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Light emitting element package and display

A technology for light-emitting elements and packages, applied in the field of lighting, can solve the problems of difficult integration, unfavorable display, loose distribution, etc., and achieve the effects of improving structural stability, reducing volume and quality, and reducing processing difficulty.

Active Publication Date: 2017-11-07
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The light-emitting element packages in the prior art usually have relatively complicated lead frames, and the matching relationship between the lead frames is complicated
Especially for light-emitting elements connected in series, the structure of the lead frame is more complicated and the distribution is relatively loose
This leads to a large volume of the light-emitting element package, and poor structural stability, which is inconvenient and not easy to integrate into electrical appliances
Especially for displays, the current development trend is lighter and thinner, and this kind of light-emitting element package is very unfavorable for the further development of displays using it towards thinner and lighter

Method used

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  • Light emitting element package and display
  • Light emitting element package and display
  • Light emitting element package and display

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Embodiment Construction

[0023] The present invention will be further described below in conjunction with accompanying drawing.

[0024] The light-emitting element package of the present invention has a plurality of conductive elements nested together, and a light-emitting element arranged between adjacent conductive elements. It should be noted here that, in order to ensure the normal operation of the light-emitting element, it is necessary to ensure that adjacent conductive members are spaced apart from each other so that they cannot be directly electrically connected, so as to form a potential difference at both ends of the light-emitting element. The light-emitting element here can be an LED lamp, a light-emitting chip, or other light-emitting elements provided according to usage needs, so as to ensure the light-emitting quality of the light-emitting element package.

[0025] It should be understood that the "nesting" mentioned here refers to the arrangement of one conductive element surrounding t...

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Abstract

The light-emitting element package comprises a plurality of conductive elements spaced to each other, and light-emitting elements disposed between adjacent conductive elements and electrically connected to the adjacent conductive elements. Adjacent conductive elements are configured correspondingly to each other so as to relatively form inner conductive elements and outer conductive elements. The light-emitting element package can be integrated into an electrical apparatus in a better way, resulting in a low manufacturing cost. In particular, when the light-emitting element package is applied to the display device, the manufacturing cost of the display device can be greatly reduced, thereby prolonging a service life of the display device.

Description

technical field [0001] The invention relates to the field of lighting technology, in particular to a light-emitting element package. The present invention also relates to a display using such a light emitting element package. Background technique [0002] In recent years, light emitting element packages have been widely used in electric appliances. The encapsulation can effectively transmit light while protecting the light-emitting element, so as to ensure its luminous effect. [0003] The light-emitting element packages in the prior art usually have relatively complicated lead frames, and the matching relationship between the lead frames is complicated. Especially for light-emitting elements connected in series, the structure of the lead frame is more complicated and the distribution is relatively loose. This results in a large volume of the light-emitting element package and poor structural stability, which is inconvenient and difficult to integrate into electrical appl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/62H01L25/075
CPCH01L25/075H01L33/62
Inventor 周革革
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD