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56results about How to "Low curing shrinkage" patented technology
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Cured composition, cured product thereof, hard primer and hard coating
InactiveCN104419234AHigh hardnessLow curing shrinkageAntifouling/underwater paintsLayered productsDouble bondMicroparticle
The invention provides a cured composition, a cured product thereof, a hard primer and a hard coating. The cured composition of the hard primer and the hard coating forms pencils with excellent hardness, lubrication and antifouling properties, low cured contraction, and excellent transparency, bending performance and anti-scratching performance. The cured composition contains, in preset ratio, organo-mineral complex (A) which is obtained by treating surface of inorganic oxide particles with a silane coupling agent containing at least two (methyl) acryloyl groups to combine the silane coupling agent with inorganic oxide particles through covalent bonds, poly-functionality (methyl) acrylate monomers (B) containing at least two (methyl) acryloyl groups, a polymerization initiator (C) and an antifouling imparting agent containing fluorochemicals having a perfluorinated polyether structure and carbon-carbon double bond.
Owner:SHOWA DENKO KK
Curable resin composition
The present invention is a curable resin composition characterized by containing (A) a copolymer represented by general formula (1) (in the formula, X denotes an atomic group formed by removing a number (k) of mercapto groups from a polyfunctional thiol compound having at least k mercapto groups, Y denotes a monovalent organic group derived from a copolymer obtained by copolymerizing an unsaturated monomer, and k is an integer between 3 and 10), (B) silica microparticles, (C) a reactive monomer and (D) a polymerization initiator. The present invention can provide a hard coating agent which exhibits little shrinkage upon curing and which can achieve both little shrinkage upon curing and blocking resistance if necessary and, by using the hard coating agent, can also provide a hard coating film or hard coating-treated plastic base material having high pencil hardness and low curling properties.
Owner:RESONAC HOLDINGS CORPORATION
Modified siloxane compound having aromatic azomethine, thermosetting resin composition including thereof, prepreg, film having resin, laminate, multi-layer printed wiring board, and semiconductor package
ActiveUS20140192501A1Excellent low cure shrinkageExcellent dielectric propertiesGroup 4/14 element organic compoundsPrinted circuit aspectsPhenyl groupSingle bond
A siloxane compound containing structures represented by the following general formulae (1) and (2):wherein R1 and R2 independently represent a hydrogen atom, a halogen atom, an alkyl group having from 1 to 3 carbon atoms, a halogenated alkyl group, a thiol group, an acetyl group, a hydroxyl group, a sulfonic acid group, a sulfoalkoxyl group having from 1 to 3 carbon atoms, or an alkoxyl group having from 1 to 3 carbon atoms; x and y independently represent an integer of from 0 to 4; and A represents a single bond or an azomethine group, an ester group, an amide group, an azoxy group, an azo group, an ethylene group, or an acetylene group, andwherein R3 and R4 independently represent an alkyl group, a phenyl group, or a substituted phenyl group; and n represents an integer of from 1 to 100.
Owner:RESONAC CORP
Optically clear hot melt adhesives and uses thereof
InactiveUS20170145267A1Good light transmissionGood optical effectAdhesive processesLayered product treatmentMeth-LED display
Hot melt adhesives with pressure sensitive adhesive properties for electronic devices are described. The hot melt adhesive comprises a styrenic block copolymer with fully hydrogenated and saturated soft blocks, a liquid diluent or a tackifier, a (meth)acrylate monomer or an oligomer having at least two (meth)acrylic functionalities per oligomer chain, and an initiator. The hot melt adhesive is also a reworkable UV curable optically clear adhesive film. The adhesive and film are suitable as a laminating PSA film or encapsulant for LCD display, LED display, touch screen, and flexible thin film photovoltaic module.
Owner:HENKEL IP & HOLDING GMBH
Epoxy hardeners for low temperature curing
Hardeners are provided for curing epoxies at lower temperatures than currently available hardeners while retaining superior mechanical and thermal properties. A first component is selected from imidazole, dicyandiamide, or a mixture of polyamines and tertiary amines. A poiyol mixture is then selected. The first component is combined with the polyol mixture to form a hardener. The hardener is combined with epoxy resin and is cured. A method for selecting a hardener to yield an epoxy-hardener system with good properties after curing at a specified temperature and time includes selecting components for the hardener so the glass transition temperature of the cured epoxy-hardener system is not significantly lower than 45° C. above the cure temperature. The method includes steps for adjusting and controlling the ultimate glass transition temperature to maximize the mechanical properties of the epoxy-hardener system. The method regularly produces hardened epoxy systems having about 90% or more epoxy groups reactect.
