21 results about "APAO" patented technology

The invention discloses a hot melt adhesive with high initial adhesion strength and a preparation method thereof, and relates to the technical field of hot melt adhesives, the hot melt adhesive comprises the following raw materials by weight: 50-70 parts of APAO resin; 10 to 20 parts of an ethylene-propylene copolymer; 20 to 30 parts of modified petroleum hydrogenated resin; 10 to 20 parts of phenolic terpene resin; 15 to 25 parts of polyethylene wax; 20 to 40 parts of a styrene-butadiene-styrene block copolymer; 0.5 to 1 part of an antioxidant; the modified petroleum hydrogenated resin is prepared by modifying petroleum hydrogenated resin, tetrahydrofuran, triethylamine, p-hydroxyanisole and acryloyl chloride. The hot melt adhesive has the effect of improving the initial adhesion strength of the hot melt adhesive.

The invention provides polyphosphoric acid-polymer composite modified asphalt and a preparation method thereof.The asphalt is prepared from, by weight, 100 parts of matrix asphalt, 0.5-3 parts of polyphosphoric acid, 0.1-0.5 part of stabilizer, 2-5 parts of bio-based plasticizer, 5-15 parts of elastomer particles, 0.5-2 parts of nano reinforcing filler and 1-5 parts of SEBS, 2-5 parts by weight of APAO, and 1-3 parts by weight of organic montmorillonite. The matrix asphalt is modified by the modifiers, so that the modified asphalt has excellent low-temperature performance.

The invention provides a hot melt adhesive and a preparation method thereof, and relates to the technical field of adhesives. According to the hot melt adhesive, amorphous polyolefin (APAO) is used as a main body, ethylene-vinyl acetate copolymer (EVA) is added as a compatilizer, and Fischer-Tropsch wax is used as a viscosity modifier. The preparation method comprises the following steps: firstly synthesizing a dopamine functional polymer, and then carrying out melt blending on the dopamine functional polymer, APAO, EVA, tackifying resin and other components so as to stably introduce a catechol group into a hot melt adhesive system. When the hot melt adhesive is bonded with a metal surface, the catechol group can form a firm coordinate bond with metal ions, so that the adhesive force is greatly improved. The product provided by the invention has high adhesive force, excellent flexibility, good compatibility and construction performance, and is suitable for bonding and sealing metal materials.

The invention discloses a low-polarity hot-melt pressure-sensitive adhesive, which is prepared from the following raw materials in percentage by weight: 50 to 70 percent of APAO polyolefin, 10 to 25 percent of alkane wax, 20 to 30 percent of petroleum resin and 0.1 to 1 percent of antioxidant. The APAO polyolefin with different melt viscosities and different molecular weights at 90 DEG C is adopted, so that the cohesion, flexibility and thermal stability of the colloid can be remarkably improved, and the problem of high-temperature flowing or low-temperature embrittlement generated by the APAO polyolefin with single performance is avoided. According to the invention, the balance between the low viscosity of 3000 + / -300cps at 150 DEG C and the high softening point of more than or equal to 120 DEG C is realized. And moreover, the quick opening time and the wide temperature range adaptability are considered, and the film covering performance of plastic films such as BOPP, PET and PE is improved.

The invention relates to the technical field of photovoltaic module packaging materials, and particularly discloses a novel butyl hot melt adhesive and a preparation method thereof.The novel butyl hot melt adhesive is prepared from, by weight, 60-80 parts of polyisobutene, 15-20 parts of APAO, 5-15 parts of resin particles, 1-5 parts of silane coupling agent and 0.5-2 parts of antioxidant; the resin particles and the silane coupling agent in a specific proportion are introduced into a conventional butyl rubber formula, the bonding performance is remarkably improved, the viscosity and interface wettability of the butyl rubber are enhanced through the resin particles, and the packaging cost is greatly reduced; while the bonding performance is improved, the air tightness, the water tightness and the high and low temperature resistance of the butyl rubber are not influenced, and the environmental requirement of long-term outdoor use of the photovoltaic module is met.

The invention relates to the technical field of sealants, in particular to a packaging material for a photovoltaic module and a preparation method of the packaging material. The packaging material comprises the following components in percentage by weight: 10-20% of APAO, 10-20% of polyisobutene, 2-8% of butyl rubber, 0.1-2% of a silane coupling agent, 0.1-4% of an antioxidant and the balance of filler, and the water vapor transmittance of the packaging material at 38 DEG C and 90% RH is not higher than 0.02 g / (m < 2 >. 24h). The packaging material for the assembly provided by the invention has excellent weather resistance, air tightness and chemical stability, and can effectively prevent moisture, oxygen and the like from eroding the photovoltaic assembly, so that the service life of the assembly is prolonged, and the power generation efficiency of the assembly is improved.

