silicone-modified epoxy resin and synthesis method as well as method for alleviating luminous attenuation with silicone-modified epoxy resin

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preparation example Construction

[0025] A kind of synthetic method of organosilicon modified epoxy resin, comprises the steps:

[0026] (1) In an oil bath at 80-120°C, add a double bond-containing epoxy monomer to the phenyl hydrogen-containing silicone oil, and add a catalyst; the double bond-containing epoxy monomer is methacrylic acid shrinkage One or more of glycerol esters, 3,4-epoxycyclohexyl methyl methacrylate, and 1,2-epoxy-4-vinylcyclohexane. The hydrogen content of the phenyl hydrogen-containing silicone oil is 0.7%. The catalyst is a platinum catalyst, the content is 1000PPM-5000PPM, and the added amount is 5% of the total amount. The weight ratio between the phenyl hydrogen-containing silicone oil and the epoxy monomer containing double bonds is 1:1.

[0027] (2) Stir while adding dropwise, and the dropwise addition time is controlled at about 2-3h;

[0028] (3) Continue to react after dripping, and detect repeatedly until the infrared spectrum detects that the Si-H characteristic peak disappe...

Embodiment 1

[0037] 1. Add 1,2-epoxy- Add 5% catalyst (1000PPM) to 4-vinylcyclohexane; the adding process is to stir while dripping in an oil bath at 80°C, and the dripping time is controlled at about 3h; after the dripping, continue the reaction until the infrared Spectral detection Si-H characteristic peak disappears completely, then stop reaction. The obtained product is a silicone-modified epoxy resin.

[0038] 2, the organosilicon epoxy resin that is synthesized is added in the bisphenol A type epoxy resin with the ratio of 0%, 20%, 50%, 100% respectively to form A agent, and B agent anhydride (weight percent is 70% formazan Base hexahydrophthalic anhydride (composed of 30% hexahydrophthalic anhydride) is cured on the patch, the curing condition is 135°C*1h+150°C*4h, the patch type is 5050, the lighting current is 3*30mA, every 200h Measure the luminous flux, light up for 1000h in total.

[0039] It was found that with the increase of the addition of new silicone epoxy resin, the i...

Embodiment 2

[0041] 1. Press "double bond-containing epoxy monomer": "phenyl hydrogen-containing silicone oil" = 1:1, add glycidyl methacrylate to 0.7% hydrogen-containing phenyl hydrogen-containing silicone oil, and add 5% catalyst (1000PPM); the adding process is to stir while dripping in an oil bath at 120°C, and the dripping time is controlled at about 3h; Stop responding. The obtained product is a silicone-modified epoxy resin.

[0042] 2. Add the synthesized organosilicon epoxy to the bisphenol A type epoxy resin in proportions of 0%, 20%, 50%, and 100% respectively to form A agent, and B agent anhydride (70% by weight is methyl Hexahydrophthalic anhydride (composed of 30% hexahydrophthalic anhydride) is cured on the patch, the curing condition is 135°C*1h+150°C*4h, the patch type is 5050, the lighting current is 3*30mA, measured every 200h Luminous flux, a total of 1000h lit.

[0043] It was found that with the increase of the amount of the new silicone epoxy resin, the improveme...

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Abstract

The invention discloses silicone-modified epoxy resin and a synthesis method as well as a method for alleviating luminous attenuation with the silicone-modified epoxy resin. The synthesis method comprises the following steps: (1) in an oil bath pot of 80-120 DEG C, adding an epoxy monomer containing double bands into phenyl hydrogen-containing silicone oil, and adding a catalyst; (2) performing stirring when the epoxy monomer is dripped for about 2-3 hours; (3) continuing a reaction after the epoxy monomer is completely dripped, performing detection for several times until infrared spectral detection Si-H characteristic peaks are completely vanished, and stopping the reaction, thereby obtaining the silicone-modified epoxy resin. Through the adoption of the silicone-modified epoxy resin disclosed by the invention, the luminous attenuation phenomenon can be remarkably alleviated.

Description

technical field [0001] The invention relates to the field of materials, in particular to a silicone-modified epoxy resin, a synthesis method and a method for improving light decay. Background technique [0002] At present, the commercialized white light LED patch part uses epoxy resin as the packaging material. Now when the ordinary epoxy resin is used as the packaging material, the light decay of the white light LED is serious. Epoxy resin has high hygroscopicity and poor flexibility. Contents of the invention [0003] Based on this, it is necessary to provide a silicone-modified epoxy resin that can significantly slow down light decay. [0004] A kind of synthetic method of organosilicon modified epoxy resin, comprises the steps: [0005] (1) In an oil bath at 80-120°C, add an epoxy monomer containing a double bond to the phenyl hydrogen-containing silicone oil, and add a catalyst; [0006] (2) Stir while adding dropwise, and the dropwise addition time is controlled a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/42C08G77/38
Inventor 马圆于爱霞关启源黄仁杰
Owner 广州惠利电子材料有限公司
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