Owner:ARDES ENTERPRISES
Hot melt adhesive composition based on a random copolymer of isotactic polypropylene
A hot melt adhesive composition is based on an isotactic polypropylene random copolymer (RCP). The composition contains about 4%-50% by weight of the RCP copolymer, about 20%-65% by weight of a compatible tackifier, about 0%-40% by weight of a plasticizer, about 0%-3% by weight of a stabilizer, about 0%-40% by weight of a wax, and optionally about 0%-60% by weight of an atactic poly-alpha-olefin (APAO). The adhesive composition may be used in a number of applications such as, for example, in disposable nonwoven hygienic articles, paper converting, flexible packaging, wood working, carton and case sealing, labeling and other assembly applications.
Owner:ATO FINDLEY
Polymerizable composition, and cured article
ActiveUS20150252234A1Good storage stabilityImprove stabilityNon-macromolecular adhesive additivesOrganic non-macromolecular adhesivePhosphinic AcidsPhosphoric acid
According to the present invention, a polymerizable composition having excellent storage stability can be provided by adding an acid that serves as a stabilizing agent and a free-radical polymerization inhibitor to a polymerizable composition that contains a polythiol compound and an enic compound having a phenylthio backbone as monomer components. In the present invention, an embodiment in which the acid is at least one compound having a protonic-acid-type functional group which is selected from phosphoric acid, phosphonic acid, phosphinic acid, sulfonic acid, sulfoneimide and carboxylic acid is preferred.
Owner:MITSUBISHI GAS CHEM CO INC
Epoxy hardener systems based on aminobis(methylene-ethyleneurea)
Owner:ARDES ENTERPRISES
Encapsulating composition, barrier layer including same, and encapsulated apparatus including same
ActiveUS20150344697A1Improve light curing rateLow curing shrinkageSemiconductor/solid-state device detailsNon-macromolecular organic additionCarboxylic acidAmide bonds
The present invention relates to an encapsulating composition, a barrier layer including the same, and an encapsulated apparatus including the same, and the composition comprises (A) a photocurable monomer and (B) a photocurable monomer containing a carboxylic acid group, wherein (B) the photocurable monomer containing the carboxylic acid group has an amide bond.
Owner:CHEIL IND INC
Preparation method of organic mineral complex, curable composition, cured product of curable composition, hard coating material, hard coating film and silane coupling agent
The present invention provides a preparation method of an organic mineral complex, a curable composition, a cured product of the curable composition, a hard coating material, a hard coating film and a silane coupling agent. The curable composition can form the hard coating film with pencil hardness, low cured shrinkage, excellent transparency, excellent flexibility and excellent scratch resistance. The curable composition contains, at a specified rate, an organic mineral complex (A) using a silane coupling agent having at least two (methyl) acryloyl groups to perform surface treatment on inorganic oxide particles so as to enable the silane coupling agent to be combined with the inorganic oxide particles with a covalent bond, a multifunctional (methyl) acrylate monomer (B) having at least two (methyl) acryloyl groups, and a polymerization initiator (C). The silane coupling agent is obtained by a condensation reaction between an isocyanate-group-containing compound and a hydroxyl-containing compound, wherein the isocyanate-group-containing compound has an alkoxysilyl group and an isocyanate group, the hydroxyl-containing compound has at least two (methyl) acryloyl groups and at least one hydroxyl group, and the hydroxyl value is more than 75mgKOH / g.
Owner:SHOWA DENKO KK
Photosensitive acrylate composition and waveguide device
InactiveUS7078445B2High photo contrastFast curingPhotosensitive materialsPhotomechanical apparatusAlcoholPhotoinitiator
A photosensitive composition suitable for practical waveguide devices is provided. The photosensitive composition comprises at least one multifunctional acrylate prepared from a fluorinated multifunctional alcohol and at least one photoinitiator. The said composition has high photo contrast, high curing speed, controllable refractive index, low curing shrinkage, high thermo-optic coefficient, low volatility and high viscosity. A waveguide device is formed by patterning the photosensitive composition.