The invention relates to the technical field of heat conduction and insulation of electronic appliances, and discloses a heat conduction and insulation material and a preparation method and application thereof.The heat conduction and insulation material comprises a base material and heat conduction powder, and the base material is selected from a hydrogenated styrene-butadiene-styrene block copolymer (SEBS), an alpha olefin copolymer (APAO) and an ethylene-butyl acrylate copolymer (EBA); through reactive extrusion, an alpha-olefin copolymer (APAO) and an ethylene-butyl acrylate copolymer (EBA) are subjected to a cross-linking reaction under the action of peroxide and form a ternary cross-linked network with a hydrogenated styrene-butadiene-styrene block copolymer (SEBS) through a physical entanglement effect; and meanwhile, the heat-conducting powder is dispersed and fixed in the mixed material in the cross-linking reaction process by utilizing the tackifying and compatibilizing effects of an alpha-olefin copolymer (APAO), so that the ternary-structure semi-intertransmission network elastomer is formed. Excellent mechanical, aging-resistant, temperature-resistant and electrical properties are realized, and the cost benefit is high; the method is suitable for electronic equipment.

The invention discloses a multi-layer composite hot melt adhesive film and a preparation process thereof and a composite board, and relates to the field of adhesives, the multi-layer composite hot melt adhesive film comprises a low-temperature layer, a high-temperature layer and a core layer, the low-temperature layer is used for being bonded with PET, the high-temperature layer is used for being bonded with metal, the core layer is used for being bonded with the low-temperature layer and the high-temperature layer, the low-temperature layer is a modified polyolefin hot melt adhesive film, and the high-temperature layer is a modified polyolefin hot melt adhesive film. The high-temperature layer is a polyolefin hot melt adhesive film; the core layer comprises the following raw materials in parts by weight: 26-32 parts of ethylene-vinyl acetate copolymer; 40 to 48 parts of an amorphous plastomer APAO; 2-4 parts of a polypropylene-alkenyl-containing epoxy compound copolymer; 5-8 parts of nylon type copolyamide; 1 to 3 parts of a silane coupling agent KH-550; the nylon type copolyamide is a polymer of nylon 12 and caprolactam. According to the prepared hot melt adhesive film, the PET layer and the metal plate are bonded together, the bonding strength is high, and water resistance, high temperature resistance and corrosion resistance are achieved.

The invention discloses a hot-melt pressure-sensitive adhesive for a packaging bag and a preparation method of the hot-melt pressure-sensitive adhesive. The hot-melt pressure-sensitive adhesive is prepared from the following components in parts by weight through a polymerization reaction: 5-10 parts of a plasticizer; 25 to 45 parts of APAO; 40 to 60 parts of tackifying resin; 3 to 8 parts of sasol wax; the hot-melt pressure-sensitive adhesive provided by the invention has the characteristics of high bonding strength and good high temperature resistance.

The application provides a polyphosphoric acid-polymer composite modified asphalt and a preparation method thereof. The asphalt comprises the following components by weight parts: 100 parts of base asphalt, 0.5-3 parts of polyphosphoric acid, 0.1-0.5 parts of a stabilizer, 2-5 parts of a bio-based plasticizer, 5-15 parts of elastomer particles, 0.5-2 parts of nano-enhanced fillers, 1-5 parts of SEBS, 2-5 parts of APAO and 1-3 parts of organic montmorillonite. The base asphalt is modified by various modifiers, so that the modified asphalt has excellent low-temperature performance.

The invention discloses a hot melt adhesive with high cohesion and a preparation method thereof, and relates to the technical field of hot melt adhesives. The invention relates to a hot melt adhesive with high cohesion, which comprises 50-64 parts of matrix resin, 18-24 parts of tackifying resin, 3.2-4.5 parts of polyethylene wax, 1.5-2.4 parts of biological wax material, 10-16 parts of modified starch particles, 1.2-3.2 parts of maleic anhydride grafted polyethylene and 0.8-1.2 parts of antioxidant, the matrix resin comprises maleic anhydride grafted APAO resin and PHBV resin, and the tackifying resin comprises maleic anhydride grafted APAO resin and PHBV resin. The tackifying resin comprises C5 hydrogenated petroleum resin and rosin polyol ester, and the biological wax material comprises any one of soybean wax, beeswax or palm wax. The maleic anhydride grafted APAO resin and the PHBV resin are used as matrix resins, and a plurality of bio-based assistants are matched, so that the degradation efficiency of the hot melt adhesive is greatly improved, the hot melt adhesive can be fully degraded or hydrolyzed by microorganisms in the environment after being discarded, and the hot melt adhesive has certain environmental protection property.

The present application relates to the technical field of sealant, in particular to a kind of encapsulating material for photovoltaic module and preparation method thereof.By percentage of weight, component includes: APAO 10-20%, polyisobutylene 10-20%, butyl rubber 2-8%, silane coupling agent 0.1-2%, antioxidant 0.1-4%, filler makes up the rest, the water vapor transmission rate of the encapsulating material under 38 DEG C, 90%RH is not higher than 0.02g / (m 2 ·24h).The encapsulating material for module provided by the present application has excellent weather resistance, air tightness and chemical stability, can effectively prevent the erosion of moisture and oxygen and the like to photovoltaic module, thereby improving the service life and power generation efficiency of module.

The present invention discloses a direct-injection high-modulus polymer asphalt modifier, which is mainly prepared from the following components by weight: 25-55 parts of PTW resin, 30-45 parts of PCTA resin, 4-15 parts of APAO-g-MAH resin compatibilizer, and 3-10 parts of core-shell butadiene rubber. The melt index of the PTW resin is 12g / 10min at 190°C and a load of 2.16kg. The specific gravity of the PCTA resin is 1.2g / cm 3 , Rockwell hardness R grade 103. Based on the same inventive concept, the present invention also provides a method for preparing a direct-cast high-modulus polymer asphalt modifier. The present invention also provides the use of a direct-cast high-modulus polymer asphalt modifier or asphalt mixture as a road building material in road maintenance or road construction. The present invention solves the problem of pavement damage by introducing a high-fluidity polymer alloy crosslinking agent to improve the adhesion between the surface layer and the middle and lower layers, increase the crosslinking degree and pavement toughness, and add a high-strength and high-toughness resin and an impact modifier.

The present invention relates to a resin composition and application thereof, the resin composition comprising amorphous poly alpha olefin (APAO) and isotactic polypropylene, wherein the amorphous poly alpha olefin is a copolymer obtained by polymerizing propylene and an alpha olefin monomer, other than propylene, having 2 to 20 carbon atoms, and the isotactic polypropylene has a glass transition temperature of -30℃ or less and a softening point of 150℃ or higher.

The present application relates to the technical field of adhesive, and provides a hot melt adhesive containing polyolefin and wax and a preparation method thereof, which comprises the following components in parts by weight: naphthenic oil 0-15 parts by weight, white oil 0-10 parts by weight, SBS rubber 5-20 parts by weight, SIS rubber 5-25 parts by weight, amorphous polyolefin elastomer (APAO) 0-15 parts by weight, polypropylene (PP) 0-10 parts by weight, wax 0-10 parts by weight, hydrogenated petroleum resin 15-55 parts by weight, rosin resin 1-10 parts by weight, and antioxidant 0.01-1 parts by weight. The present application solves the problems of poor bonding effect and poor low-temperature resistance of most hot melt adhesives on the market on materials such as kraft paper, copper plate paper, corrugated paper, laminated packaging paper, non-woven fabric and cotton fabric.

Compositions comprising: (a) from 0.05% to 50% by weight of at least one amorphous poly-alpha-olefin (APAO) having chains with an average maximum end-to-end distance (Rmax) greater than or equal to 1.6*10-6 m; (b) from 35% to 95% by weight of a liquid phase selected from: vegetable oils, synthetic organic esters, linear or branched saturated hydrocarbons, aromatic hydrocarbons, and mixtures thereof; (c) from 0 to 15% by weight of an anti-sticking agent; the weight percentages being calculated on the basis of the total weight of the composition. The APAOs are obtained by a polymerization process of at least one alpha-olefin monomer, carried out at a temperature not higher than 40°C, by using a catalytic system comprising (i) a bimetallic catalyst containing: titanium in the oxidation state +3 (Ti(III)), and optionally titanium in the oxidation state +4 (Ti(IV)); and at least one metal selected from hafnium in the oxidation state +4 (Hf(IV)) and zirconium in the oxidation state +4 (Zr(IV)); and (ii) at least one organoaluminum co-catalyst. Such compositions have a drag reduction effect higher than that achieved by using amorphous poly-alpha-olefins synthetized by means of conventional Ziegler Natta catalytic systems containing only titanium and aluminum as metals.

The present invention discloses a low-temperature hot melt adhesive and a preparation method thereof, and relates to the technical field of polyolefin system hot melt adhesive. A low-temperature hot melt adhesive comprises 45-65 parts of base resin, 28-44 parts of tackifying resin, 3-6 parts of SIS rubber, 3-6 parts of wax, 1.6-2.5 parts of polyisobutylene, 5-8 parts of maleic anhydride grafted POP, 3-4 parts of reinforcing fillers and 0.5-1 parts of antioxidant, wherein the base resin comprises APAO resin, the tackifying resin comprises a petroleum liquid resin and at least one of C5 hydrogenated petroleum resin or C5 / C9 copolymerized petroleum resin, and the SIS rubber is a SIS rubber containing 25%-35% of diblock SI. By using APAO resin as the base resin of the hot melt adhesive, in combination with tackifying resin, SIS rubber and reinforcing filler, the obtained polyolefin hot melt adhesive has a lower softening point, can be melted and used normally without being heated to above 150°C, is conducive to reducing the risk of being scalded during use, and greatly improves the safety of the polyolefin hot melt adhesive.

The invention provides an electronic hot melt adhesive composition which is characterized by comprising the following components in parts by weight: 15-35 parts of APAO resin, 12-30 parts of EVA resin, 25-45 parts of tackifying resin, 0.1-4 parts of white oil, 2-10 parts of wax powder, 1-5 parts of titanium dioxide, 0.1-1 part of an antioxidant and 1-10 parts of barium titanate. Wherein the number average molecular weight of the APAO resin ranges from 11000 g / mol to 14000 g / mol; the melt viscosity at the temperature of 190 DEG C is 8000 to 30000 mPa. S; the VA content of the EVA resin is 20 to 35 percent; the electronic hot melt adhesive has the advantages of good heat resistance, high viscosity at high temperature, high dielectric strength and high volume resistivity.

The invention belongs to the field of hot melt adhesives, and particularly relates to a hot melt adhesive as well as a preparation method and application thereof. The hot melt adhesive disclosed by the invention is an A-B double-component reactive polyolefin hot melt adhesive, the A component contains amorphous-alpha-polyolefin copolymer (APAO) with three different softening points and maleic anhydride grafted resin, and the B component comprises two acrylate monomers, namely TMPTMA and TMPTA, so that the hot melt adhesive has better adhesive property, and the hot melt adhesive has the advantages of high temperature resistance, high heat resistance, high heat resistance and the like. Various materials such as PP (polypropylene), ABS (acrylonitrile butadiene styrene), PC (polycarbonate), PVC (polyvinyl chloride), paint, textile fabrics, non-woven fabrics and the like can be adhered, and the application range to base materials is wide; meanwhile, the hot melt adhesive is good in high and low temperature resistance and long in opening time, and long construction time is provided under the condition that the requirement for heat resistance is met; in addition, the hot melt adhesive disclosed by the invention is low in viscosity, relatively appropriate in softening point and more convenient to construct.

The invention provides a packaging adhesive film and a preparation method and application thereof, the packaging adhesive film comprises a first EVA layer, a middle POE layer and a second EVA layer, the first EVA layer and the second EVA layer are prepared from the following raw materials: 80-99 parts of EVA resin, 0.01-0.1 part of a charge dissipation agent, 0.1-2 parts of a first cross-linking agent, 0.1-2 parts of a modified assistant cross-linking agent, 0.1-1 part of a silane coupling agent and 0.01-0.2 part of a first light stabilizer; the second EVA layer further comprises 0.01 to 0.2 part of an ultraviolet light absorber; the middle POE layer is prepared from the following raw materials: 60 to 80 parts of POE resin, 10 to 20 parts of modified POE resin, 10 to 20 parts of APAO resin, 0.1 to 2 parts of a second cross-linking agent, 0.1 to 2 parts of an assistant cross-linking agent and 0.01 to 0.2 part of a second light stabilizer. The packaging adhesive film has the advantages of excellent anti-PID performance, low haze and low auxiliary agent migration.