Silicone compounds, modified imide resins, thermosetting resin compositions, prepregs, resin-coated films, laminates, multilayer printed wiring boards, and semiconductor packages

A technology of siloxane compound and compound, which is applied in the direction of semiconductor devices, synthetic resin layered products, semiconductor/solid device components, etc., can solve the problems of low solubility, processability, difficult to handle, etc., and achieve low curing shrinkage properties, low thermal expansion, and good dielectric properties

Active Publication Date: 2017-06-30
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In this regard, known liquid crystalline polymers such as polyester, polyamide, polycarbonate, polythiol, polyether, and polyazomethine have low thermal expansion, dielectric properties, A thermosetting resin with excellent heat resistance, but there are problems with processability and formability, and problems with difficult handling due to low solubility in organic solvents

Method used

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  • Silicone compounds, modified imide resins, thermosetting resin compositions, prepregs, resin-coated films, laminates, multilayer printed wiring boards, and semiconductor packages
  • Silicone compounds, modified imide resins, thermosetting resin compositions, prepregs, resin-coated films, laminates, multilayer printed wiring boards, and semiconductor packages
  • Silicone compounds, modified imide resins, thermosetting resin compositions, prepregs, resin-coated films, laminates, multilayer printed wiring boards, and semiconductor packages

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0225] Hereinafter, the present invention will be described in more detail using the following examples, but the present invention is not limited to these examples.

[0226] Furthermore, the curing shrinkage was measured and evaluated by the following method using the resin sheets obtained in the respective Examples and Comparative Examples, and the glass transition temperature, thermal expansion coefficient, copper foil adhesion, and copper-containing solder resistance were measured and evaluated using the copper-clad laminate. Thermal properties, flexural elastic modulus, and dielectric properties were measured and evaluated by the following methods.

[0227] (1) Measurement of cure shrinkage of resin sheet

[0228] A 5 mm square resin plate (thickness 1 mm) was produced, and thermomechanical analysis was performed by a compression method using a TMA test apparatus (manufactured by TA Instruments, Q400). After the resin plate was mounted on the device in the Z direction, th...

manufacture Embodiment 1

[0243] Production Example 1: Production of Siloxane Compound (i-1)

[0244] To a 2-liter reaction vessel with a thermometer, a stirring device, and a moisture meter with a reflux condenser capable of heating and cooling, add 3,3'-dimethyl-4,4'-diaminobiphenyl: 0.27 g, terephthalaldehyde: 0.33 g, X-22-161B: 199.4 g, propylene glycol monomethyl ether: 300.0 g, and reacted at 115°C for 4 hours, then heated to 130°C and dehydrated by atmospheric concentration to obtain a mixture containing Solution (Mw: 30000, resin component: 90 mass %) of modified siloxane compound (i-1) with aromatic azomethine.

manufacture Embodiment 2

[0245] Production Example 2: Production of Siloxane Compound (i-2)

[0246] To a 2-liter reaction vessel equipped with a thermometer, a stirring device, and a moisture meter with a reflux condenser and capable of heating and cooling, 4,4'-diaminobenzamide: 0.27 g, terephthalaldehyde were added. : 0.31g, X-22-161B: 199.4g, propylene glycol monomethyl ether: 300.0g, after reacting at 115°C for 4 hours, the temperature was raised to 130°C and dehydration was carried out by concentration at atmospheric pressure to obtain an aromatic azomethine containing of the modified siloxane compound (i-2) (Mw: 31000, resin component: 90% by mass).

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Abstract

Provided is a siloxane compound and the like containing the structures indicated by formula (1) and formula (2). (In formula (1), R1 and R2 individually represent a hydrogen atom, a halogen atom, an alkyl group having 1-3 carbon atoms, a halogenated alkyl group, a thiol group, an acetyl group, a hydroxyl group, a sulfonic acid group, a sulfoalkoxyl group having 1-3 atoms, or an alkoxyl group having 1-3 carbons atoms, and x and y individually represent an integer of 0-4. A represents a single bond, an azomethine group, an ester group, an amide group, an azoxy group, an azo group, an ethylene group, or an acetylene group.) (In formula (2), R3 and R4 individually represent an alkyl group, a phenyl group, or a substituted phenyl group and n is an integer of 1-100.)

Description

technical field [0001] The present invention relates to a siloxane compound suitable for use in semiconductor packages and printed wiring boards, modified imide resins using the same, thermosetting resin compositions, prepregs, films with resins, laminates, multilayers Printed wiring boards, and semiconductor packages. Background technique [0002] With the trend of miniaturization and high performance of electronic equipment in recent years, the wiring density and high integration of multilayer printed wiring boards have been advanced. The demand for improved reliability brought about by the improvement of heat resistance is strengthened. In such applications, especially in semiconductor packages, both excellent heat resistance and low thermal expansion are required. In addition, dielectric properties corresponding to higher frequencies of electrical signals are also required. [0003] In this regard, well-known liquid crystalline polymers such as polyester-based, polyam...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/00B32B5/28B32B27/00C08G73/12C08G77/452C08J5/24C08K3/00C08L63/00C08L79/00C08L83/10C08L101/12H01L23/14H05K1/03
CPCB32B15/08B32B15/092B32B15/20B32B27/06B32B27/18B32B27/28B32B27/38B32B37/06B32B37/10B32B38/10B32B2260/046B32B2307/204B32B2307/51B32B2307/736B32B2457/08C08G77/388C08J5/18C08J2383/08C08L83/08C08L2203/16C08L2203/20C08L2203/206C09D183/08H01L23/145H01L2924/00H01L2924/0002H05K1/0346H05K3/285C08G59/5033
Inventor 小竹智彦长井骏介桥本慎太郎安部慎一郎宫武正人高根泽伸村井曜
Owner RESONAC CORPORATION
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