A high vacuum magnetron bush sputtering machine
A high-vacuum, sputtering machine technology, applied in the direction of vacuum evaporation plating, sputtering plating, ion implantation plating, etc., can solve the problems of low output, low efficiency, serious pollution and human injury, etc., to increase work output, improve efficiency effect
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2017-08-15
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Abstract
Description
technical field
[0001] The invention relates to a sputtering device, in particular to a high-vacuum magnetron bush sputtering machine. Background technique
[0002] At present, standard bearings are divided into four layers: steel back, copper-based alloy sintered on the steel back, nickel grid layer, and anti-friction alloy layer. Usually, the method of processing standard bearings is: 1. First manufacture the steel back, 2. On the steel back Sinter or pour the copper-based alloy layer on the back, 3, electroplate the nickel grid layer on the copper-based alloy layer, and 4, send it into the sputtering equipment to sputter the anti-friction alloy layer. The disadvantage of this method is: in the method steps Including the electroplating method, which is a processing method with serious pollution and great harm to the human body. Another method of processing standard bearing bushes is: 1. Manufacturing the steel back first, 2. Sintering or pouring a copper-based alloy layer ...
Examples
Embodiment
[0017] by reference figure 1 with figure 2 , a high-vacuum magnetron bearing bush sputtering machine, comprising a sputtering housing 1, a sputtering chamber 8 is arranged in the sputtering housing 1, and the sputtering chamber 8 is provided with a sputtering target 2 and a bearing bush support frame 4, The bottom of the sputtering housing 1 is provided with a base 7, and the base 7 is provided with a sputtering target frame rotating shaft 6, and the sputtering target frame rotating shaft 6 is fixedly provided with a sputtering frame for moving the sputtering target 2. A target support frame 3, the sputtering target 2 is a double-sided target, the front is a nickel target, and the back is an alloy target. The middle of the sputtering target support frame 3 is fixedly connected with a sputtering target frame rotating shaft 6, and The edge is concave-convex and serrated, and a baffle 10 is also provided on the base 7. The edge of the baffle is provided with concave-convex and ...