Owner:ENABLENCE TECH USA
Epoxy hardener systems based on aminomethylene-ethyleneureas
InactiveUS20070179257A1Long latency periodShort curing timeOrganic chemistrySynthetic resin layered productsEpoxyLong latency
An epoxy-hardener system is provided having relatively long latency periods combined with relatively short cure times at low cure temperatures. The hardeners of the present invention are ureidoamines and their derivatives, which are chelates of ureido compounds and amines. The ureidoamines are prepared by reacting an amine with the ureido compound and aqueous formaldehyde without a catalyst. Complexes of ureidoamine hardeners with various blocking agents are prepared in the melt. The hardener is prevented from curing the epoxy by the reaction between the hardener and the blocking agent. The blocked hardener is then blended with the epoxy, usually by warming the mixture briefly at about 50-60 degrees C.
Owner:ARDES ENTERPRISES
Curable resin composition
InactiveUS20130237629A1Low curing shrinkageHigh pencil hardnessImpression capsPlastic/resin/waxes insulatorsThiolPolymer science
The present invention is a curable resin composition comprising a copolymer (A) represented by the following general formula (1), silica fine particles (B), a reactive monomer (C) and a polymerization initiator (D). In the general formula (1), X is an atomic group formed by removing “k” mercapto groups from a multifunctional thiol compound having at least “k” mercapto groups; Y is a monovalent organic group derived from a copolymer formed by copolymerizing unsaturated monomers; and “k” is an integer of 3 to 10. The present invention can provide a hard coat agent which has low curing shrinkage and which has both low curing shrinkage and antiblocking properties as needed; a hard coat film and a hard-coat treated plastic substrate having high pencil hardness and low curling properties, by using this hard coat agent.XS—Y)k (1)
Owner:SHOWA DENKO KK
Preparation method of dental composite resin containing function monomer PMDM and modified hydroxylapatite and use thereof
InactiveCN101390813AGood dispersionPacked tightlyImpression capsDentistry preparationsPolymer scienceFunctional monomer
The invention belongs to the biomedical high molecular material technical field, in particular to a preparation method and the application of dental composite resin which contains functional monomer PMDM and modified hydroxyapatite. The preparation method includes the steps: 5%-20% of functional monomer PMDM is added to the substrate resin and placed in a constant-temperature oven; under the temperature of 40 DEG C -80 DEG C, the PMDM is dissolved in the substrate resin and stirred evenly; then photosensitizer and organic amine activator are added to the substrate resin and stirred evenly; then modified inorganic filler is added and diluted in solvent; the amount of solvent is 5%-10% of the mass of the mixture; the mass fraction of inorganic filler is 20%-70% of the total mass; inorganic filler is stirred evenly; the mixture is placed in a vacuum oven and placed under 40 DEG C-80 DEG C for 2-4 hours; the composite resin paste is obtained after the solvent is volatilized completely and the air bubbles are eliminated. The oral cavity repair resin has the advantages of good bond performance, ultrastructure, higher mechanical intensity, higher biocompatibility, having wide application prospect in the oral cavity repair field, having reasonable preparation line, obtainable raw materials, lower price, simple preparation process, having important popularization and application values.
Owner:TONGJI UNIV
Square particle benzoxazine molding plastic
The invention relates to square particle benzoxazine molding plastic. The square particle benzoxazine molding plastic is prepared from the following components by weight percent: 20 to 40 percent of benxoxazine resin, 30 to 60 percent of chopped fibers, 1 to 5 percent of titanium dioxide, 1 to 3 percent of curing accelerant, 1 to 5 percent of thermoplastic polyurethane elastomer rubber, 1 to 3 percent of stearic acid, 0.5 to 2 percent of wax and the balance of wollastonite; and the components are prepared, mixed, extruded, diced, cooled, screened and magnetically selected so as to remove iron,thus obtaining a square finished product. By adopting the formula, the curing shrinkage is small, the mechanical properties are excellent, the flame retardant performance is high, the heat stabilityis high, less fine powder exists, the rate of finished products is increased, and the environment of a molding workshop is protected.
