Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Optical coupling device and method of forming the same

An optical coupling device and bonding technology, which is applied in the coupling of optical waveguides, semiconductor devices, electrical components, etc., can solve the problems of unfavorable optical waveguide device performance and low coupling efficiency, and achieve the effect of preventing mutual interference and improving performance

Active Publication Date: 2017-05-17
SEMICON MFG INT (SHANGHAI) CORP +1
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the coupling efficiency of the grating coupling technology in the prior art is low, which is not conducive to improving the performance of the optical waveguide device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Optical coupling device and method of forming the same
  • Optical coupling device and method of forming the same
  • Optical coupling device and method of forming the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] In the three-dimensional packaging structure of the prior art, grating coupling is usually used to realize the connection between two planar optical waveguides on the silicon substrate. Since the grating coupling is not reflective coupling, the loss of light waves during the coupling process Larger, the coupling efficiency is very low, usually the grating coupling efficiency is only 20% to 70%.

[0038] To this end, an embodiment of the present invention provides an optical coupling device and a method for forming the same. The coupling device of the present invention includes: a first semiconductor substrate and a second semiconductor substrate. The first groove on the first surface of the bottom, the sidewall of the first groove has a first inclination angle, the first reflective layer is provided on the sidewall and bottom surface of the first groove; the second semiconductor substrate has A second groove that runs through the third surface of the second semiconducto...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Provided is an optical coupling device and a forming method thereof. The optical coupling device comprises a first semiconductor substrate, a first groove, a first reflecting layer, a second semiconductor substrate, a second groove, and a second reflecting layer. The first semiconductor substrate comprises a first surface and a second surface opposite to the first surface. The first groove is arranged in the first semiconductor substrate and passes through the first surface of the first semiconductor substrate. The sidewall of the first groove is provided with a first inclination angle. The first reflecting layer is arranged on the surfaces of the sidewall and the bottom of the first groove. The second semiconductor substrate comprises a third surface and a fourth surface opposite to the third surface. The second groove is arranged in the second semiconductor substrate and passes through the third surface of the second semiconductor substrate. The sidewall of the second groove is provided with a second inclination angle. The first inclination angle and the second inclination angle are mutually complementary. The second reflecting layer is arranged on the surfaces of the sidewall and the bottom of the second groove. The first surface of the first semiconductor substrate and the third surface of the second semiconductor substrate are bonded together in order that the first groove and the second groove correspond to each other. The optical coupling device improves coupling efficiency.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, and more to an optical coupling device and a forming method thereof. Background technique [0002] An optical waveguide is a guiding structure that transmits optical frequency electromagnetic waves composed of an optically transparent medium (such as quartz glass). The transmission principle of the optical waveguide is that the total reflection phenomenon of the electromagnetic wave confines the light wave to propagate in the waveguide and its surrounding limited area on the medium interface with different refractive indices. [0003] Among the many optical waveguide materials used in the communication band, silicon-on-insulator materials are easy to produce submicron low-loss optical waveguides due to their strong light confinement ability, and the preparation process is compatible with the fabrication process of microelectronic integrated circuits, which greatly The cost of preparing...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/12H01L31/18G02B6/24
CPCG02B6/24H01L31/12H01L31/18H01L31/1876Y02P70/50
Inventor 陈福成洪中山
Owner SEMICON MFG INT (SHANGHAI) CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products