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Levelness measuring device and method

A technology of levelness measurement and levelness, which is applied in the field of measurement, can solve the problems of lack of levelness and relative distance measurement devices, and achieve the effect of simple structure and suitable for popularization and application

Active Publication Date: 2015-08-26
ACM RES SHANGHAI
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is currently no levelness and relative distance measuring device suitable for the aforementioned process

Method used

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  • Levelness measuring device and method
  • Levelness measuring device and method

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Embodiment Construction

[0021] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0022] The measuring device proposed by the invention has two functions of measuring levelness and relative distance. Therefore, it can be called a levelness and relative distance measuring device. When performing levelness measurements, the measuring device can also be considered to be a levelness measuring device.

[0023] refer to figure 1 and image 3 , figure 1 Discloses a top view of a first embodiment of the levelness and relative distance measuring device of the present invention, image 3 A side view of a first embodiment of the levelness and relative distance measuring device of the present invention is disclosed. combine figure 1 and image 3 , the measurement device 100 includes a reference plane 101, a measurement probe...

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Abstract

The invention discloses a levelness measuring device and method for measuring the levelness of an object to be measured. The levelness measuring device comprises a reference plane, a plurality of measuring probes, a reference probe, a power supply, a servo motor and a controller, wherein the reference plane comprises upper and lower surfaces; the plurality of measuring probes are arranged on the upper surface of the reference plane, and the height by which the plurality of measuring probes are higher than the upper surface of the reference plane is known; the reference probe is arranged on the upper surface of the reference plane, and the reference probe is higher than the measuring probes; an electrode of the power supply is electrically connected with the plurality of measuring probes, and another electrode of the power supply is electrically connected with the reference probe; the servo motor drives the object to be measured to move in the vertical direction; and the controller receives and records feedback values of the servo motor when the plurality of measuring probes are in contact with the object to be measured, and judges whether the levelness of the object to be measured meets the requirement according to the feedback values of the servo motor. The invention further discloses a method for measuring the levelness of an object to be measured by using the levelness measuring device.

Description

technical field [0001] The invention relates to the field of measurement technology, in particular to a levelness and relative distance measuring device and method for measuring the levelness of an object to be measured and the relative distance between the object to be measured and the measuring device. Background technique [0002] With the rapid development of semiconductor technology and the continuous reduction of the feature size of semiconductor devices, the requirements for process precision are getting higher and higher. In each step of the process, the detection and calibration of the process equipment is an important link to ensure the accuracy of the process. For example, in the electrochemical polishing process, the wafer chuck holds the wafer and carries the wafer to the top of the nozzle, the surface to be polished of the wafer faces the nozzle, and the electrolyte is sprayed to the surface to be polished of the wafer through the nozzle to The wafer is electr...

Claims

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Application Information

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IPC IPC(8): G01B7/34G01B7/14H01L21/66
Inventor 金一诺王坚王晖
Owner ACM RES SHANGHAI
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