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Printed circuit board assembly information system and its realization method

A printed circuit board and information system technology, which is applied to the assembly of printed circuits with electrical components, collaborative devices, instruments, etc., can solve the problems of long production cycle and high assembly cost

Active Publication Date: 2017-11-03
EAST CHINA UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a printed circuit board assembly information system and its implementation method, which effectively solves the technical problems of high assembly cost and long production cycle of small and medium-sized printed circuit boards in the prior art

Method used

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  • Printed circuit board assembly information system and its realization method
  • Printed circuit board assembly information system and its realization method
  • Printed circuit board assembly information system and its realization method

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Embodiment Construction

[0085] The specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that those skilled in the art can more clearly understand how to implement the present invention. It should be understood that although the invention has been described in terms of preferred embodiments thereof, these are illustrative of the embodiments only, and are not intended to limit the scope of the invention.

[0086] like figure 1 A printed circuit board assembly system shown includes: at least one printed circuit board 2 to be assembled; at least one RFID electronic tag 3, and each printed circuit board 2 to be assembled is equipped with an RFID electronic tag 3; An RFID reader 4, wirelessly connected to the RFID electronic tag 3; a computer 1, connected to the RFID reader 4, installed with a printed circuit board assembly information system 10, and at least one PCB assembly device 5, connected to the computer 1, each At least o...

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Abstract

The invention relates to a printed circuit board assembly information system, comprising a PCB assembly knowledge collection module, a PCB assembly body instantiation module, a PCB assembly body knowledge base module, a PCB basic information collection module, and a PCB basic information database module , a PCB assembly parameter acquisition module, an RFID data preprocessing middleware, a PCB assembly operation judgment module, a PCB information retrieval module, a PCB knowledge base query module and a PCB file output module. The present invention also relates to a printed circuit board assembly system and a method for realizing the printed circuit board assembly information system, which can set different PCB assembly body instances for different types of printed circuit boards, so that the printed circuit board The assembly is called according to the needs, which effectively solves the technical problems of high assembly cost and long production cycle of small-batch printed circuit boards existing in the prior art.

Description

technical field [0001] The invention relates to a printed circuit board assembly information system and its realization method. Background technique [0002] Printed Circuit Board (Printed Circuit Board), referred to as PCB, also known as printed circuit board, is the provider of electrical connections for electronic components. After the design and manufacture of the printed circuit board are completed, the corresponding electronic components need to be assembled and tested according to the design requirements before it can work normally. Traditional printed circuit board assembly mainly includes processes such as surface mount component assembly, through-hole component assembly, and functional testing. Among them, the assembly of surface mount components is mainly completed by the surface mount system. Make electrical connections to the circuit board. Through-hole component assembly involves manually inserting through-hole components into the printed circuit board, and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/30G06K17/00
Inventor 易建军姜辉顾春华朱晓民罗金龙徐骏
Owner EAST CHINA UNIV OF SCI & TECH