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Temperature-controllable heating disc with spider-web-shaped surface structure

A technology of surface structure and heating plate, which is applied in the direction of gaseous chemical plating, coating, electrical components, etc., can solve the problem that the wafer temperature cannot be controlled quickly and accurately, and achieve the effect of enhancing heat conduction efficiency and improving yield

Inactive Publication Date: 2015-08-12
PIOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the above problems, and mainly solve the problem that the existing heating plate and electrostatic chuck cannot quickly and accurately control the wafer temperature

Method used

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  • Temperature-controllable heating disc with spider-web-shaped surface structure

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Embodiment 1

[0013] Such as figure 1 As shown, a temperature-controllable heating plate with a spider web-shaped surface structure includes a heating plate 4 with a central air inlet 1 . The surface of the heating plate 4 is designed with a spider web-shaped groove structure and the edge is formed with gas recovery holes 3 . The spider web-shaped groove structure is composed of N gas flow annular grooves 2 and N gas flow radial grooves 5 arranged along the center of the heating plate 4. The gas flow annular grooves 2 and the gas flow radial grooves The number of grooves depends on actual needs. The above-mentioned annular groove 2 is in contact with and communicates with the gas flow radial groove 5 .

[0014] At least two of the above-mentioned annular grooves 2 and gas flow radial grooves 5 are selected.

[0015] Working principle of the present invention: the heat transfer medium enters the surface of the heating plate 4 from the central air inlet 1 of the heating plate 4, and a circ...

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Abstract

The invention relates to a temperature-controllable heating disc with a spider-web-shaped surface structure. The temperature-controllable heating disc comprises a heating disc with a central gas inlet; a spider-web-shaped trench structure is designed on the surface of the heating disc; and gas recovery holes are formed at the edge of the heating disc, wherein the spider-web-shaped trench structure is composed of N gas flowing annular trenches and N gas flowing radial trenches which are arranged at the center of the heating disc, wherein the annular trenches are connected and communicated with the gas flowing radial trenches. According to the temperature-controllable heating disc with the spider-web-shaped surface structure of the invention, a certain air gap can be formed between the surface of the heating disc and wafers through adopting the air incoming channels; and a heat conduction gas with an excellent heat conduction effect is led into the air gap so as to be adopted as a heat transfer medium, and can fast transfer heat passing through the heating disc to the wafers or fast transfer heat on the waters to the heating disc to lead out the heat. The structural design of the surface of the heating disc is reasonable, so that the heat conduction medium can flow in the gap fast and evenly, so that heat exchange between the heating disc and the wafers can be realized timely.

Description

technical field [0001] The invention relates to a disk surface structure of a temperature-controllable heating disk applied to semiconductor deposition equipment. The spider web-shaped gas distribution form is used to achieve precise control of the wafer temperature. The invention belongs to the technical field of semiconductor thin film deposition application and manufacture. Background technique [0002] Semiconductor equipment often needs to preheat the wafer and chamber space or maintain the temperature required for the deposition reaction during the deposition reaction. Most semiconductor deposition equipment uses heating plates or electrostatic chucks to achieve the purpose of preheating the wafer. However, because the deposition reaction is mostly carried out under vacuum conditions, the vacuum environment has poor thermal conductivity due to the lack of heat-conducting media. It is often not possible to preheat the wafer to the required temperature quickly, or to p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCC23C16/54C23C16/0209H01L21/67098H01L21/68714
Inventor 陈英男姜崴郑旭东关帅
Owner PIOTECH CO LTD
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