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Mask plate applied to laser radiation and laser encapsulation method

A technology of laser irradiation and masking, applied in sputtering coating, vacuum evaporation coating, coating and other directions, can solve the problems of lower utilization rate of substrates, difficult and narrow frame design of display panels, etc., and achieve the effect of improving utilization rate

Active Publication Date: 2015-08-19
BOE TECH GRP CO LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0004] However, since the diameter φ of the laser spot is greater than the cross-sectional width d of the sealant, the laser will not only irradiate the sealant, but also irradiate both sides of the sealant. Due to the high energy of the laser beam, its instantaneous temperature can be In order to prevent the heat generated by the laser beam from burning the electronic devices inside the display panel, it is necessary to reserve a certain safe area between the electronic device and the packaging area when designing the display panel (with a distance of at least 0.7mm) to avoid the above-mentioned laser burning; therefore, due to the limitation of the reserved safe area, it is difficult for the display panel to further realize the narrow frame design, and at the same time, it will reduce the utilization rate of the substrate

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  • Mask plate applied to laser radiation and laser encapsulation method
  • Mask plate applied to laser radiation and laser encapsulation method
  • Mask plate applied to laser radiation and laser encapsulation method

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Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0034] It should be noted that, unless otherwise defined, all terms (including technical and scientific terms) used in the embodiments of the present invention have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. It should also be understood that terms such as those defined in common dictionaries should be interpreted as having meanings consistent with their meanings in the context of the rel...

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Abstract

The embodiment of the invention provides a mask plate applied to laser radiation and a laser encapsulation method, and relates to the technical field of encapsulation. The mask plate can be applied to encapsulation of a display panel with a narrow border design, so that the display effect of the encapsulated display panel is improved; meanwhile, the utilization rate on a substrate is improved; and the cost is reduced. The mask plate comprises a laser block area and a laser transmission area, wherein the laser transmission area encircles the laser block area, and corresponds to an encapsulation area of a to-be-encapsulated panel; the laser block area corresponds to a device area which is encircled by the encapsulation area in the to-be-encapsulated panel; the section width of the laser transmission area is smaller than the spot diameter of the laser along the panel direction vertical to the mask plate; the section width of the laser transmission area is greater than or equal to that of the encapsulation area. The laser encapsulation method is applied to preparation of the mask plate.

Description

technical field [0001] The invention relates to the field of packaging technology, in particular to a mask plate applied to laser irradiation and a laser packaging method. Background technique [0002] After the display panel is prepared, because the internal electronic devices, such as the OLED (Organic Light-Emitting Display) display panel, the OLED device inside the display panel is very easy to react with the water and oxygen in the air, causing the device performance to fail. Therefore, the display panel needs to be tested. encapsulation. Such as figure 1 As shown, the main steps of the packaging process are: the first substrate coated with the sealant is combined with the second substrate to form a display panel to be packaged; the laser emitted by the laser generator (as shown in the direction of the arrow in the figure ) through the mask plate to irradiate the display panel to be packaged, so that the laser passes through the transmission area of ​​the mask plate t...

Claims

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Application Information

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IPC IPC(8): C23C14/04H01L51/56
CPCH10K71/00H10K59/8722H10K71/166H10K50/8426C23C14/042C23C14/58
Inventor 洪瑞
Owner BOE TECH GRP CO LTD