55results about How to "Low curing shrinkage" patented technology

The invention provides a cured composition, a cured product thereof, a hard primer and a hard coating. The cured composition of the hard primer and the hard coating forms pencils with excellent hardness, lubrication and antifouling properties, low cured contraction, and excellent transparency, bending performance and anti-scratching performance. The cured composition contains, in preset ratio, organo-mineral complex (A) which is obtained by treating surface of inorganic oxide particles with a silane coupling agent containing at least two (methyl) acryloyl groups to combine the silane coupling agent with inorganic oxide particles through covalent bonds, poly-functionality (methyl) acrylate monomers (B) containing at least two (methyl) acryloyl groups, a polymerization initiator (C) and an antifouling imparting agent containing fluorochemicals having a perfluorinated polyether structure and carbon-carbon double bond.

A siloxane compound containing structures represented by the following general formulae (1) and (2):

wherein R₁ and R₂ independently represent a hydrogen atom, a halogen atom, an alkyl group having from 1 to 3 carbon atoms, a halogenated alkyl group, a thiol group, an acetyl group, a hydroxyl group, a sulfonic acid group, a sulfoalkoxyl group having from 1 to 3 carbon atoms, or an alkoxyl group having from 1 to 3 carbon atoms; x and y independently represent an integer of from 0 to 4; and A represents a single bond or an azomethine group, an ester group, an amide group, an azoxy group, an azo group, an ethylene group, or an acetylene group, and

wherein R₃ and R₄ independently represent an alkyl group, a phenyl group, or a substituted phenyl group; and n represents an integer of from 1 to 100.

Hot melt adhesives with pressure sensitive adhesive properties for electronic devices are described. The hot melt adhesive comprises a styrenic block copolymer with fully hydrogenated and saturated soft blocks, a liquid diluent or a tackifier, a (meth)acrylate monomer or an oligomer having at least two (meth)acrylic functionalities per oligomer chain, and an initiator. The hot melt adhesive is also a reworkable UV curable optically clear adhesive film. The adhesive and film are suitable as a laminating PSA film or encapsulant for LCD display, LED display, touch screen, and flexible thin film photovoltaic module.

Hardeners are provided for curing epoxies at lower temperatures than currently available hardeners while retaining superior mechanical and thermal properties. A first component is selected from imidazole, dicyandiamide, or a mixture of polyamines and tertiary amines. A poiyol mixture is then selected. The first component is combined with the polyol mixture to form a hardener. The hardener is combined with epoxy resin and is cured. A method for selecting a hardener to yield an epoxy-hardener system with good properties after curing at a specified temperature and time includes selecting components for the hardener so the glass transition temperature of the cured epoxy-hardener system is not significantly lower than 45° C. above the cure temperature. The method includes steps for adjusting and controlling the ultimate glass transition temperature to maximize the mechanical properties of the epoxy-hardener system. The method regularly produces hardened epoxy systems having about 90% or more epoxy groups reactect.

According to the present invention, a polymerizable composition having excellent storage stability can be provided by adding an acid that serves as a stabilizing agent and a free-radical polymerization inhibitor to a polymerizable composition that contains a polythiol compound and an enic compound having a phenylthio backbone as monomer components. In the present invention, an embodiment in which the acid is at least one compound having a protonic-acid-type functional group which is selected from phosphoric acid, phosphonic acid, phosphinic acid, sulfonic acid, sulfoneimide and carboxylic acid is preferred.

The present invention relates to an encapsulating composition, a barrier layer including the same, and an encapsulated apparatus including the same, and the composition comprises (A) a photocurable monomer and (B) a photocurable monomer containing a carboxylic acid group, wherein (B) the photocurable monomer containing the carboxylic acid group has an amide bond.

