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Energy beam-curable adhesive

An energy ray curing and adhesive technology, which is applied in the direction of adhesives, non-polymer organic compound adhesives, polymer adhesive additives, etc., can solve the problems of easy peeling or whitening, and achieve low curing shrinkage and high Excellent elongation, heat and cold cycle resistance, and storage stability

Active Publication Date: 2017-04-19
DENKA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, in the cooling and heating cycle test repeatedly exposed to low-temperature atmosphere and high-temperature atmosphere, considerable stress is applied to the adhesive due to the difference in linear expansion coefficient of the adherend, so there is a problem that it is easy to peel off or whiten

Method used

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  • Energy beam-curable adhesive
  • Energy beam-curable adhesive
  • Energy beam-curable adhesive

Examples

Experimental program
Comparison scheme
Effect test

experiment example 1～23

[0170] The raw materials of the types shown in Tables 3, 4, and 5 were mixed at the composition ratios (units are parts by mass) shown in Tables 3, 4, and 5 to prepare resin compositions, and the evaluations described later were implemented. Various evaluation results are shown in Table 3, Table 4, and Table 5. Unless otherwise specified, it was carried out in an environment of 23°C and a humidity of 50%.

[0171] [table 3]

[0172]

[0173] [Table 4]

[0174]

[0175] [table 5]

[0176]

[0177] [Viscosity]

[0178] Using a Brookfield viscometer, the viscosity at a predetermined rotational speed (rpm) was measured. It was calculated in the form of Thixotropy (TI)=((viscosity at 2 rpm) / (viscosity at 20 rpm)).

[0179] [Light curing conditions]

[0180] When photocuring, an ultra-high pressure mercury lamp mounting device (“UL-750” manufactured by HOYA CORPORATION) was used, and the irradiation intensity at a wavelength of 365 nm was 200 mW / cm 2 , Cumulative lig...

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Abstract

This invention provides a curable adhesive with excellent thermal cycle resistance. An energy beam curable adhesive includes: (A) 100 parts by mass of (meth)acrylate; (B) 25-150 parts by mass of polyolefin particles; (C) an inorganic filler; and (D) a photoradical polymerization initiator. The (A) (meth)acrylate may include a (A1) mono-functional (meth)acrylate and a (A2) multi-functional (meth)acrylate. The (B) polyolefin particles may include polyethylene particles and / or polypropylene particles.

Description

technical field [0001] The present invention relates to an energy ray-curable adhesive. For example, it relates to an energy ray-curable adhesive having excellent curability and adhesiveness, low curing shrinkage, little adhesive strain, and excellent thermal cycle resistance, and a cured product and a joined product using the same. Background technique [0002] In the field of optoelectronics, with the increase in the performance of equipment, there has been an increase in the adhesion of various dissimilar materials, such as glass, metal, ceramics, plastics, and engineering plastics, as adherends. [0003] In particular, in recent years, engineering plastics represented by polycarbonate, polyphenylene sulfide, and liquid crystal polymer, which are plastics excellent in heat resistance, low thermal expansion, and moldability, have been used instead of metal materials from the viewpoint of device weight reduction. use. However, since engineering plastics generally lack adh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02C08F2/44C09J11/04C09J11/06C09J11/08C09J123/00
CPCC08F2/44C09J11/04C09J11/06C09J11/08C09J123/00C09J4/06
Inventor 后藤庆次汤浅淳一武间淳一郎依田公彦
Owner DENKA CO LTD
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