56results about How to "Low curing shrinkage" patented technology

The present invention is a curable resin composition characterized by containing (A) a copolymer represented by general formula (1) (in the formula, X denotes an atomic group formed by removing a number (k) of mercapto groups from a polyfunctional thiol compound having at least k mercapto groups, Y denotes a monovalent organic group derived from a copolymer obtained by copolymerizing an unsaturated monomer, and k is an integer between 3 and 10), (B) silica microparticles, (C) a reactive monomer and (D) a polymerization initiator. The present invention can provide a hard coating agent which exhibits little shrinkage upon curing and which can achieve both little shrinkage upon curing and blocking resistance if necessary and, by using the hard coating agent, can also provide a hard coating film or hard coating-treated plastic base material having high pencil hardness and low curling properties.

An epoxy-hardener system is provided having relatively long latency periods combined with relatively short cure times at low cure temperatures. The hardeners of the present invention are ureidoamines and their derivatives, which are chelates of ureido compounds and amines. The ureidoamines are prepared by reacting an amine with the ureido compound and aqueous formaldehyde without a catalyst. Complexes of ureidoamine hardeners with various blocking agents are prepared in the melt. The hardener is prevented from curing the epoxy by the reaction between the hardener and the blocking agent. The blocked hardener is then blended with the epoxy, usually by warming the mixture briefly at about 50-60 degrees C.

The present invention relates to an encapsulating composition, a barrier layer including the same, and an encapsulated apparatus including the same, and the composition comprises (A) a photocurable monomer and (B) a photocurable monomer containing a carboxylic acid group, wherein (B) the photocurable monomer containing the carboxylic acid group has an amide bond.

An object of the present invention is to provide a radiation-curable coating material which forms a cured coating film having high hardness and low curing shrinkage, a radiation-curable resin composition for obtaining the radiation-curable coating material, and a method for forming a protective layer using the radiation-curable coating material. The present invention provides a radiation-curable resin composition including an urethane (meth)acrylate (A), which is obtained by reacting a bicyclo ring-containing polyisocyanate compound (a1), a hydroxyl group-containing, trifunctional or higher polyfunctional (meth)acrylate (a2) and a tris(2-hydroxyalkyl)isocyanurate di(meth)acrylate (a3); a radiation-curable coating material including the above resin composition; and a method for forming a protective layer, which includes: applying the above radiation-curable coating material onto a support to form a layer of the radiation-curable coating material thereon; and irradiating the layer of the coating material with radiation thereby curing the layer of the coating material to form a protective layer.

The present invention relates to a thermosetting resin composition for a semiconductor package and a prepreg using the same. Specifically, a thermosetting resin composition for a semiconductor package which exhibits a low curing shrinkage ratio and has a high glass transition temperature and greatly improved flowability by introducing acrylic rubber and mixing two specific inorganic fillers surface-treated with a binder of a specific composition at a certain ratio, and a prepreg using the same, are provided.

Hot melt adhesives with pressure sensitive adhesive properties for electronic devices are described. The hot melt adhesive comprises a styrenic block copolymer with fully hydrogenated and saturated soft blocks, a liquid diluent or a tackifier, a (meth)acrylate monomer or an oligomer having at least two (meth)acrylic functionalities per oligomer chain, and an initiator. The hot melt adhesive is also a reworkable UV curable optically clear adhesive film. The adhesive and film are suitable as a laminating PSA film or encapsulant for LCD display, LED display, touch screen, and flexible thin film photovoltaic module.

Optical devices of excellent optical and physical properties produced from cured resins are disclosed. The resins and / or the cured hybrid polymer material made with the resins are characterized by a high level of cycloaliphatic-containing groups. Specific additives that can participate in crosslinking the curable polysiloxane provide additional physical property advantages.

Provides polyurethane (meth)acrylamide oligomers with excellent compatibility with organic solvents, general-purpose acrylic monomers, and oligomers, and high curing speed to active energy rays, as well as its adhesiveness, moisture resistance and An active energy ray-curable resin composition having excellent surface curability and low cure shrinkage, and a molded article thereof. Polyurethane (meth)acrylamide oligomers, with a molecular weight selected from carbonate skeletons, diene skeletons or hydrogenated diene skeletons, with one or more (meth)acrylamide groups, and components with a molecular weight of less than 1000 ( The content rate of the hydroxyl group-excluding (meth)acrylamide compound (A)) is 5 weight% or less. Using this oligomer, it is possible to obtain a polyurethane oligomer with excellent compatibility with organic solvents, general-purpose acrylic monomers, and oligomers, and high curability, as well as its adhesiveness, adhesion resistance, moisture resistance and resistance. An active energy ray curable resin composition excellent in shrinkability.