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Semiconductor package

A semiconductor and wire technology, applied in the field of via plug design, can solve problems affecting product reliability and quality, heat dissipation, electromagnetic interference, etc., and achieve the effect of improving signal integrity

Inactive Publication Date: 2015-07-22
MEDIATEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the increased number of input / output (I / O) connections in multi-function chip packages can lead to problems with thermoelectric characteristics, for example, heat dissipation, crosstalk, signal propagation delay or radio frequency (RF) ) circuit electromagnetic interference and other issues
The above thermoelectric characteristics will affect the reliability and quality of the product

Method used

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  • Semiconductor package
  • Semiconductor package

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Embodiment Construction

[0012] Certain words are used in the claims and description to refer to specific components. Those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same components. The claims and description do not use differences in names as a way to distinguish components, but use differences in functions of components as a criterion. The "including" mentioned in the claims and specification is an open term, so it should be interpreted as "including but not limited to". In addition, the term "coupling" here includes any direct and indirect electrical connection means. Therefore, if the text describes that the first device is coupled to the second device, it means that the first device can be directly electrically connected to the second device, or indirectly electrically connected to the second device through other devices or connection means .

[0013] In order to make the objectives, features, and advantages of the present invention ...

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Abstract

The invention provides a semiconductor package. The semiconductor package includes a first semiconductor die having pads thereon. A first via and a second via are respectively disposed on the first semiconductor die. The first via connects to at least two of the pads of the first semiconductor die.

Description

Technical field [0001] The present invention relates to a semiconductor package, and more particularly to a via plug design of a semiconductor package. Background technique [0002] For the design of semiconductor packages, it is necessary to increase the number of input / output (I / O) connections in response to multi-function chips. The above-mentioned influence will force printed circuit board manufacturers to reduce line width or line spacing or develop direct chip attach (DCA) semiconductors. However, the increase in the number of input / output (I / O) connections in the multi-function chip package can cause thermoelectric characteristics problems, such as heat dissipation, crosstalk, signal propagation delay, or radio frequency (RF). ) Problems such as electromagnetic interference of the circuit. The above thermoelectric characteristics will affect the reliability and quality of the product. [0003] Therefore, in this technical field, there is a need for a high-density semicond...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/528H01L23/488
CPCH01L24/17H01L25/0655H01L2225/06541H01L25/0657H01L2224/16227H01L23/3107H01L2225/06517H01L23/481H01L2224/13024H01L2225/06513H01L23/5286H01L2224/16146H01L2224/13025H01L2924/181H01L2224/16225H01L23/3128H01L2924/00
Inventor 林子闳
Owner MEDIATEK INC
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