Control method and control device for temperature of substrate as well as film deposition equipment
A technology of substrate temperature and control method, which is applied in the field of substrate temperature control and thin film deposition equipment, can solve the problems of large randomness and uncertainty, achieve enhanced uniformity and density, ensure quality, and improve adhesion Effect
Active Publication Date: 2015-08-19
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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This method often relies heavily on the operating experience of the craftsman, and there is greater randomness and uncertainty
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[0036] Specific embodiments of the present invention will be described in detail below. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.
[0037] The invention provides a method for controlling the substrate temperature, wherein the substrate is placed on a hollow sample stage, and a coolant circulates in the hollow area of the sample stage. Control method of the present invention specifically comprises the following steps:
[0038] S100, measuring the temperature of the coolant flowing into the sample stage to obtain the inflow temperature; measuring the temperature of the coolant flowing out of the sample stage to obtain the outflow temperature.
[0039] S200, calculating the difference between the outflow temperature and the inflow temperature.
[0040] S300, adjust the flow rate of the coolant according to the difference obtained in st...
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Abstract
The invention discloses a control method and a control device for the temperature of a substrate as well as film deposition equipment, wherein the substrate is arranged on a hollow sample stage; a flowing coolant is introduced into a hollow area of the sample stage; the substrate temperature is controlled by adopting the following mode: measuring the temperature of the coolant on flowing into the sample stage to obtain an inflow temperature; measuring the temperature of the coolant flowing out of the sample stage to obtain an outflow temperature; calculating the difference between the inflow temperature and the outflow temperature; adjusting the flow of the coolant according to the difference, and controlling the temperature of the substrate according to the flow of the coolant. According to the control method and the control device disclosed by the invention, accurate control over the temperature of the substrate is realized, the quality of a deposited film is guaranteed, and the controllability and the repeatability of the process are greatly improved.
Description
technical field [0001] The invention relates to the field of thin film processing and preparation, in particular to a substrate temperature control method, device and thin film deposition equipment. Background technique [0002] The cooling control of the substrate temperature in a high temperature state has a direct impact on the high temperature treatment and reaction process, especially the thermal plasma thin film deposition process. Taking arc plasma as an example, arc preparation is carried out in high pressure, and the arc temperature is as high as thousands or even tens of thousands of degrees. In order to achieve thermodynamic equilibrium deposition conditions, the substrate needs to be cooled to meet the process requirements of thin film deposition; The quality of film deposition and the controllability and repeatability of film deposition process must strictly control the substrate temperature. [0003] At present, thin film deposition is generally achieved by pa...
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IPC IPC(8): C23C14/54C23C14/50C23C14/32
Inventor 叶继春韩灿邬苏东高平奇杨映虎张胜
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI