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Systems and methods for providing surface connectivity of oriented conductive channels

A conductive layer and conductive particle technology, applied in the field of forming conductive composite materials, conductive composite materials, conductive adhesives, conductive pads and conductive films, can solve the problems of not providing sufficient adhesion and conductivity

Active Publication Date: 2015-07-29
FLEXCON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such composites do not provide sufficient adhesion and conductivity for some applications

Method used

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  • Systems and methods for providing surface connectivity of oriented conductive channels
  • Systems and methods for providing surface connectivity of oriented conductive channels
  • Systems and methods for providing surface connectivity of oriented conductive channels

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] A conductive carbon dispersion of FLEXcon's EXV-216 carbon dispersion was coated onto a 2 mil (50 μ) polyethylene terephthalate (PET) film with a surface impedance of about 80 Ω / sq. 2.5 mil (63[mu]) of FLEXcon's V-12HW dispersion with 10% conductive carbon (by weight on total solids) was coated thereon. Using the AAMI impedance test scheme described above, the impedance in the "Z" direction of the test profile is measured with an average value of 1300kΩ. When a ring constructed of FLEXcon's EXV-216 and having a 0.69" (17.5mm) O.D. and a 0.25" (6.36mm) I.D. was placed on top of the V-12HW / carbon mixture on each of the two electrodes and then When the two electrodes were placed face-to-face with the ring and V-12HW adhesive in contact with each other, the resulting Z-direction impedance averaged 775Ω.

[0060] The difference in impedance is believed to be the result of the conductive rings contacting a small number of random, occasional, Z-direction conductive pathways t...

Embodiment 2

[0069] A silver nanoparticle dispersion (designation 120727-01) obtained from Chasm Technology Inc. (480 Neponset Road, Canton, MA 02021 ) was mixed into FLEXcon V-95 at a ratio of About 0.75% silver by dry weight of binder polymer. Samples were prepared as described for the carbon particle system and were applied as 1.3 mil (32.5 μ) dry deposition to an EXV-216 conductive carbon coating, resulting in a surface resistance of about 80 Ω / sq versus 2 mil white PET film. The silver nanoparticles and V-95 mixture was then coated to produce a 2 mil dry thickness. A dry mixture of binder (V-95) nanoparticles was then applied to a stainless steel plate, which served as the ground for the activation stage. For activation, a 10 μF capacitor was charged to 200 VDC and discharged through a 20 KΩ resistor, grounded through the V-95 / silver nanoparticles mixture.

[0070] With an average initial impedance of 5200 KΩ measured at 10 Hz and 20 mV, the sample then yielded an average value of 1...

Embodiment 3

[0072] The second carbon dispersion was prepared by mixing about 5% "Black Pearl" carbon black (from Cabot Corporation, Boston, MA) and about 7% (on a solid basis) into FLEXcon V-95PSA ) Arquad HTL8-MS (which is used more herein as a dispersant aid). A 2 mil (50 μm) dry coating was applied to the substrate (2 mil (50 μm) white PET coated with EXV-216 from FLEXcon Corporation) to a surface resistance of 80 Ω / in2. The average value of impedance before activation was 2.5 MΩ; the average value of impedance after activation was 2.7 KΩ. Activation conditions were the same as previously used carbon dispersions (from AAMI EC 12-2000–4.2.2.4 Test equipment used in defibrillation overload recovery tests).

[0073] According to one embodiment of the invention, the continuous dielectric layer may be covered with a conductive bridging layer spanning 100% of the surface of the dielectric layer. In this case, any adhesive properties of the continuous dielectric layer are eliminated.

[00...

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Abstract

An electrically conductive composite is disclosed that includes a dielectric material having a first side and a second side, conductive particles within the dielectric material layer, and a discontinuous layer of a conductive material on a first side of the dielectric layer. The conductive particles are aligned to form a plurality of conductive paths from the first side to the second side of the dielectric material, and each of the conductive paths is formed of at least a plurality of conductive particles. The discontinuous layer includes a plurality of non-mutually connected portions that cover portions of, but not all of, the first side of the dielectric material such that exposed portions of the underlying first side of the dielectric material remain exposed through the discontinuous layer, yet the discontinuous layer facilitates the electronic coupling together of a plurality of the conductive paths from the first side to the second side of the dielectric material.

Description

[0001] priority [0002] This application claims priority to U.S. Utility Application Serial No. 14 / 209,213, filed March 13, 2014, which is a continuation-in-part of U.S. Patent Application Serial No. 13 / 834,948, filed March 15, 2013, the disclosure of which is incorporated by reference in its entirety incorporated into this article. Background technique [0003] The present invention generally relates to conductive polymers and elastomeric materials for a variety of applications including, but not limited to, conductive adhesives, conductive pads, and conductive films. [0004] For example, the design of conductive pressure sensitive adhesives (PSAs) has long been challenging, at least because bond strength and flexibility generally decrease with increasing conductivity. Materials typically used (added to) to provide good conductivity are generally less flexible and inhibit adhesion. One conventional method of making conductive coatings is to fill the polymeric material wit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/20
CPCC25D13/00H01B1/20H05K1/0296H01B1/24H01B1/22C09J9/02
Inventor K·伯纳姆R·斯科弗S·托马斯J·阮S·皮佐L·克里斯利普
Owner FLEXCON