Owner:广西信和新合成材料有限公司
Photocured composition, blocking layer comprising same and encapsulated device comprising same
ActiveUS20150337065A1High reliabilityLow curing shrinkageSemiconductor/solid-state device detailsSolid-state devicesBlock layerBlocking layer
Owner:CHEIL IND INC
White ultraviolet light polymerization resin composition, and preparation method and application method thereof
ActiveCN102925033AHigh solid contentImproves wettability of inert fillersInksEpoxy resin coatingsEpoxyAcrylic resin
The invention relates to white ultraviolet light polymerization resin composition, and a preparation method and an application method thereof. The composition comprises, by weight, the following raw materials: 100 parts of side chains multi-vinyl epoxy resin, 10-100 parts of vinyl end long chains epoxy resin, 1-30 parts of photopolymerization initiators, 5-100 parts of unsaturability monomer, 5-40 parts of thermoplastic acrylic resin, 35-400 parts of inorganic filling materials and 0.5-10 parts of wetting dispersants. The composition is grinded by a three-roll machine to reach certain fineness for printing. The composition is used for printing characters and patterns of circuit boards. By the aid of the composition, definition and plumpness of the characters are enhanced after the characters are printed, and diffusivity of the characters due to printing repeatedly for a plurality of times is reduced.
Owner:JIANGSU KUANGSHUN PHOTOSENSITIVITY NEW MATERIAL
Energy beam-curable adhesive
ActiveCN106574148ALow curing shrinkageHigh elongationNon-macromolecular adhesive additivesMacromolecular adhesive additivesPolyolefinPolymer science
This invention provides a curable adhesive with excellent thermal cycle resistance. An energy beam curable adhesive includes: (A) 100 parts by mass of (meth)acrylate; (B) 25-150 parts by mass of polyolefin particles; (C) an inorganic filler; and (D) a photoradical polymerization initiator. The (A) (meth)acrylate may include a (A1) mono-functional (meth)acrylate and a (A2) multi-functional (meth)acrylate. The (B) polyolefin particles may include polyethylene particles and / or polypropylene particles.
Owner:DENKA CO LTD
Thermosetting resin composition for semiconductor package and prepreg using the same
ActiveUS20180148555A1Low curing shrinkageHigh glass transition temperatureSemiconductor/solid-state device detailsSolid-state devicesFilling materialsChemistry
The present invention relates to a thermosetting resin composition for a semiconductor package and a prepreg using the same. Specifically, a thermosetting resin composition for a semiconductor package which exhibits a low curing shrinkage ratio and has a high glass transition temperature and greatly improved flowability by introducing acrylic rubber and mixing two specific inorganic fillers surface-treated with a binder of a specific composition at a certain ratio, and a prepreg using the same, are provided.
Owner:LG CHEM LTD
Aromatic polythiol compound for optical material
ActiveUS20190292144A1Improve mechanical propertiesHigh refractive indexThiol preparationProjector focusing arrangementOptical propertyEyeglass lenses
An embodiment relates to an aromatic polythiol compound for optical materials, and the aromatic polythiol compound according to the embodiment contains a phenyl group and a large number of sulfur atoms in its polythiol structure so that a polymerizable composition and an optical material obtained therefrom have excellent optical properties such as high refractive index and low specific gravity, as well as excellent mechanical properties such as low cure shrinkage; thus, they can be advantageously used for producing various plastic optical lenses such as eyeglass lenses and camera lenses.
Owner:SKC CO LTD
Curable resin composition and cured product
The present invention relates to a curable resin composition and a cured product. The curable resin composition has excellent reproductivity of curing and processing characteristic in manufacturing process of cured product, can obtain the cured product with stable quality and has low curing shrinkage characteristic. Furthermore the cured product with heat discoloring resistance, low heat expansibility and high transparency can be obtained. The curable resin composition is characterized by comprising the following components as essential components: (A) organic-inorganic compound which comprises more than two aliphatic unsaturated bonds and is composed of cage type siloxane and organic components; (B) olefinic unsaturated compound with at least two (methyl)acryloyls, and (C) solid catalyst, wherein relatively to 100 parts by weight of total amount of (A), (B) and (C), the content of component (A) which uses the organic-inorganic compound as the main component is at least 30 parts by weight.
