Manufacturing method for flexible printed circuit board, and intermediate product thereof
A technology of flexible printing and manufacturing method, applied in the directions of printed circuit manufacturing, printed circuit, multilayer circuit manufacturing, etc., can solve the problems of difficult multi-layering, difficult inner layer substrate and outer layer substrate, etc.
Active Publication Date: 2015-08-19
NIPPON MEKTRON LTD
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Problems solved by technology
However, in the method disclosed in Patent Document 2, it is difficult to align the position of the inner layer base material and the outer layer base material, so it is difficult to achieve multilayering.
Method used
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no. 1 approach
[0052] (1) The first step: preparation of the continuous substrate 10
[0053] figure 1 It is a perspective view schematically showing the roll state of the continuous base material 10 .
[0054] First, prepare as figure 1 The continuous substrate 10 is shown. The continuous base material 10 is not a rectangular substrate, but can be continuously drawn out from the portion wound into a roll, and rewound into a roll after processing.
[0055] exist figure 2 In the illustrated configuration, the continuous substrate 10 is provided with conductive layers 12 on both surfaces of a flexible and electrically insulating substrate 11 . The base material 11 corresponds to a first base material. The base material 11 is formed of, for example, a polyimide film, but the material of the base material 11 may be other materials as long as it has flexibility and insulating properties. In addition, the conductor layer 12 corresponds to the first conductor layer. The conductive layer 12 ...
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The invention provides a manufacturing method for a flexible printed circuit board, and an intermediate product thereof. According to the manufacturing method for the flexible printed circuit board (P), a strip-shaped continuous base material (10) with a first substrate (11) and a first conductor layer (12) is led out. Meanwhile, various layers are laminated on the above continuous base material (10) to realize the multiple stratification effect. The first substrate (11) is electrically insulated. The first conductor layer (12) is electricity-conductive. The manufacturing method comprises an adhesive material pressing process and a laminate substrate laminating process. During the adhesive material pressing process, a rectangular adhesive sheet (40) is laminated on the continuous base material (10). The laminate substrate laminating process is conducted before or after the adhesive material pressing process. During the laminate substrate laminating process, a rectangular laminate substrate (50) is aligned with an adhesive sheet (40) to be laminated onto the adhesive sheet (40). The laminate substrate (50) is composed of an electrically insulated second substrate (51) and an electrically conductive second conductor layer (52).
Description
technical field [0001] The present invention relates to a method for manufacturing a flexible printed circuit board and intermediate products thereof. Background technique [0002] In recent years, along with miniaturization and higher performance of electronic equipment, there has been an increasing demand for higher density of flexible printed circuit boards (Flexible printed circuits; hereinafter referred to as “circuit boards”). The flexible circuit board includes a single-sided circuit board, a double-sided circuit board and a multilayer circuit board, wherein the single-sided circuit board and the double-sided circuit board are mainly manufactured by a roll-to-roll continuous manufacturing method, On the other hand, multilayer circuit boards are mainly manufactured by a short-cut-cut manufacturing method in which cut sheets are bonded and moved. It can be seen that the production line for manufacturing single-sided circuit boards and double-sided circuit boards is dif...
Claims
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IPC IPC(8): H05K3/46H05K1/02
CPCH05K3/4644H05K2203/068
Inventor 宫本雅郎
Owner NIPPON MEKTRON LTD