The present invention provides a preparation method of an organic mineral complex, a curable composition, a cured product of the curable composition, a hard coating material, a hard coating film and a silane coupling agent. The curable composition can form the hard coating film with pencil hardness, low cured shrinkage, excellent transparency, excellent flexibility and excellent scratch resistance. The curable composition contains, at a specified rate, an organic mineral complex (A) using a silane coupling agent having at least two (methyl) acryloyl groups to perform surface treatment on inorganic oxide particles so as to enable the silane coupling agent to be combined with the inorganic oxide particles with a covalent bond, a multifunctional (methyl) acrylate monomer (B) having at least two (methyl) acryloyl groups, and a polymerization initiator (C). The silane coupling agent is obtained by a condensation reaction between an isocyanate-group-containing compound and a hydroxyl-containing compound, wherein the isocyanate-group-containing compound has an alkoxysilyl group and an isocyanate group, the hydroxyl-containing compound has at least two (methyl) acryloyl groups and at least one hydroxyl group, and the hydroxyl value is more than 75mgKOH/g.

A photosensitive composition suitable for practical waveguide devices is provided. The photosensitive composition comprises at least one multifunctional acrylate prepared from a fluorinated multifunctional alcohol and at least one photoinitiator. The said composition has high photo contrast, high curing speed, controllable refractive index, low curing shrinkage, high thermo-optic coefficient, low volatility and high viscosity. A waveguide device is formed by patterning the photosensitive composition.

The present invention is a curable resin composition comprising a copolymer (A) represented by the following general formula (1), silica fine particles (B), a reactive monomer (C) and a polymerization initiator (D). In the general formula (1), X is an atomic group formed by removing “k” mercapto groups from a multifunctional thiol compound having at least “k” mercapto groups; Y is a monovalent organic group derived from a copolymer formed by copolymerizing unsaturated monomers; and “k” is an integer of 3 to 10. The present invention can provide a hard coat agent which has low curing shrinkage and which has both low curing shrinkage and antiblocking properties as needed; a hard coat film and a hard-coat treated plastic substrate having high pencil hardness and low curling properties, by using this hard coat agent.

XS—Y)_k  (1)

The invention belongs to the biomedical high molecular material technical field, in particular to a preparation method and the application of dental composite resin which contains functional monomer PMDM and modified hydroxyapatite. The preparation method includes the steps: 5%-20% of functional monomer PMDM is added to the substrate resin and placed in a constant-temperature oven; under the temperature of 40 DEG C -80 DEG C, the PMDM is dissolved in the substrate resin and stirred evenly; then photosensitizer and organic amine activator are added to the substrate resin and stirred evenly; then modified inorganic filler is added and diluted in solvent; the amount of solvent is 5%-10% of the mass of the mixture; the mass fraction of inorganic filler is 20%-70% of the total mass; inorganic filler is stirred evenly; the mixture is placed in a vacuum oven and placed under 40 DEG C-80 DEG C for 2-4 hours; the composite resin paste is obtained after the solvent is volatilized completely and the air bubbles are eliminated. The oral cavity repair resin has the advantages of good bond performance, ultrastructure, higher mechanical intensity, higher biocompatibility, having wide application prospect in the oral cavity repair field, having reasonable preparation line, obtainable raw materials, lower price, simple preparation process, having important popularization and application values.

The invention relates to square particle benzoxazine molding plastic. The square particle benzoxazine molding plastic is prepared from the following components by weight percent: 20 to 40 percent of benxoxazine resin, 30 to 60 percent of chopped fibers, 1 to 5 percent of titanium dioxide, 1 to 3 percent of curing accelerant, 1 to 5 percent of thermoplastic polyurethane elastomer rubber, 1 to 3 percent of stearic acid, 0.5 to 2 percent of wax and the balance of wollastonite; and the components are prepared, mixed, extruded, diced, cooled, screened and magnetically selected so as to remove iron,thus obtaining a square finished product. By adopting the formula, the curing shrinkage is small, the mechanical properties are excellent, the flame retardant performance is high, the heat stabilityis high, less fine powder exists, the rate of finished products is increased, and the environment of a molding workshop is protected.

The present invention relates to a photocured composition comprising (A) a photocurable monomer and (B) a monomer of chemical formula 1, a blocking layer comprising the same, and an encapsulated device comprising the same.

The invention relates to white ultraviolet light polymerization resin composition, and a preparation method and an application method thereof. The composition comprises, by weight, the following raw materials: 100 parts of side chains multi-vinyl epoxy resin, 10-100 parts of vinyl end long chains epoxy resin, 1-30 parts of photopolymerization initiators, 5-100 parts of unsaturability monomer, 5-40 parts of thermoplastic acrylic resin, 35-400 parts of inorganic filling materials and 0.5-10 parts of wetting dispersants. The composition is grinded by a three-roll machine to reach certain fineness for printing. The composition is used for printing characters and patterns of circuit boards. By the aid of the composition, definition and plumpness of the characters are enhanced after the characters are printed, and diffusivity of the characters due to printing repeatedly for a plurality of times is reduced.

This invention provides a curable adhesive with excellent thermal cycle resistance. An energy beam curable adhesive includes: (A) 100 parts by mass of (meth)acrylate; (B) 25-150 parts by mass of polyolefin particles; (C) an inorganic filler; and (D) a photoradical polymerization initiator. The (A) (meth)acrylate may include a (A1) mono-functional (meth)acrylate and a (A2) multi-functional (meth)acrylate. The (B) polyolefin particles may include polyethylene particles and/or polypropylene particles.

The present invention relates to a thermosetting resin composition for a semiconductor package and a prepreg using the same. Specifically, a thermosetting resin composition for a semiconductor package which exhibits a low curing shrinkage ratio and has a high glass transition temperature and greatly improved flowability by introducing acrylic rubber and mixing two specific inorganic fillers surface-treated with a binder of a specific composition at a certain ratio, and a prepreg using the same, are provided.

An embodiment relates to an aromatic polythiol compound for optical materials, and the aromatic polythiol compound according to the embodiment contains a phenyl group and a large number of sulfur atoms in its polythiol structure so that a polymerizable composition and an optical material obtained therefrom have excellent optical properties such as high refractive index and low specific gravity, as well as excellent mechanical properties such as low cure shrinkage; thus, they can be advantageously used for producing various plastic optical lenses such as eyeglass lenses and camera lenses.

The present invention relates to a curable resin composition and a cured product. The curable resin composition has excellent reproductivity of curing and processing characteristic in manufacturing process of cured product, can obtain the cured product with stable quality and has low curing shrinkage characteristic. Furthermore the cured product with heat discoloring resistance, low heat expansibility and high transparency can be obtained. The curable resin composition is characterized by comprising the following components as essential components: (A) organic-inorganic compound which comprises more than two aliphatic unsaturated bonds and is composed of cage type siloxane and organic components; (B) olefinic unsaturated compound with at least two (methyl)acryloyls, and (C) solid catalyst, wherein relatively to 100 parts by weight of total amount of (A), (B) and (C), the content of component (A) which uses the organic-inorganic compound as the main component is at least 30 parts by weight.

Provided is an active energy ray curable resin which has excellent compatibility with organic solvents, general purpose acrylic monomers, and oligomers, and a high curing property with an active energy ray, and also has a high adhesion property for each substrate. A cured film obtained by ultraviolet curing of the active energy ray curable resin has an excellent surface curing property, scratch resistance and bending resistance, while also having high transparency. Provided is a urethane modified (meth)acrylamide compound having a urethane bond and one or more (meth)acrylamide groups in the molecule. The urethane modified (meth)acrylamide compound has excellent compatibility with organic solvents, general purpose acrylic monomers, and oligomers, and exhibits a high curing property with an active energy ray. Also provided is an active energy ray curable resin which is obtained with the urethane modified (meth)acrylamide compound and has an excellent surface curing property, scratch resistance, and bending resistance.