Owner:NIPPON STEEL CHEMICALL &MATERIAL CO LTD
Encapsulating composition, barrier layer including same, and encapsulated apparatus including same
ActiveUS9598582B2Improve light curing rateLow curing shrinkageSemiconductor/solid-state device detailsSolid-state devicesCarboxylic acidPhotochemistry
The present invention relates to an encapsulating composition, a barrier layer including the same, and an encapsulated apparatus including the same, and the composition comprises (A) a photocurable monomer and (B) a photocurable monomer containing a carboxylic acid group, wherein (B) the photocurable monomer containing the carboxylic acid group has an amide bond.
Owner:CHEIL IND INC
Radiation-curable resin composition, radiation-curable coating material, and method for forming protective layer
ActiveUS8414979B2High hardnessLow curing shrinkagePretreated surfacesPolyurea/polyurethane coatingsPolymer scienceMeth-
Owner:DIC CORPORATION
Photosensitive acrylate composition and waveguide device
InactiveUS20060229379A1Increase contrastFast curingPhotosensitive materialsPhotomechanical apparatusAlcoholPhotoinitiator
A photosensitive composition suitable for practical waveguide devices is provided. The photosensitive composition comprises at least one multifunctional acrylate prepared from a fluorinated multifunctional alcohol and at least one photoinitiator. The said composition has high photo contrast, high curing speed, controllable refractive index, low curing shrinkage, high thermo-optic coefficient, low volatility and high viscosity. A waveguide device is formed by patterning the photosensitive composition.
Owner:ENABLENCE TECH USA
Thermosetting resin composition for semiconductor package and prepreg using the same
ActiveUS10294341B2Low curing shrinkageHigh glass transition temperatureSemiconductor/solid-state device detailsSolid-state devicesAcrylic rubberSemiconductor package
The present invention relates to a thermosetting resin composition for a semiconductor package and a prepreg using the same. Specifically, a thermosetting resin composition for a semiconductor package which exhibits a low curing shrinkage ratio and has a high glass transition temperature and greatly improved flowability by introducing acrylic rubber and mixing two specific inorganic fillers surface-treated with a binder of a specific composition at a certain ratio, and a prepreg using the same, are provided.
Owner:LG CHEM LTD
Curable resins and articles made therefrom
InactiveUS8197723B2Good optical performanceLow curing shrinkageSynthetic resin layered productsOrganic dyesPolymer sciencePolymer
Optical devices of excellent optical and physical properties produced from cured resins are disclosed. The resins and / or the cured hybrid polymer material made with the resins are characterized by a high level of cycloaliphatic-containing groups. Specific additives that can participate in crosslinking the curable polysiloxane provide additional physical property advantages.
Owner:NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD
Urethane-modified (METH)acrylamide compound and active energy ray curable resin composition containing same
ActiveUS20180244832A1Improve compatibilityImprove curing effectCosmetic preparationsOther chemical processesGeneral purposeOrganic solvent
Provided is an active energy ray curable resin which has excellent compatibility with organic solvents, general purpose acrylic monomers, and oligomers, and a high curing property with an active energy ray, and also has a high adhesion property for each substrate. A cured film obtained by ultraviolet curing of the active energy ray curable resin has an excellent surface curing property, scratch resistance and bending resistance, while also having high transparency. Provided is a urethane modified (meth)acrylamide compound having a urethane bond and one or more (meth)acrylamide groups in the molecule. The urethane modified (meth)acrylamide compound has excellent compatibility with organic solvents, general purpose acrylic monomers, and oligomers, and exhibits a high curing property with an active energy ray. Also provided is an active energy ray curable resin which is obtained with the urethane modified (meth)acrylamide compound and has an excellent surface curing property, scratch resistance, and bending resistance.
Owner:KJ CHEM
Optically clear hot melt adhesives and uses thereof
InactiveUS10266733B2Good effectFacilitate transmissionAdhesive processesLayered product treatmentMeth-LED display
Owner:HENKEL IP & HOLDING GMBH
Curable resins and articles made therefrom
InactiveUS20120178859A1Good optical performanceLow curing shrinkageNon-fibrous pulp additionInksPolymer sciencePolymer
Owner:NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD
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