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Multi-layer ceramic electronic assembly and board provided thereon with multi-layer ceramic electronic assembly

A technology of multi-layer ceramics and electronic components, which is applied to printed circuits, electrical components, laminated capacitors, etc. connected with non-printed electrical components, can solve problems such as discomfort for listeners, and achieve the effect of reducing acoustic noise.

Active Publication Date: 2015-07-29
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Vibration sounds can correspond to audible frequencies in the range of 20 Hz to 20,000 Hz, causing discomfort to the listener

Method used

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  • Multi-layer ceramic electronic assembly and board provided thereon with multi-layer ceramic electronic assembly
  • Multi-layer ceramic electronic assembly and board provided thereon with multi-layer ceramic electronic assembly
  • Multi-layer ceramic electronic assembly and board provided thereon with multi-layer ceramic electronic assembly

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Embodiment Construction

[0030] Exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.

[0031] This disclosure, however, may be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0032] In the drawings, the shapes and dimensions of elements may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like elements.

[0033] In order to clearly describe the exemplary embodiments of the present disclosure, directions of a hexahedron will be defined. The width direction indicates a direction along which the external electrodes are formed, the length direction indicates a direction crossing the width direction, and the thickness direction indicat...

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Abstract

The present invention relates to a multi-layer ceramic electronic assembly and a board provided thereon with the multi-layer ceramic electronic assembly. The multi-layer ceramic electronic assembly comprises a multi-layer ceramic capacitor composed of a first ceramic body, a plurality of first inner electrodes, a plurality of second inner electrodes, a plurality of first outer electrodes and a plurality of second outer electrodes; and a ceramic chip composed of a first ceramic body, a third inner electrode, a fourth inner electrode, a first connecting terminal, a second connecting terminal, a first outer terminal and a second outer terminal. The second ceramic body is formed through stacking up a plurality of ceramic layers on the mounting surface of a multi-layer ceramic capacitor. The first and second connecting terminals are respectively extending to some parts of the upper surface of the ceramic body from the lateral surface of the second ceramic body respectively, and are respectively connected to the first and second outer electrodes of the multi-layer ceramic capacitor. The first and second outer terminals are respectively arranged on the end of the ceramic body, and are respectively connected to the exposed portions of the third and fourth inner electrodes respectively.

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2014-0009719 filed with the Korean Intellectual Property Office on Jan. 27, 2014, the disclosure of which is hereby incorporated by reference. technical field [0002] The present disclosure relates to a multilayer ceramic electronic component and a board on which the multilayer ceramic electronic component is mounted. Background technique [0003] Multilayer ceramic capacitors (multilayer chip electronic components) are mounted in, for example, display devices (such as liquid crystal displays (LCDs), plasma display panels (PDPs), etc.), computers, personal digital assistants (PDAs), cellular phones, etc. Chip capacitors on circuit boards in various electronic products for charging or discharging. [0004] Multilayer ceramic capacitors (MLCCs) may be used as components of various electronic devices due to advantages such as small size, high capacitance, and ease of mounting. [0005] A multilayer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/30H01G4/005H01G4/232H05K1/18
CPCH01G2/06H01G4/12H01G4/30H05K3/301H05K2201/10636
Inventor 朴祥秀朴珉哲
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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